Qorvo QM77050 LMHB L-PAMiD Packaging Analysis

Package Analysis report of the Qorvo QM77050, featuring LNA and integrated duplexers.

This is a package analysis report of the Qorvo QM77050. The QM77050 is a Low-Band (LB), Mid-Band/High-Band (MHB) Radio Frequency Power Amplifier Module with LNA and integrated duplexers (L-PAMiD) developed for 4G LTE and 5GNR applications. It represents the second such module that combines the functionality of the LB and MHB front-end into a single module. The first being the Qualcomm QPM8590-002. The QM77050 used in this analysis was taken from the Honor X70 (MNT-AN00) smartphone from the Chinese market.