End Market Demand for Advanced Packaging
Explore cutting-edge advancements in datacenter technology with our spotlight on advanced packaging and chiplets. Discover how GPUs and ASICs are reshaping server processors, driving market growth in AI and accelerated computing. Dive into our blog series for insights into the future of datacenter processing.
In our latest spotlight series, we delve into the technology advancements that are revolutionizing the datacenter industry. At the forefront are advanced packaging and chiplets, crucial innovations responding to the ever-growing demands of the market, particularly driven by accelerated computing and artificial intelligence (AI).
Datacenter processing is divided into hyperscalers—industry giants like Amazon, Microsoft, Meta, and Google—and enterprise, government, and high-performance computing (HPC) for research. This sector is seeing a shift towards accelerated servers, which are becoming essential for meeting advanced processing needs. As highlighted in our Datacenter Computing Processors Q1 2024 report, accelerated servers are on the rise.
From a server processor viewpoint, the spotlight is on graphics processing units (GPUs) and application-specific integrated circuits (ASICs), which are driving significant market value. While central processing unit (CPU) revenue remains stable, the surge in GPU and ASIC revenue marks a transformative trend in the industry.
Discover more about these technological advancements and their impact on the datacenter market in the second blog in our Advanced Packaging and Chiplets Summer Series. The future of datacenter processing is accelerating—don’t miss out on the insights shaping this dynamic field.
Access exclusive insights and discover which manufacturers are leading the industry
Explore cutting-edge advancements in datacenter technology with our spotlight on advanced packaging and chiplets.
