Semiconductor Packaging

These comprise innovations at the package architecture level which simplify the integration of heterogeneous devices into a single package. Example technologies include:

• System in package (SiP)
• Multi-chip module (MCM)
• Antenna in package(AIP)
• Chiplets
• Discrete components in redistribution layer (RDL)
• CMOS image sensor, image sensor processor, filter, and lens stack with actuation

• Underfill materials to reduce mechanical stress
• Encapsulation to protect the die from environmental contamination
• Epoxy and thermal paste improve heat distribution
• EMI shielding

• Hybrid bonding including wafer-to-wafer (W2W), face-to-face (F2F), chip-to-wafer (C2W), face-to-back (F2B)
• Flip chip, Through-silicon via (TSV)
• Interposer/bridges/high-density (HD) routing
• Fan-in and fan-out wafer-level packaging (FI-WLP, FO-WLP)

This is increasingly important as devices become more complex, power-hungry, and utilize stacking options that impact the device’s thermal profile. Innovation areas include:

• Thermal interface materials (TIMs)
• Microfluidics (future)
• System-level considerations

Growth in big data, AI, and multifunction portable devices are driving the need for high-performance, compact, and energy-efficient processing solutions, all of which are only achievable with advanced packaging technologies.

The Logic and Memory Packaging subscription is focused on packaging technologies found in advanced ICs and innovative memory devices including processors, application processors, GPUs, ASICs, DDR, NAND, and more.

The analysis covers source product information and images, optical die and package imaging, X-rays, and SEM cross-section analysis of the package structures and materials including metals, dielectrics, and interconnect along with SEM planar and isometric view of the package assembly.

RF system performance and energy efficiency is a critical factor of 5G handsets that significantly influences customer experience. Packaging is very tightly coupled to the overall RFIC design.

The Radio Frequency IC Packaging analysis profiles system co-design of front-end components such as LPAMiD and L-PAMiF, XCVRs, Rx Diversity, antenna in package, and mm-Wave TxRx front-end modules from the latest cutting-edge 5G handsets from leaders and disruptors such as Apple, Google, Samsung, Xiaomi, Oppo, Motorola, and more.

The analysis covers source product information and images, optical die and package imaging, X-rays, and SEM cross-section analysis of the package structures and materials including metals, dielectrics, and interconnect along with optical planar-view images of selected PWB metal layers.

The power semiconductor market is experiencing strong growth driven by several key factors including the trend towards vehicle electrification, the need for better power conversion efficiency in data center and renewable energy systems, and the quest for longer battery life in portable electronics. The introduction of wide bandgap semiconductors and advanced packaging technologies has brought about significant improvements in power device performance.

Power Semiconductor Packaging analysis profiles package level structural and materials innovation on Si, SiC, GaN, and power management ICs, Intelligent Power Modules, IGBT, Si MOSFETs, and more.

The analysis covers source product information and images, optical die and package imaging, X-rays, and SEM cross-section analysis of the package structures and materials including shielding, substrate, and interconnect.

The image sensor market is going through phenomenal innovation driven by a range of high-growth application areas including automotive, mobile, security, biometrics, and industrial/machine vision.

The Imager and Optical Sensor Packaging analysis profiles structural, materials, and key feature analysis targeting the most innovative and disruptive imager and optical/3D sensing technologies including camera modules, time-of-flight (ToF), optical in-display fingerprint sensing, ambient light sensors, and more.

The analysis covers source product information and images, module/package photographs and X-rays, module/package cross-sections, SEM-EDS of select features, die photograph, and phase detection autofocus (PDAF) classification. Key details of the camera module and package assembly are shown including:

• Shielding structures (metal, plastic, etc.)
• Lens mount strategy
• Lenses (number, type), spacers
• IR filter, glass window, etc.
• Substrate (type, metals, vias, etc.)
• Autofocus actuator