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Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
The Chip Insider®– Soft Landing or Hard Landing?
Explore the potential impact of economic tightening on the semiconductor industry as chip stocks signal a hard landing. Understand the importance of equipment content rates, utilization, and silicon production to navigate the industry's rough seas and prepare for future challenges.
Battery Breakthroughs in EVs: Chevy Bolt, Tesla Models, and Hyundai IONIQ 5
The electric vehicle (EV) market is rapidly expanding, with millions of new electric cars registered globally, bringing the total on the roads to tens of millions.
Exploring Apple Vision Pro’s Revolutionary Eye Tracking System
In our series on Apple Vision Pro, we now focus on the headset's eye tracking system. This advanced technology allows users to control the interface with their gaze, replacing traditional input methods like a mouse or trackpad.
TDK CeraCharge™ - the First Rechargeable all-Ceramic SMD Battery
TDK CeraCharge™ - the First Rechargeable all-Ceramic SMD Battery Discover the advancements in IoT power sources with TDK CeraCharge™, the first rechargeable all-ceramic solid-state SMT battery. Learn about its innovative materials, performance
Syntiant’s NDP250 Boosts Memory
Explore Syntiant’s new chip that handles larger models than competition, and offers advanced vision and voice interfaces.
Chiplets Moving Into the Fast Lane: Transforming Automotive Processors
Chiplets moving into the Fast Lane: Transforming Automotive Processors Discover how chiplet technology is transforming the automotive industry, offering higher yields, faster development, and reduced costs. TechInsights predicts significant chiplet
Smart Home Device Shipments to Exceed 2.5 Billion in 2030
Discover how the smart home device market is set to exceed 2.5 billion shipments by 2030. Learn about the key drivers, regional insights, and strategic opportunities that will shape the future of smart home technology.
Sustainable Semiconductor Manufacturing: A Mid-Year Roundup of 2024 Top Developments
The first half of 2024 has witnessed significant strides in the quest for a more sustainable semiconductor manufacturing industry. With increasing pressure from environmental regulations, consumer demand, and investor scrutiny, chipmakers are actively exploring innovative solutions to reduce their environmental footprint.
KIOXIA/WD BiCS8 218L CBA 3D TLC NAND
Discover the latest Hybrid Bonding technology with the KIOXIA/WD BiCS8 CBA 3D TLC NAND. Analyzed by TechInsights, this innovative device showcases an advanced edge-XDEC floor plan and a sophisticated 2-deck integration.
Samsung SF3 (2nd Gen 3nm GAA) in Exynos W1000 Processor Confirmed
Initial SEM results confirm Samsung’s 2nd generation 3nm GAA technology in the Exynos W1000 processor. Discover key insights and implications for high-volume manufacturing requirements in our latest analysis on the TechInsights Platform.
The Chip Insider®– If Trump wins election: The bill for Chip Makers
In this blog, we discuss the potential impact on the semiconductor industry if Trump wins the election, including concerns about U.S. direct investment requirements for foreign chip makers, and Samsung's delay of their Taylor, TX fab following the $6.4 billion CHIPS Act subsidy announcement.
Intel Drops Hyperthreading From New CPU
Intel’s Lion Cove contains significant departures from previous CPU microarchitectures, prioritizing performance efficiency by omitting hyperthreading and other performance-boosting innovations but still manages to deliver a double-digit IPC uplift.
Microprocessor Report June 2024 Review
Microsoft’s Copilot+ PC demands saw Qualcomm, Intel and AMD all launch new PC SoCs with advanced NPUs. Intel’s Gaudi 3 will compete with NVIDIA—although only NVIDIA’s previous generation H100. Advanced packaging is a significant industry trend, and AR is a driving force behind new packaging technologies from TSMC seen in the Apple R1, and an experimental SoC from Meta.
AI's Influence on Advanced Packaging: Mid-Year Briefing Highlights and Innovations
Topics covered include TSMC’s recent announcements of an expanded technology offering for system-on-wafer (SoW) and new targets supporting continued interposer scaling in 2.5D chip-on-wafer-on-substrate (CoWoS) technology that is underpinning the AI boom.
Apple Vision Pro: Revolutionizing Face ID with TrueDepth Technology
Spatial computing integrates a user’s virtual environment with their physical surroundings, and Apple's Vision Pro achieves this with a suite of advanced sensors. While LiDAR, or Light Detection and Ranging, plays a significant role in mapping the user's space, the TrueDepth camera system adds another layer of depth sensing.
Samsung Galaxy Watch 7
Discover the Samsung Galaxy Watch 7 with TechInsights. Explore the latest Exynos W1000 processor, advanced health tracking, AI wellness tools, and our detailed technical analysis.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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