- Downstream product teardown
- Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
- SEM bevel through the logic memory array and peripheral regions
- SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
- A single TEM cross section through the MRAM cell and orthogonal to word lines, showing the MRAM cell, metals and dielectrics, cell transistor gate stack, isolation, and other FEOL features
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