Apple APL1V02 A17 Pro Processor TSMC 3 nm FinFET Process Digital Floorplan Analysis

Apple APL1V02 A17 Pro Processor TSMC 3 nm FinFET Process Digital Floorplan Analysis

 
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This is a Digital Floorplan Analysis (DFR) of the TMQG36 die found inside the Apple A17 Pro APL1V02 processor. The Apple A17 Pro component was extracted from the Apple iPhone 15 Pro released on September 22, 2023. The A17 Pro GPU features six cores, offering a remarkable 70% increase in performance compared to the GPU found in the iPhone 12 Pro. Furthermore, it offers four times the speed in ray tracing when compared to the A16 Bionic, and its neural engine, equipped with 16 cores, achieves a remarkable two times increase, conducting nearly 35 trillion operations per second.

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