High Performance Computing
From SoC floorplans to MLPerf-validated AI server performance, gain the independent intelligence needed to lead in high-performance and AI-driven compute markets.
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Key Benefits
High Performance Computing from TechInsights empowers engineers, architects, and technology leaders with in-depth technical analysis of System on a Chip (SoC), chiplets, interconnects, and high-bandwidth memory (HBM)—key technologies at the forefront of data center, Artificial Intelligence (AI), and scientific computing.
By revealing how cutting-edge packaging, three-dimensional integrated circuit (3DIC), and disaggregated architectures are implemented in the most advanced systems, this offering enables faster product development, optimized investment strategies, and reduced risk.
From floorplan analysis to process transitions to independent performance benchmarking, TechInsights provides the clarity needed to lead in the most demanding compute environments, helping you benchmark competitors, validate vendor claims, identify emerging technology trends, and accelerate innovation in high-performance computing and AI applications.
What You'll Receive
High performance computing inclusions — click a tile to see details below
Technical Teardown and Reverse Engineering
Access approximately seven comprehensive high-performance computing product teardowns annually, featuring in-depth analysis of processors including central processing units (CPU), graphics processing units (GPU), tensor processing units (TPU), data processing units (DPU), and input/output (I/O) processors, as well as networking hardware. Coverage includes disaggregated and chiplet-based SoCs, providing detailed insights into how leading manufacturers implement advanced architectures for data center, AI, and scientific computing applications. Each teardown delivers floorplan analysis of major compute and memory integrated circuits (IC), enabling you to understand die-level design decisions and benchmark competitive implementations across the industry.
High Performance Interconnect and Packaging
Gain comprehensive analysis of high-performance interconnect and packaging technologies including substrates, interposers, fan-out packaging, silicon bridges, through-silicon vias (TSV), and hybrid bonding implementations. Coverage extends to emerging packaging innovations such as co-packaged optics, photonic integrated circuits with electronic integrated circuits (PIC+EIC), glass core substrates with through-glass vias (TGV), three-dimensional chiplet stacks, static random-access memory (SRAM) chiplets, liquid cooling solutions, and embedded passive components. This analysis provides critical visibility into how industry leaders are pushing the boundaries of packaging technology to achieve higher bandwidth, lower latency, and improved power efficiency in next-generation computing systems.
Memory Analysis and Expert Support
Receive detailed memory floorplan analysis of HBM dynamic random-access memory (DRAM) and controller dies, accompanied by comprehensive HBM module interconnect and packaging insights that reveal how memory subsystems are optimized for bandwidth-intensive applications. Benefit from inquiry privileges and access to expert-driven insights for competitive benchmarking and technology strategy, enabling direct consultation with TechInsights analysts who can provide context, answer technical questions, and help you interpret findings in the context of your specific business objectives and product development roadmaps.
AI Server Performance Benchmarking
Receive independent, third-party performance, power, and thermal validation of fully configured single-node AI servers, delivering approximately two to four evaluations annually. Testing uses public MLPerf Inference workloads—covering CNN inference, large language model (LLM) inference, sequence-based, and graph neural network (GNN) workloads—executed under controlled laboratory conditions with external AC power instrumentation accurate to ±0.5%. Each evaluation covers full hardware characterization, independent power profiling across idle, burst, sustained load, and post-load decay states, thermal ramp and throttling analysis, and statistical reporting including throughput vs. power curves, energy-to-solution, and 95% confidence intervals. Published deliverables include an HTML benchmark report, executive summary, raw measurement data, MLPerf logs, and full instrumentation documentation, providing defensible data for procurement decisions, vendor claim validation, RFP support, and sustainability modeling.
AI Accelerator Card Performance Benchmarking
Gain independent, third-party performance, power, and thermal validation at the accelerator card boundary, delivering approximately two to four card-level evaluations annually. Testing uses MLPerf Inference workloads including Llama 3.1, IGB heterogeneous graph neural network benchmarks, FLUX.1 image benchmarks, and InferenceX, executed within a defined host reference system using external AC power instrumentation—not telemetry alone. Each evaluation covers accelerator card hardware characterization, PCIe topology and firmware documentation, independent power profiling, thermal stability and throttling analysis, and statistical reporting including vendor claim comparison where available. Published deliverables include an HTML benchmark report, executive summary, raw measurement data, MLPerf logs, and full instrumentation documentation, enabling normalized SKU comparisons, TCO modeling, and defensible procurement and RFP support.
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Applications
Hardware engineers and system architects leverage floorplan analysis and packaging insights to optimize their own designs, reduce development cycles, and implement proven architectural approaches in next-generation products. Technology strategists and investment teams use competitive benchmarking data to evaluate emerging technologies, assess vendor capabilities, and make informed decisions about research and development priorities and capital allocation.
Semiconductor manufacturers and fabless designers analyze process transitions, chiplet implementations, and interconnect strategies to refine their technology roadmaps and identify partnership opportunities. Supply chain managers and ecosystem partners examine packaging technologies and component integration approaches to understand equipment requirements, material dependencies, and manufacturing capabilities needed for advanced HPC systems.
Product managers and competitive intelligence teams track innovation trends across CPU, GPU, TPU, and DPU architectures to position their offerings, identify market gaps, and anticipate competitor moves in the rapidly evolving high-performance computing landscape.
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