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Details on how the product is built
Innovative design features and supply chain relationships
In-depth cost estimate of the bill of materials (BOM) included
Our Value
By revealing the innovation others can’t inside advanced technology, we prove patent value and drive the best IP and technology investment decisions.
Technical and product teams for the world’s most innovative and disruptive technology companies use our insights to make the best technology investment decisions.
By combining deep patent knowledge with the most advanced reverse engineering and technical analysis capabilities in the world we have demonstrated an unrivaled ability to match patents to products and deliver solid evidence of use in advance technology markets.
Depth and Breadth of Analysis
TechInsights analyses thousands of devices each year, from system level, right through to the silicon.
- Teardown and analyze 750+ products
- Catalogue 6,500+ components
- Analyze 2,000+ chips per year
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iPhone 17 Teardown Reveals Major STMicroelectronics IR Sensor Redesign
The iPhone 17 Pro Max introduces a major IR sensor redesign. See how STMicroelectronics’ new architecture reshapes biometric imaging.
Huawei Mate 80 Pro Max Teardown Confirms Kirin 9030 Pro on SMIC N+3
TechInsights’ teardown of the Huawei Mate 80 Pro Max confirms the Kirin 9030 Pro on SMIC’s N+3 process and reveals major upgrades in display, cameras, and connectivity.
2026 Advanced Packaging Outlook Report
Discover the five expectations defining advanced packaging in 2026, including CPO adoption, HBM4 demand, panel and glass scaling, 3D thermal challenges, and chiplets for mobile.
The Authoritative Information Platform to the Semiconductor Industry.
