Samsung 128L 512 Gb TLC die Memory Floorplan Analysis

Product Code

MFR-2102-804

Release Date

13/05/2021

Availability

Published

Product Item Code

SAM-KLUFG8RHDB-B0E1

Device Manufacturer

Samsung

Device Type

NAND Flash

Subscription

Memory - NAND & DRAM

Channel

Memory - NAND Floorplan Analysis

Samsung 128L 512 Gb TLC die Memory Floorplan Analysis

This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
Measurements of vertical and horizontal dimensions of major microstructural features
Plan-view optical micrograph of the die delayered to the polysilicon layer
Identification of major functional blocks on a polysilicon die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

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