Qualcomm Snapdragon 8 Elite Gen 5 Advanced Packaging Quick Look

Advanced Packaging Quick Look of Qualcomm’s Snapdragon 8 Elite Gen 5 highlights its 3nm N3P process node and organic-substrate-based iPoP.

This is an Advanced Packaging Quick Look (APQ) summary for the Qualcomm Snapdragon 8 Elite Gen 5 device found within the Xiaomi Tech 17 Pro Max handset. The Qualcomm Snapdragon 8 Elite Gen 5 (SM8850-AC) is a flagship mobile system-on-chip (SoC) fabricated on TSMC's 3nm N3P process node, and is co-packaged with 16 GB LPDDR5X DRAM memory in an interposer package-on-package (iPoP) configuration. The Snapdragon 8 Elite Gen 5 continues to use an organic-substrate-based iPoP, similar to the technology used in previous Snapdragon 8 Elite devices. Qualcomm has yet to adopt fan-out redistribution layer (FORDL) packaging technology, as used by other flagship SoCs like the Apple A-series processors, Samsung Exynos series, and Google G-series processors, for its Snapdragon Elite series. Details of the iPoP packaging technology used in the Snapdragon 8 Elite Gen 5 are presented in this report.