USI 339M00227 Antenna-In-Package Packaging Analysis
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This report presents a package analysis (PKG) on the USI 339M00227 mmWave AiP device. The 339M00227 AiP contains a radio frequency TX/RX transceiver die and an antenna array formed from the metallization layers of a printed wiring board (PWB). A power management integrated circuit (PMIC) die and numerous passive devices are mounted alongside the TX/RX die at the top of the PWB. The analysis was performed on samples removed from the Apple iPhone 15 Pro Max mobile handset (A2849).
