4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop (IISW) 2019 Blog outline of the talk was structured

Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.

4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image Sensors Workshop (IISW) 2019 TechInsights had the

Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 2019. This continued growth stems from the need for

Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was reached with the introduction of 1y by Samsung with

Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.

Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges associated with the use of mmWave componentry, because of

In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.