Chip Observer
Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
Trump Approves H200 Exports: Impact on NVIDIA, TSMC & HBM
Trump’s approval of H200 exports to China could reshape GPU, packaging, and HBM markets. TechInsights analyzes supply constraints, pricing, and $40–50B demand.
Amazon Echo Show 21 Teardown: High-Level Cost and Design Insights
A high-level teardown overview of the Amazon Echo Show 21, highlighting design trends, cost contributors, and connectivity upgrades. Full deep dive available free on the TechInsights Platform.
SMIC N+3 Confirmed: Kirin 9030 Analysis Reveals How Close SMIC Is to 5nm
Our Kirin 9030 analysis confirms SMIC’s N+3 node and reveals how it compares to industry 5nm. Get process measurements, density benchmarks, and expert analysis.
The Chip Insider®–SEMI ITPC Highlights and Notables
SEMI ITPC: ASML pushes EUV cost cuts & new packaging tools; Intel bets on power tech & culture shift; Samsung, SK hynix eye custom HBM; AWS flags heat & optical fixes.
The AI Carbon Challenge: Why Your Next GPU's Memory Stack Is the New Emissions Hotspot
AI GPU production will account for 8.7% of all semiconductor sector emissions by 2030. The Global AI GPU Manufacture Carbon Emissions Forecast, 2026-2030, contains the critical data and strategic insights needed to navigate this accelerating environmental transition.
TechInsights Confirms China’s First Commercial STT-MRAM Chips
TechInsights confirms China’s first commercial STT-MRAM shipments, signaling a major semiconductor milestone and new competition in emerging memory markets.
Cost Explorer: Optimizing PPACtE for Semiconductor R&D
TechInsights’ Cost Explorer adds cost, cycle time, and carbon modeling to Synopsys DTCO workflows, enabling full PPACtE optimization before costly test wafers.
Sony Launches First 200MP Smartphone Sensor: LYTIA 901
Sony debuts its first 200MP smartphone sensor, the LYTIA 901, featuring a 1/1.12-inch format, 0.7µm pixels, AI remosaicing, advanced HDR, and flagship zoom performance.
Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
The 2026 Roadmap Begins Here
Get a data-driven view of the technologies, markets, and supply-chain dynamics that will define 2026 and beyond.
The Chip Insider®– Temperature Check
Get the latest industry pulse, capturing market sentiment, leadership insights, and progress toward the trillion-dollar semiconductor milestone.
The Chip Insider® – DRAM Super-Cycle?
The DRAM market is experiencing significant changes due to shortages, AI advancements, and production shifts, reshaping its future dynamics.
Apple iPhone 17 Pro Max Teardown: A19 Pro, New mmWave System & BOM Analysis
Explore the TechInsights Apple iPhone 17 Pro Max teardown featuring the A19 Pro, Qualcomm Snapdragon X80 modem, new mmWave subsystem, upgraded cameras, and detailed BOM analysis.
How Product Manufacturers Use Semiconductor Intelligence to Stay Ahead
Discover how product manufacturers use teardown and cost analysis data from TechInsights to gain competitive advantage and reduce design risk.
Cloud Market Share Trends - Big Three Together Hold 63% while Oracle and the Neoclouds Inch Higher
New data from Synergy Research Group shows that Amazon, Microsoft and Google together accounted for 63% of enterprise spending on cloud infrastructure services in Q3.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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