ALD/ALE Process in Commercially Available Memory Devices
2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices.
This presentation will examine some of the different structures we have seen through the evolution of these technologies, in particular the latest 3D-NAND and DRAM parts. We will also look at several historical applications of ALD/ALE technology that have been observed through reverse engineering. We will highlight the importance of ALD/ALE process in advanced logic devices. In many cases, the technology could not have advanced without the implementation of ALD technology.
Rajesh Krishnamurthy
Senior Analyst
Rajesh Krishnamurthy is a senior analyst for TechInsights, an Ottawa, Canada-based reverse engineering company. TechInsights analyses a broad range of devices, giving Rajesh a unique overview of what technologies make into the real world of semiconductor production.
Rajesh graduated in 1998 with PhD in Materials Engineering from University of Western Ontario, London, ON, Canada. Rajesh has more than 20 years of experience working as an analyst, focusing on semiconductor process development, and R&D of semiconductor materials and devices. He joined the TechInsights team in 2006.
Webinar is on demand
Wednesday October 28, 2020 at...
- 11am Pacific
- 12pm Central
- 1pm Mountain
- 2pm Eastern
ALD/ALE Process in Commercially Available Memory Devices Webinar
This webinar happened October 28, 2020
