This is an Advanced CMOS Essentials (APE) Summary document of the fan-out panel level package (FO-PLP) built using Samsung’s next generation of semiconductor packaging technology. Concise analyst’s summary of critical device metrics, scanning electron microscopy based energy dispersive X-ray spectroscopy (SEM-EDS) of package materials, and salient features supported by the following images:

• Downstream product teardown
• Package photographs and X-rays
• Die photographs
• Optical planar view images of the redistribution layers (RDLs) and the embedded printed wiring board (PWB)
• SEM and optical cross section of the general package structure, and targeted SEM cross section of the metals, dielectric materials, RDL interconnect, embedded PWB and PoP interconnect