Beken BK3296 22nm Bluetooth Audio SoC Process Analysis

This report provides an analysis of the structure and materials used in the manufacture of Beken BK3296 22nm Bluetooth Audio SoC manufactured in UMC's 22nm ULP process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
21Mar

Deep Dive Teardown of the OnePlus Open CPH2551 Smartphone

Power Management (PM8550VE-001, PM8550VS-001, and PM8550-001) used in Samsung version S24 Ultra, which indicates the use of the same chipset as flagships smartphones. ICs from Skyworks, Qualcomm and Murata provide RF chips for smartphones. Of the new RF chips, the most notable is the LB Front-End Module (SKY58101-11). OnePlus has WiFi 7 and Bluetooth 5.3, for this used Qualcomm IC (WCN7851-101).
20Mar

Intel Core Ultra 7 155H Meteor Lake CPU Die (Intel 4) Advanced CMOS Process Analysis

This report provides an analysis of the structure and materials used in the manufacture of the of the Intel Core Ultra 7 155H (Meteor Lake) CPU die (compute tile), fabricated using the Intel 4 finFET process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
20Mar

Smartphone Battery Market Share CY2023: Revenue Decline Exceeds 10% YoY

The global market for smartphone battery cells recorded more than 10% annual decline in revenues in CY 2023. Revenues fell because of the sluggish market demand and declining cell pricing environment. Amperex Technology Ltd. (ATL) led with 46% revenue share followed by LG Energy Solutions and Samsung SDI. This report includes the global shipments, revenue and ASP of battery cells by vendor by quarter from Q1 2018 to Q4 2023.
20Mar