This is an Advanced Packaging Essentials on the Qualcomm QET5100M Envelope Tracker Module Embedded Die Technology. The envelop tracker IC is embedded in a six layer PWB organic substrate. Passive components are surface mounted on the PWB substrate, and overmolded. Metalized overmold provides EMI shielding.

• Downstream product teardown
• Package photographs and X-rays
• Die photographs
• Optical planar view images of the redistribution layers (RDLs)
• SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, and vias