AMD’s Ryzen 7 9800X3D enhances thermal efficiency with a new SoIC configuration, building on the MI300 AI accelerators.
Building on the success of the X3D components, AMD leveraged SoIC in their MI300 family AI accelerators but reversed the vertical order, placing the processor chiplets over the cache for improved thermals. With the Ryzen 7 9800X3D, AMD has now brought this improved configuration to the consumer market.
TechInsights Experts Analyze the Impact on Supply Chains, Costs, and Market Winners in a Rapidly Shifting Semiconductor Landscape.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
Stay ahead of the curve with TechInsights Tariff Watch, your go-to resource for timely and in-depth analysis on the shifting landscape of tariffs and their impact on the tech industry.
