The concise analysis summary report of critical device metrics, transmission electron microscopy-based energy dispersive X-ray spectroscopy (TEM-EDS) and TEM-based electron energy loss spectroscopy (TEM-EELS) results, and salient features, supported by the following image folders:

• Downstream product teardown
• Package photographs and X-rays, top metal and polysilicon die photographs
• SEM cross section along the word line (WL) and the bit line (BL) of the 3D NAND array
• TEM cross section along the BL direction (BLD)
• TEM cross section along the WL direction (BLD)
• SEM bevel
  • Memory array
  • Memory array edge
  • Periphery at the polysilicon level

The results of TEM-EDS analyses are included in the AME summary document. The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.