- Package photographs and X-rays, top metal and polysilicon die photographs
- SEM cross section along the word line (WL) and the bit line (BL) of the ReRAM module
- TEM cross section along the BL direction (BLD)
- TEM cross section along the WL direction (BLD)
- SEM bevel
- Memory array bevel
- Memory periphery at the polysilicon gate level
- Memory periphery at the polysilicon gate level
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