Qualcomm Snapdragon 8 Elite Gen 5 Floorplan Analysis
2 Min Read February 25, 2026
This report reviews the digital floorplan of Qualcomm’s HG11‑77362‑2 die inside the SM8850, taken from the Xiaomi 17 Pro Max.
This report presents a Digital Floorplan Analysis of the Qualcomm HG11-77362-2 die found inside the Qualcomm SM8850 component. The SM8850 component was extracted from the Xiaomi 17 Pro Max Handset.
This summary outlines the analysis* found on the TechInsights' Platform.
*Some analyses may only be available with a paid subscription.
