TechInsights Library - Work In Progress

Report Name	Device Type	Manufacturer	Part Number	Report Code
Qualcomm QET5100M Advanced Packaging Essentials	Envelope Tracking Power Supply	Qualcomm	QET5100M	APE-2001-801
Qualcomm SDR865 5G Mobile RF Transceiver Architecture Analysis	RF Transceiver	Qualcomm	SDR865	ARC-2002-801
Qualcomm SDR8150 RF Transceiver Basic Floorplan Analysis	RF Transceiver	Qualcomm	SDR8150	BFR-2002-801
Silicon Labs EFR32BG22C224 Bluetooth 5.2 SoC Basic Floorplan Analysis	SoC (System-on-Chip)	Silicon Laboratories	EFR32BG22C224F512IM32-C	BFR-2003-803
Qualcomm QCA6391 Wi-Fi 6/BT 5.1 SoC Basic Floorplan Analysis	WiFi SoC	Qualcomm	QCA6391	BFR-2003-804
Samsung SHANNON5500 RF Transceiver Basic Floorplan Analysis	RF Transceiver	Samsung	SHANNON_5500	BFR-2003-813
MediaTek MT6177W RF Transceiver Basic Floorplan Analysis	RF Transceiver	MediaTek	MT6177W	BFR-2003-816
On Semiconductor AR0233AT Device Essentials Folder	CMOS Image Sensor	ON Semi	AR0233AT	DEF-1902-801
GPixel GMAX0505 Monochrome Global Shutter CIS Device Essentials Folder	CMOS Image Sensor	GPixel Inc	GMAX0505-BM	DEF-1902-803
Intel i5-10210U (Comet Lake) 14+++ FinFET Process Digital Floorplan Analysis	Microprocessor	Intel	SRGKY	DFR-2001-802
Samsung Exynos 990 Digital Functional Analysis Report		Samsung	S5E9830	DFR-2003-801
Samsung K3LK4K40BM-BGCN 1y nm 12 Gb LPDDR5 Memory Floorplan Analysis		Samsung	K4L2E165Y8	MFR-2002-801
Samsung K3LK3K30EM-BGCN 1y nm 8 Gb LPDDR5 Memory Floorplan Analysis		Samsung	K4L8E165YE	MFR-2002-802
UNIC Memory UNMEN05G21E31BS YMTC 64L 3D NAND Memory Floorplan Analysis	USB Flash Drive	UNIC Memory	S1-C	MFR-2003-801
Cree C2M0045170P SiC Power Essentials Folder	SiC Power FET	Cree	C2M0045170P	PEF-2003-801
Samsung Exynos 9820 8LLP NPU SoC Design Standard Cell GDS Library Analysis	Applications Processor	Samsung	9820	SDG-2001-806

Report Name	Device Type	Manufacturer	Part Number	Report Code	Availability
Samsung Exynos Octa 9820 Application Processor Samsung 8LPP ACMOS Essentials	Applications Processor	Samsung	9820	ACE-1903-801	21/06/2020
Qualcomm Snapdragon 675 SM6150 Samsung 11LPP FinFET Process aCMOS Essentials	Applications Processor	Qualcomm	SM6150	ACE-1905-801	30/07/2020
Toshiba 96L 3D NAND (TH58LJT0T24BADE) Advanced Memory Essentials	NAND Flash	Toshiba	TH58LJT0T24BADE	AME-1902-801	16/05/2020
Samsung K3UH7H70AM-AGCL LPDDR4X SDRAM 1y nm Process Advanced Memory Essentials	LPDDR4X	Samsung	K3UH7H70AM-AGCL	AME-1902-802	05/10/2020
Samsung K9DUGY8J5B-DCK0 92-Layer 3D V-NAND Advanced Memory Essentials	NAND Flash	Samsung	K9DUGY8J5B-DCK0	AME-1902-804	05/03/2020
Micron MT29F2T08EMHBFJ4-R:B 96-Layer 3D NAND Advanced Memory Essentials	NAND Flash	Micron Technology	MT29F512G08EBHBFJ4-R_B	AME-1902-805	05/04/2020
Micron MT40A2G4SA-062E:J DDR4 SDRAM 1y nm Process Advanced Memory Essentials	DDR4 SDRAM	Micron Technology	MT40A2G4SA-062E_J	AME-1905-801	13/08/2020
GaN GS66508B/GS66508T Embedded Die Package Advanced Packaging Essentials		GAN Systems	GS66508T_die	APE-2002-801	22/07/2020
Mediatek MT6190W (AM10822A1) Mobile Transceiver Architecture Report	RF Transceiver	MediaTek	MT6190W	ARC-2003-801	14/08/2020
Samsung Shannon_5510 (S5M5510A01) Mobile Transceiver Architecture Report	RF Transceiver	Samsung	SHANNON_5510	ARC-2003-802	14/08/2020
Intel PMB5765 (SMARTI8 RXB0A) Mobile Transceiver Architecture Report	RF Transceiver	Intel	PMB5765	ARC-2003-803	14/08/2020
Mediatek MT6186MV (AXD10787B1) Mobile Transceiver Architecture Report	RF Transceiver	MediaTek	MT6186MV	ARC-2003-804	14/08/2020
HiSilicon HI6363 (Hi6363V100) Mobile Transceiver Architecture Report	Transceiver	HiSilicon Technologies Co. Ltd	Hi6363	ARC-2003-805	14/08/2020
Intel PMB5762 (SMARTI7 E301A) Mobile Transceiver Architecture Report	RF Transceiver	Intel	PMB5762	ARC-2003-806	14/08/2020
Mediatek MT6190W (AM10822A1) Mobile Transceiver Basic Floorplan Report	RF Transceiver	MediaTek	MT6190W	BFR-2003-805	14/08/2020
Samsung Shannon 5510 (S5M5510A01) Mobile Transceiver Basic Floorplan Report	RF Transceiver	Samsung	SHANNON_5510	BFR-2003-806	14/08/2020
Intel PMB5765 (SMARTI8 RXB0A) Mobile Transceiver Basic Floorplan Report	RF Transceiver	Intel	PMB5765	BFR-2003-807	14/08/2020
Mediatek 6186MV (AXD10787B1) Mobile Transceiver Basic Floorplan Report	RF Transceiver	MediaTek	MT6186MV	BFR-2003-808	14/08/2020
Hisilicon HI6365 GFCv100B10G (HI6365_V100B17) Mobile Transceiver Basic Floorplan Report	RF Transceiver	HiSilicon Technologies Co. Ltd	SHAN5100	BFR-2003-809	14/08/2020
Mediatek MT6186W (BHH10758C1) Mobile Transceiver Basic Floorplan Report	RF Transceiver	MediaTek	MT6186W	BFR-2003-810	14/08/2020
Qualcomm SDX50M (HG11-P7861-210) Mobile Transceiver Basic Floorplan Report	Modem Interface	Qualcomm	SDX50M	BFR-2003-811	14/08/2020
Qualcomm QTM052 mmWave Antenna Module 5G Mobile Transceiver (HG11-P7860-210) Basic Floorplan Report	RF Antenna Module	Qualcomm	QTM052	BFR-2003-812	14/08/2020
Intel PMB5762 (SMARTI7 E301A) Mobile Transceiver Basic Floorplan Report	RF Transceiver	Intel	PMB5762	BFR-2003-814	14/08/2020
Mediatek MT6177MV (BC10550A1) Mobile Transceiver Basic Floorplan Report	RF Transceiver	Mediatek	MT6177MV	BFR-2003-815	14/08/2020
HiSilicon HI6363 (HI6363V100) Mobile Transceiver Basic Floorplan Report	Transceiver	HiSilicon Technologies Co. Ltd	Hi6363	BFR-2003-817	14/08/2020
Samsung Shannon_955 (S5M9550A01) Mobile Transceiver Basic Floorplan Report	RF Transceiver	Samsung	SHANNON_955	BFR-2003-818	14/08/2020
Qualcomm QTM525 mmWave Antenna Module Floorplan Analysis	RF Antenna Module	Qualcomm	QTM525	BFR-2004-810	22/05/2020
HiSilicon Hi6365GFC RF Transceiver Circuit Analysis	RF Transceiver	HiSilicon Technologies Co. Ltd	Hi6365GFC	CAR-1908-201	21/01/2020
HiSilicon Hi9500 Balong 5000 5G Modem SRAM Macro Circuit Analysis	Modem Interface	HiSilicon Technologies Co. Ltd	Hi9500	CAR-1908-202	23/01/2020
CircuitVision Analysis on the MediaTek MT6303P Envelope Tracker	Envelope Tracking Power Supply	MediaTek	MT6303P	CAR-1908-203	06/05/2020
Samsung 1y LPDDR4X (K3UH7H70AM) 8Gb Circuit Analysis Reports	LPDDR4X	Samsung	K3UH7H70AM-AGCL	CAR-1909-801	19/06/2020
Apple U1 (TMKA75 die) Ultra-Wideband die (USI RF Module of the iPhone 11) Circuit Analysis Report	UWB – Ultra Wide Band	Universal Scientific Industrial	USI_Comp	CAR-1910-801	06/05/2020
Circuit Analysis Report on ams TMF8701	Proximity Sensor	Austria Microsystems	50352480	CAR-1912-801	29/05/2020
Sk Hynix D1y DDR4 Select Block-Circuit Analysis	DDR4 SDRAM	Hynix	DTDRH682WX2	CAR-2001-802	08/07/2020
Intel/Micron MT29F512G08EBHBF-R_B Selected Block Circuit Analysis Report	NAND Flash	Micron Technology	MT29F512G08EBHBFJ4-R_B	CAR-2002-801	28/02/2020
Samsung 1y LPDDR5 12Gb Circuit Analysis Report		Samsung	K4L2E165Y8	CAR-2002-803	28/08/2020
Samsung S5KHM1 from Samsung Galaxy S20 Ultra 5G Circuit Analysis Reports	Camera Module	Unknown	SM-G988N_Quad-Rear-Cam2	CAR-2002-807	17/06/2020
Sony IMX555 from Samsung Galaxy S20 Circuit Analysis Report		Sony	SM-G986N_Triple-Rear-Cam1_ISP	CAR-2002-808	28/05/2020
CircuitVision Analysis of select blocks of the Macom MALD-38435 quad 28GBaud PAM4/NRZ linear VCSEL driver	Unclassified	Macom	MALD-38435	CAR-2003-902	05/05/2020
Socionext SCOFQAA-B-000 Circuit Analysis	PCB	Socionext	SCOFQAA-B-000	CAR-2004-202	15/06/2020
OmniVision OH01A10 Device Essentials Folder	Camera Module	OmniVision	OH01A10-EAAA-1A-AA0A	DEF-1902-802	04/08/2020
Sony IMX650 Stacked Back-Illuminated CIS from Huawei P30 Pro 40 MP Camera Module Device Essentials Folder	Image Processor	Sony	VOG-L29_Triple-Rear-Cam2-ISP	DEF-1904-801	13/05/2020
Samsung S5K3P9SN Device Essentials Folder	CMOS Image Sensor	Samsung	S5K3P9SN_CIS	DEF-1905-801	13/06/2020
ams Proximity Sensor from the Huawei Mate 20 Pro Device Essentials Folder	Proximity Sensor	Austria Microsystems	50352480	DEF-1905-802	21/06/2020
Infineon IRS2381C ToF from LG G8 ThinQ Front Camera Device Essentials Folder	CMOS Image Sensor	PMD Technologies	LM-G820UM_Front-Cam2_ToF_CIS	DEF-1905-803	06/08/2020
OmniVision OX01B40 Device Essentials Folder	Camera Module	OmniVision	OX01B40_SiP_Camera_Module	DEF-1906-801	25/07/2020
S5K3J1SX03 CIS from the Samsung Galaxy S10e Device Essentials Folder	CMOS Image Sensor	Samsung	S5K3J1SX03_CIS	DEF-1906-802	09/07/2020
Samsung S5K2G1XX Device Essentials Folder	CMOS Image Sensor	Unknown	NZ1GXD	DEF-1907-801	15/08/2020
Microsoft Azure Kinect Device Essentials Folder	Camera Module	Microsoft	X948802-0C2	DEF-1907-802	15/08/20
Samsung S5KGM1SP 48 MP Stacked BI ISOCELL Plus CIS Device Essentials Plus	CMOS Image Sensor	Samsung	S5KGM1SP_CIS	DEP-1901-802	04/07/2020
GPixel GMAX0505 (TPSCo. 2.5 um Global Shutter) Device Essentials Plus	CMOS Image Sensor	GPixel Inc	GMAX0505-BM	DEP-1902-801	04/10/2020
Sony IMX650 from the Huawei P30 and P30 Pro Device Essentials Plus	Camera Module	Unknown	VOG-L29_Triple-Rear-Cam2	DEP-1905-801	31/07/2020
Microsoft X948802-002 from the Azure Kinect DK Device Essentials Plus	Camera Module	Microsoft	X948802-0C2	DEP-1907-801	28/08/2020
iPad Pro LiDAR Scanner Device Essentials Plus	Camera Module	Unknown	A2068_Triple-Rear-Cam2_LiDAR	DEP-2003-801	06/05/2020
ON Semi AR0820 Device Essentials Plus	CMOS Image Sensor	ON Semi	LI-AR0820-GMSL2_Front-Cam	DEP-2004-801	30/06/2020
Sony IMX608 Device Essentials Plus	CMOS Image Sensor	Sony	ELS-AN00_Triple-Rear-Cam1_CIS	DEP-2004-802	07/10/2020
MediaTek Dimensity 5G 1000L Digital Floorplan Analysis Report	Applications Processor	MediaTek	MT6885Z	DFR-2002-801	05/07/2020
Qualcomm Snapdragon 765G Digital Floorplan Analysis Report	Applications Processor	Qualcomm	SM7250	DFR-2002-802	05/12/2020
Samsung Exynos 980 5G Digital Floorplan Analysis Report	Applications Processor	Samsung	980	DFR-2002-803	21/05/2020
Tesla FSD Chip Digital Floorplan Analysis Report	Microprocessor	Tesla, Inc.	UBQ01B0	DFR-2002-804	06/09/2020
Qualcomm Snapdragon 865 Digital Floorplan Analysis Report	Applications Processor	Qualcomm	SM8250	DFR-2002-805	18/06/2020
Qualcomm SDX55M TSMC N7 Digital Floorplan Analysis Report	RF Module	Qualcomm	SDX55M	DFR-2003-802	07/09/2020
Mobileye STMicro 28nm FD-SOI Digital Floorplan Analysis Report	SoC (System-on-Chip)	Mobileye	STME-EyeQ4H	DFR-2003-803	31/07/2020
Apple A12Z Bionic Digital Floorplan Analysis Report	Computer Tablet	Apple	A2068	DFR-2003-804	17/08/2020
Exploratory SSRM on Samsung S5KGM1SP	CMOS Image Sensor	Samsung	S5KGM1SP_CIS	EXR-1911-802	05/05/2020
YMTC 64L NAND Memory Design - Periphery	USB Flash Drive	UNIC Memory	S1-C	MDP-2003-801	29/05/2020
Micron 1y LPDDR5 8 Gb Memory Design - Periphery		Micron Technology	Y2BM	MDP-2004-801	06/10/2020
Micron MT44K32M36RCT-125 3rd Gen RLDRAM Memory Peripheral Design	DRAM	Micron Technology	MT44K32M36RCT-125	MDP-2004-802	24/06/2020
Micron 1y LPDDR5 8 Gb Memory Floorplan Analysis Report	LPDDR5	Micron Technology	MT62F1G64D8CH-036_WT_A	MFR-2004-801	22/05/2020
Infineon IMW65R107M1HXKSA1 CoolSiC Power Essentials Folder	SiC Power FET	Infineon	IMW65R107M1HXKSA1	PEF-2003-802	15/05/2020
HiSilicon Kirin 980 GPU TSMC N7 Standard Cell Essentials	Applications Processor	HiSilicon Technologies Co. Ltd	Hi3680	SCE-1811-802	25/07/2020
AMD Ryzen 5 3600X SoC Design Analysis	Applications Processor Module	AMD	100-100000022BOX	SDA-1908-801	05/06/2020
Intel 10nm (2nd Gen) Ice lake CPU SoC Design Analysis	Laptop Computer	Hewlett-Packard	15-dy1973cl	SDA-2001-801	17/07/2020
Intel 10nm (2nd Gen) Ice Lake GPU SoC Design Analysis	Laptop Computer	Hewlett-Packard	15-dy1973cl	SDA-2001-802	26/06/2020
Intel 10 nm (2nd Gen) Ice Lake Overhead SoC Design Analysis	Laptop Computer	Hewlett-Packard	15-dy1973cl	SDA-2001-803	28/07/2020
HiSilicon Kirin 990 5G CPU SoC Design Analysis	Applications Processor	HiSilicon Technologies Co. Ltd	Hi3690	SDA-2003-801	28/08/2020
Intel 10nm (2nd Gen) Ice Lake CPU SoC Design Standard Cell GDS Library Analysis	Laptop Computer	Hewlett-Packard	15-dy1973cl	SDG-2001-801	19/06/2020
Intel 10nm (2nd Gen) Ice Lake GPU SoC Design Standard Cell GDS Library Analysis	Laptop Computer	Hewlett-Packard	15-dy1973cl	SDG-2001-802	21/07/2020
Intel 10nm Ice Lake Transistor Characterization Report	Microprocessor	Intel	SRG0N	TCR-2002-801	20/05/2020
Micron 1y LPDDR5 8 Gb Transistor Characterization Report		Micron Technology	Y2BM	TCR-2004-801	06/05/2020
Micron 512 Gbit TLC 96L 3D NAND (MT29F512G08EBHBFJ4-R:B) Internal Waveform Analysis	NAND Flash	Micron Technology	MT29F512G08EBHBFJ4-R_B	WAR-1912-801	15/05/2020

Trump’s Tariff Tensions: What’s in store for the Semiconductor Industry?

Join top global experts in this free webinar to explore how semiconductor tariffs, export controls, and trade tensions are disrupting the chip industry beyond just the U.S. and China.

22 Apr

Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing

Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.

21 Apr

TechInsights Tariff Watch

Stay ahead of the curve with TechInsights Tariff Watch, your go-to resource for timely and in-depth analysis on the shifting landscape of tariffs and their impact on the tech industry.

21 Apr

Dan Kim, Chief Strategy Officer, TechInsights

Dan Kim, Chief Strategy Officer at TechInsights, is a globally recognized semiconductor expert with leadership experience at SK hynix, Qualcomm, and the U.S. Department of Commerce, where he led strategy for the $39B CHIPS for America program.

17 Apr

Insight: Tariffs and Trade Restrictions Fuel Uncertainty in the Sensor Market

Explore how tariffs and trade restrictions are reshaping the sensor market – uncover key challenges, supply chain risks, and impacts on major players in our latest insight.

17 Apr

TechInsights Appoints Dan Kim as Chief Strategy Officer

TechInsights has announced the appointment of Dan Kim as its new chief strategy officer, effective April 21, 2025. In this new role, Kim will lead TechInsights’ strategy and engagement with corporate and government customers across the Americas, Europe, and Asia.

17 Apr

Unlock the Future of Advanced Packaging: A Deep Dive into Hybrid Bonding

Discover how hybrid bonding is revolutionizing semiconductor packaging and driving the future of high-performance, low-power devices.

14 Apr

TechInsights’ NVIDIA HGX B200 Analysis Reveals HBM3E Supplier and Advanced Packaging Innovation

Explore TechInsights’ early analysis of NVIDIA’s HGX B200 AI accelerator, revealing SK hynix as the HBM3E supplier and showcasing the first commercial use of TSMC’s CoWoS-L packaging.

14 Apr

Quarterly Assembly Packaging Equipment Regional Sales – April 7, 2025

Analyze Assembly and Packaging Equipment revenue sales by region, including China, Europe, Japan, and more. Access detailed quarterly and annual sales data by company.

09 Apr

Inside Blackwell: The Secrets Powering NVIDIA’s AI Supremacy

Discover the secrets inside NVIDIA Blackwell B200. TechInsights reveals exclusive insights into its architecture, packaging, and HBM3e memory.

03 Apr

Can Intel Reclaim Its Crown in the Semiconductor World?

Join industry experts David MacQueen and James Sanders as they uncover Intel’s bold strategies, leadership shifts, and cutting-edge innovations that could redefine the semiconductor landscape.

Discover the HiSilicon Hi1105-GFCV150 die, uncovered inside its component from the Huawei Mate 70 Pro+—a glimpse into Huawei’s latest tech innovation!

20 Mar

5 Key Trends Shaping Automotive Electronics in 2025 and beyond

Join us to unlock exclusive insights on the key trends shaping automotive electronics, from AI and EVs to semiconductor demand and automated driving!

12 Mar

Hybrid Bonding –Tomorrow’s Interconnect

Gain data-driven insights into hybrid bonding’s impact on semiconductor packaging.

10 Mar

Apple iPhone 16e Teardown

Discover the iPhone 16e teardown! Explore Apple's cost-saving design, the new Apple C1 5G modem, and key differences from the iPhone 16.

05 Mar

MWC 2025 Day 1: Qualcomm –“The agentic AI is the new mobile UI”

03 Mar

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27 Feb

Thank you for your interest in our The Chip Insider!

27 Feb

TechInsights at Mobile World Congress 2025

Join TechInsights at Mobile World Congress 2025 in Barcelona as we explore the latest industry shifts shaping the future of mobile technology.

26 Feb

Global Smartphone Market Outlook in 2025 and Beyond

Join industry experts as we uncover the key forces shaping the smartphone market in 2025. From AI-driven innovation to shifting consumer trends, get ahead of the competition with exclusive insights!

25 Feb

Power product to develop a targeted sales strategy by identifying key areas for product enhancement -hp

Leveraging TechInsights' Power product to develop a targeted sales strategy by identifying key areas for product enhancement and pinpointing gaps to address, enabling successful sales engagement with a major Foundry account

TechInsights’ Power product provided the Capital Equipment company with both the process and process flow information they needed.

25 Feb

Amkor Technology Q4 2024 Earnings Summary

Explore key takeaways from Amkor’s Q4 2024 earnings, including a 13% QoQ revenue decline and challenges in automotive and industrial markets.

25 Feb

iPhone 16e Debuts with Apple’s First In-House 5G Modem and Enhanced AI Capabilities

Apple’s new iPhone 16e introduces the C1 modem, marking a major step toward modem independence from Qualcomm while delivering improved 5G performance and power efficiency.

21 Feb

SanDisk is back

20 Feb

Reliance Jio launches JioTele OS for Smart TVs to compete with Google TV in India

19 Feb

China's Chipmakers: Driving the Path to Semiconductor Self-Reliance

The rapid growth of China’s semiconductor industry is reshaping the global tech landscape. With strong government backing and a surging domestic market, Chinese chipmakers are making bold strides toward self-reliance in a geopolitically charged environment.

11 Feb

Owner Group Q&A with Tesla Model Y Team Reveals 4D Interior Radar

07 Feb

2025 Semiconductor Industry Forecast: Key Trends & Insights

Discover the top semiconductor trends for 2025, including AI-driven chip innovations, memory market shifts, and custom silicon advancements. View this free TechInsights report to stay ahead.

04 Feb

Chip Observer: February 2025

DeepSeek’s AI breakthrough shakes the market, U.S. tariffs and CHIPS Act funding uncertainty disrupt supply chains, and TechInsights uncovers major semiconductor advancements.

04 Feb

DeepSeek Surpasses ChatGPT

Discover how DeepSeek’s innovative approach to AI is challenging hardware reliance and setting new benchmarks in generative AI development.

27 Jan

China Enters 2025 with Big Memory Breakthroughs

TechInsights reveals not one, but two advanced memory developments out of YMTC and CXMT, and their impact on the semiconductor industry.

24 Jan

Year in Review: AI Continues March to the Edge

See how AI progressed to the edge in 2024, with breakthroughs in edge AI chips, NPUs, and 64-bit MCUs enhancing performance and efficiency.

23 Jan

The Software-Defined Vehicle is Rearchitecting the Industry

Explore how software-defined vehicles (SDVs) are revolutionizing automotive technology and industry dynamics, driving centralized architectures, ADAS-cockpit convergence, and new partnerships across the value chain.

23 Jan

Robotaxis Outshine Traditional Automakers in the Autonomous Revolution

Learn more about how robotaxi companies like May Mobility, Waymo, and Zoox are shaping the future of autonomous vehicles in 2025, while traditional automakers take a backseat.

22 Jan

SoC Design: Insights into Overcoming Challenges and Driving Innovation

Unlock the secrets of successful SoC design! Explore challenges, strategies, and innovative solutions in this on-demand webinar. Gain insights from TechInsights' analyses to enhance collaboration, de-risk strategies, and drive innovation in your projects. Watch now for free on the TechInsights Platform!

TechInsights’ Analysis of AMD’s MI300X Reveals Samsung HBM3

TechInsights reveals the first commercial use of Samsung's HBM3 memory in AMD’s MI300X AI accelerator. Discover how this breakthrough impacts AI processors, memory technology, and advanced packaging.

17 Jan

What Does TSMC Q4 2024 Earnings Imply About Smartphone Business?

17 Jan

Innovations in Logic Scaling Performance for Semiconductors

Explore cutting-edge innovations in logic scaling performance. Discover nanosheets, CFETs, and next-gen materials shaping the future of semiconductors.

15 Jan

Leveraging TechInsights' array of technical analysis and cost models to gain valuable insights into advanced packaging and interposer technologies

This organization develops products that enhance high frequency and high voltage use in low-voltage transistor applications, essential for Data Centers, AI, High Performance Computing (HPC), and mobile applications requiring low quiescent current.

15 Jan

Further export controls limit sale of advanced node semiconductor products to Chinese customers

15 Jan

CES 2025: HL Klemove & Harman Unveil Integrated Automotive Platform

CES 2025 Wearables: What to Expect

07 Jan

CES 2025: Toyota and Zeekr. A Tale of Two Automakers

07 Jan

Join TechInsights at CES® 2025

TechInsights is thrilled to announce that our expert analysts specializing in Consumer Electronics, Automotive, and Mobile will be attending CES® 2025!

06 Jan

Five Key Trends for RF/Analog and Sensors in 2025

2025 promises transformative shifts in mobile innovation, driven by generative AI, 5G advancements, and evolving global trade dynamics.

03 Jan

Five Key Trends for Power Semiconductors in 2025

Discover key trends shaping the power semiconductor industry's future, from AI-driven data center growth to advancements in SiC, GaN, and China's expanding ecosystem.

03 Jan

Five Key Trends for Wearables in 2025

In this blog, we explore the emerging trends driving the future of wearables. From the resurgence of smartwatches to advancements in sensors, the rise of smartglasses and smart rings, and new possibilities in virtual reality, the wearables landscape is undergoing a remarkable shift.

30 Dec

Five Key Trends for Automotive in 2025

TechInsights has identified five key trends that will define the automotive electronics landscape in 2025 and beyond. These insights are essential for industry stakeholders navigating this rapidly shifting terrain.

23 Dec

2024 Automotive Software Survey: Key Results into a Rapidly Evolving Industry

The 2024 Automotive Software Survey, conducted by Aurora Labs in partnership with TechInsights, sheds light on how the industry is grappling with these rapid changes and evolving consumer expectations.

23 Dec

Five Key Trends for Consumer Electronics in 2025

Explore the key trends shaping the future of consumer electronics in 2025. Access a detailed, free analysis on the TechInsights Platform to stay ahead of the curve.

20 Dec

Semiconductor Sustainability – Eight Moments that Mattered in 2024

Looking back on sustainability developments of the past year, from NVIDIA innovations to legal challenges for emissions reporting, Apple net-zero progress to the release of the first global semiconductor carbon emissions forecast.

19 Dec

Global Semiconductor Carbon Emissions Forecast, 2025-2030

To set the bar for semiconductor sustainability and provide analysis and leadership to address the industry's carbon footprint, TechInsights has developed the Global Semiconductor Carbon Emissions Forecast, 2025-2030.

19 Dec

Google Looks to the Future: Quantum Leap and XR Revolution

Discover how Google’s 105-qubit Willow quantum computer and Android XR spatial computing platform are shaping the future of technology.

Chip Observer December 2024

This month’s Chip Observer explores major industry developments, from Intel’s leadership shake-up and escalating US-China trade tensions to groundbreaking advancements in quantum computing and a political crisis in South Korea.

17 Dec

CS-Compute to optimize floorplan and technology selection processes

Leveraging TechInsights' Compute to optimize floorplan and technology selection processes, ensuring alignment with product objectives and accelerating product development cycles

The business has a strong position in semiconductor manufacturing and specializes in advanced logic chips and stays competitive by adopting and integrating new technologies quickly after their market introduction.

16 Dec

Nordic Semiconductor and Kigen Collaborates on a New IoT eSIM Solution

13 Dec

Continental Confirms Spinoff of Automotive Group

13 Dec

Hyundai and BAIC Injecting Capital into Joint Venture to Target Chinese Market

12 Dec

GM Pulls the Plug on its Cruise Robotaxi Business

11 Dec

Huawei Mate 70 Pro+: Exploring the HiSilicon Kirin 9020 Processor

Using TechInsights’ Advanced Packaging to Effectively Position and Communicate a Product’s Value to a Target Audience

The marketing team at a fabless semiconductor company faced pressure to respond to a competitor's campaign that was touting enhancements to its product roadmap, driven by advanced packaging.

04 Dec

Using TechInsights' memory market intelligence to avoid production delays and cost overruns and increase competitive positioning in the market

The customer’s device team was preparing for a major product launch scheduled about a year in advance, confident there would be no significant challenges with pricing or component availability.

04 Dec

Memory Market Developments in 2025 and Beyond

Join TechInsights for an in-depth webinar on Memory Market Developments in 2025 and beyond. Discover trends in DRAM, NAND, AI advancements, and more with top industry experts.

Insights into Logic Standard Cell Height Optimization

The evolution of logic scaling stands at the forefront of semiconductor innovation, shaping the efficiency and performance of next-generation devices.

03 Dec

SmartSens Introduces its First Domestic High-end Smartphone CIS Product

02 Dec

An update on Vishay 3.0 strategy

29 Nov

Can Huawei Mate 70 Series Duplicate the Success of Mate 60 Pro?

Curious about the future of Huawei's flagship smartphones? Discover how the Mate 70 series stacks up against the highly successful Mate 60 Pro.

Chip Observer November 2024

Discover the latest in semiconductor advancements and challenges in the November 2024 Chip Observer. Explore licensing disputes, trade shifts, domestic tool breakthroughs, and key industry milestones, plus insights on SiC, GaN, and Nintendo.

27 Nov

NXP MiFare DUOX IC Enhances Security and Simplifies Key Management in Automotive NFC Entry Systems

27 Nov

Cost Modeling ICs in Apple iPad Air 13” – #1 The M2 SoC

Explore the cost dynamics of Apple’s M2 SoC in the iPad Air 13". Learn how TechInsights’ IC Cost and Price Model reveals hidden costs and boosts strategic decision-making.

26 Nov

The 5G mobile radio in Huawei Mate 70: We've seen the Phase 7 radio architecture in Mate 60 Pro, now what?

26 Nov

Deutsche Telekom, Skylo and Qualcomm Demonstrate D2H Connectivity in Europe

26 Nov

CHIPS Act incentives finalized for TSMC, GlobalFoundries, BAE Systems, and Rocket Lab

26 Nov

Finished Goods Stockpiling and Alarms During Q3 2024 Earnings Calls Precede Trump's Proposed Tariffs

The Wall Street Journal recently reported that American businesses are stockpiling finished goods in anticipation of new across-the-board global tariffs and significantly higher tariffs levied on China proposed in the second Trump administration.

How Trump Policies Could Disrupt Automotive Semiconductor Markets

Discover how Trump policies could impact automotive semiconductor demand, with a focus on EV sales, tariffs, and global trade.

20 Nov

Trump, CHIPS, and Tariffs: How the 2024 U.S. Election Will Reshape the Semiconductor Industry

Discover how the 2024 U.S. election could reshape the semiconductor industry with increased tariffs, CHIPS Act uncertainties, and shifting global supply chains. Prepare for what's next.

20 Nov

AI Procurement Outlook: A Record-Breaking Year for Semiconductors

Explore trends driving semiconductor growth, record-breaking sales, rising ASPs, and the impact of AI hardware demand on the global market.

19 Nov

Smartphone Sales in China Surge 26% YoY During 11.11 Festive 2024

TechInsights Mobile team estimated that the smartphone sales by volume during China’s largest online shopping festival 11.11 (Nov 11) in 2024 rebounded 26% year-over-year (yoy) to 9.5 million units, largely due to the longer sales window.

15 Nov

Using TechInsights' Mobile RF product to predict semiconductor equipment requirements for foundry and IDM customers

A leading semiconductor equipment manufacturer needed to determine the requirements imposed by the fabrication and packaging of RFIC on foundry processes and wafer fab equipment for their foundry and IDM customers over the next several years.

14 Nov

Cs-Using TechInsights Semiconductor Manufacturing Economics, Executive Insights and ConnectedSmart Home Coverage to Enhance Procurement Negotiating-hp

Using TechInsights Semiconductor Manufacturing Economics, Executive Insights and Connected/Smart Home Coverage to Enhance Procurement Negotiating

An industry leading designer and manufacturer of innovative sound systems that delivers high-quality audio for music, TV and smart home applications, used TechInsights analysis to improve their procurement negotiation tactics.

12 Nov

Memory Procurement Outlook: Navigating the Demand Surge

Discover key trends in memory procurement, including rising demand driven by AI and datacenter expansions. Learn about increasing prices, supply constraints, and the importance of advanced memory solutions like DDR5 and HBM in the evolving market landscape.

11 Nov

2025 Consumer IoT Outlook Report

Get a glimpse of the future as the global consumer IoT market is set to grow 8.8% in 2025, driven by generative AI, the Matter standard, and rising demand for smart home solutions!

07 Nov

The Blooming AI PC Processor Market: A $35 Billion Opportunity by 2029

Explore the booming AI PC processor market, projected to reach $35 billion by 2029 with a 42% CAGR. Discover insights on leading vendors, market share, and the rise of AI-capable CPUs with NPUs.

07 Nov

2025 Mobile Outlook Report

Get a glimpse of the 2025 mobile market revolution—AI-driven experiences, foldables, and Huawei's rise. Ready for what’s next?

07 Nov

2025 Connectivity Outlook Report

Get a glimpse of 2025’s wireless future, where 5G, Wi-Fi 7, and emerging RF technologies like GaN and GaAs drive faster speeds, lower latency, and enhanced connectivity for consumer and industrial applications.

07 Nov

2025 PC/Laptop Outlook Report

Get a glimpse of the pivotal trends reshaping the PC and laptop markets in 2025, from AI-powered upgrades to the end of Windows 10 support.

07 Nov

2025 Power Outlook Report

Get a glimpse of the 2025 power semiconductor market, where AI and compound semiconductors drive innovation and fuel growth amidst industry shifts.

07 Nov

AI Market Outlook 2025: Key Insights and Trends

Explore the AI Market Outlook 2025, highlighting key growth trends in AI hardware, from data center chips to edge devices. Discover how hyperscalers, enterprises, and startups are shaping the future of AI infrastructure.

06 Nov

Advanced Packaging Market: 2025 Outlook and Growth Trends

Explore the 2025 Advanced Packaging Market outlook with key growth trends, recovery insights, and technology shifts in AI, data centers, and high-performance computing.

06 Nov

Memory Market Outlook: AI Demand and Tight Supply Drive Resurgence

Explore the 2025 Memory Market Outlook, highlighting AI-driven demand, supply constraints, and projected growth across DRAM and NAND markets. Discover trends shaping future memory demand and revenue.

05 Nov

2025 Sensor Outlook Report

Get a glimpse of the transformative growth in the sensor market for 2025, driven by cutting-edge advancements in mobile imaging, automotive safety, and biometric security.

05 Nov

Unlock the Future of Devices with On-Device Generative AI: Market Disruption Ahead

Discover our eBook on on-device generative AI and its market-shaping potential, with insights into tech breakthroughs, industry impact, and innovation strategies.

30 Oct

Leveraging TechInsights’ Manufacturing Insights to enhance supply chain resilience and adaptability for capital equipment companies in a rapidly changing market

As a capital equipment organization, it’s essential to have a comprehensive understanding of your supply chain. This includes identifying key suppliers, assessing your current market position, and analyzing strengths and weaknesses relative to competitors.

30 Oct

2025 Manufacturing Outlook Report

Get a glimpse of 2025, where soaring IC demand and transformative technologies promise to reshape the semiconductor industry—are you ready to seize the opportunities?

29 Oct

Dr. Jeongdong Choe

Dr. Jeongdong Choe has a Ph.D. in electronic engineering and 30 years’ experience in semiconductor process integration for DRAM, (V) NAND, SRAM, and logic devices. A Ph.D. in Electronics (Semiconductor) from Sungkyunkwan University, he also holds master’s and bachelor’s Degrees in Materials Engineering (Metallurgical) from Yonsei University.

28 Oct

Material and Electrochemical Insights: SeLian-Hakadi Sodium-Ion Battery Advancements

Discover insights from TechInsights’ analysis of Hakadi’s commercial SIBs, highlighting innovative materials and performance enhancements that could revolutionize energy storage.

28 Oct

Using TechInsights' Mobile RF product to better position foundry services for fabless RFIC designs

Benchmarking RFIC PDKs for 5G mobile design? Learn how TechInsights' Mobile RF helps foundries enhance offerings with competitive analysis, optimizing die layouts, materials, and packaging.

24 Oct

Unlock the Future of Mobility with Automotive Semiconductors

Explore comprehensive teardowns, competitive benchmarking, and market trends driving innovations in autonomous vehicles, EVs, and ADAS systems.

23 Oct

2025 Compute Outlook Report

This report delves into the pivotal factors driving growth, the technology shifts on the horizon, and what to expect in terms of procurement and pricing in the coming years.

23 Oct

2025 AI Outlook Report

Discover how groundbreaking advancements in AI models, edge computing, and new regulations will redefine industries and create exciting opportunities in 2025.

23 Oct

Huawei Mate XT Teardown

Discover the technical innovations behind the Huawei Mate XT in this teardown analysis, exploring its foldable display, Kirin 980 processor, triple-lens camera, and 5G capabilities.

21 Oct

Unlock Insights into the Global Semiconductor Supply Chain

Unlock Insights into the Global Semiconductor Supply Chain Explore TechInsights’ In-Depth Semiconductor Supply Chain Analysis The semiconductor supply chain is the backbone of today's technology ecosystem. With ever-evolving demands in AI, IoT

21 Oct

Chinese Semiconductor Developments

11 Oct

Honor 200 Pro ELP-AN00 Smartphone Deep Dive Teardown

Discover how the Honor 200 Pro, powered by the Snapdragon 8s Gen 3, compares to the Google Pixel 8a with its Tensor G3 processor. Explore their similarities in design and performance.

10 Oct

Apple Watch Series 10 Teardown

Explore the Apple Watch Series 10 teardown as we reveal its slimmer design, larger display, and advanced components. Discover what’s new in Apple’s latest wearable technology.

10 Oct

Breakthroughs in Sodium-Ion Battery Technology

Sodium-ion batteries (SIBs) are gaining traction as a cheaper, safer alternative to lithium-ion batteries (LIBs). With abundant, lower-cost materials like sodium and aluminum, SIBs reduce production expenses by up to 10% compared to LIBs.

10 Oct

Free Access: Latest Component Price Landscape Report

Get free access to TechInsights' latest Component Price Landscape (CPL) 2Q Quarterly Summary, offering key insights into electronic component pricing trends and lead-time forecasts.

10 Oct

Apple iPhone 16 Teardown

Discover the intricate details of the Apple iPhone 16 in our latest teardown analysis. Explore design changes, internal components, and key upgrades including a new camera control system and the advanced A18 processor.

08 Oct

Unlocking Cost Efficiency and Capacity Forecasting

Discover the challenges procurement managers face in accurately assessing foundry costs and forecasting future production capacity for critical node expansions.

07 Oct

A First Look at Infineon’s and Industry’s First 400 V SiC MOSFET

TechInsights is excited to announce that we have Infineon’s, and the industry’s, first 400 V silicon carbide (SiC) MOSFET in-house.

07 Oct

2025 Memory Outlook Report

Discover the key trends shaping the memory market in 2025, including AI impacts on HBM and NAND growth. Stay informed with essential insights and forecasts.

07 Oct

2025 Advanced Packaging Outlook Report

Discover key insights from the Advanced Packaging Outlook Report 2025, covering trends like interposers for AI, Panel-Level Packaging (PLP), automotive chiplets, silicon photonics, and glass substrates, driving the future of semiconductor packaging.

07 Oct

Apple MacBook Air (A3113) Teardown

Explore the Apple MacBook Air (A3113), 13 inch teardown, uncovering key components like the M3 processor, WiFi 6E, camera subsystem, and a cost-effective yet premium design.

04 Oct

The Impact of Standard Cell Width on Future Innovation

Module two dives into logic scaling by focusing on standard cell width, setting the foundation with a recap of module one.

03 Oct

Hurricane Helene Disrupts Access to the World’s most Critical Quartz Mine

Discover how Hurricane Helene's disruption of North Carolina's critical quartz mines may impact the semiconductor supply chain, sourcing strategies, and market trends.

02 Oct

A18 Pro Processor in iPhone 16 Pro Max

Access the full analysis of the A18 Pro processor, including in-depth insights and performance breakdowns.

28 Sep

Leverage TechInsights’ Power product to uncover new market opportunities and establish your products as technologically superior

Marketing professionals at fabless semiconductor companies must navigate competitive markets like SiC, GaN, and PMICs, ensuring timely product launches and clear value propositions.

27 Sep

Unveiling the A18 vs A18 Pro – Key Differences in Apple's Latest SoCs

Discover the key differences between the A18 and A18 Pro processors in the iPhone 16 series. Log in to TechInsights Platform for the full analysis and detailed insights.

25 Sep

Using TechInsights Semiconductor Manufacturing Economics to minimize capex investment risk and ensure profitability

IDMs face high stakes in capex investments, balancing risks of over- and under-investment in new semiconductor manufacturing to stay competitive and profitable.

24 Sep

Using TechInsights Semiconductor Manufacturing Economics to establish competitive pricing

Case Study Using TechInsights Semiconductor Manufacturing Economics to establish competitive pricing The Challenge IDMs must design and price their products in a competitive market landscape. While they typically maintain some form of cost model for

24 Sep

Using TechInsights Compute Offering to Predict Future Node Requirements

Leading IDM partners with TechInsights to leverage industry benchmarking for developing next-gen 2nm semiconductor solutions, shaping future technology strategies.

24 Sep

AI-Driven Growth: The Future of Compute Servers Through 2029

Discover the future of compute servers in our latest report, exploring AI-driven growth and the rise of accelerated servers. Gain insights into market trends, financial performance of top OEMs/ODMs, pricing forecasts, and shipment projections through 2029.

24 Sep

Webinar - Semiconductor Industry Developments

Join industry experts Dan G. Hutcheson and Andrew Leach in a fireside chat discussing the latest semiconductor developments, including sanctions, subsidies, and silicon advancements. Gain valuable insights into market shifts, technological innovations, and geopolitical strategies shaping the industry's future.

24 Sep

iPhone 16 Pro Models: How Reduced Lead Times Enhance Availability

iPhone 16 Pro models now ship faster in key markets like the US, China, and the UK, with lead times reduced by up to 3 weeks. Learn more about the potential impact on sales.

24 Sep

Using TechInsights Advanced Packaging to Achieve a Broad Perspective of Commercialized Technologies

Discover how a company addresses miniaturization challenges by developing thermal models and exploring technologies to meet size, power, and thermal requirements for their applications.

23 Sep

Using TechInsights Executive Insights to Support Procurement Planning Cycles and Address Productivity Issues

Learn how a company's strategic acquisition aimed at expanding into high-growth sectors like security and smart home led to integration of vendors, pricing, and supply chain optimization.

23 Sep

Apple iPhone 16 Pro Max (A3295) Teardown

Experience the iPhone 16 Pro Max with its titanium design, A18 Pro chip, 6.9-inch OLED display, and advanced 48MP camera system. Discover unparalleled performance in 2024's flagship phone.

20 Sep

2Q2024 Table Application Processor Market Model

Explore our latest report on the global tablet applications processor market, which grew 16% YoY in Q2 2024. Apple leads with 69% revenue share, while x86-based APs remain stable. Includes shipment and revenue data for 24 vendors, with estimates through Q1 2025.

19 Sep

Apple Vision Pro Utiizes SK hynix DRAM in R1 Chip

Discover how the SK hynix H5EA1A56MWA 1 Gb LLW DRAM enhances real-time processing and low-latency performance in the Apple Vision Pro AR headset with advanced memory architecture.

19 Sep

Apple AirPods Pro Disrupts Hearing Aid Market

Apple's AirPods Pro is set to disrupt the $12B hearing aid market with FDA-approved features and cutting-edge tech. Explore TechInsights' reports for a detailed breakdown of the tech driving this innovation.

19 Sep

Deep Dive Analysis of the Amprius SiCore™ SA-08 Battery

Will Silicon-Based Anode Technology Take the Crown as the Future of High-Energy-Density Lithium Batteries?

The most used anode material for LIBs is graphite which has a specific capacity of 372 milliampere hours per gram (mAh/g). However, the energy density of LIBs can be improved with the incorporation of Silicon (Si) instead of graphite.

19 Sep

Using TechInsights to understand inflection points when new toolsets will be adopted

Explore how a leading DRAM equipment manufacturer drives innovation by providing cutting-edge solutions that enable the production of advanced DRAM devices and smaller technology nodes.

18 Sep

Using TechInsights' Mobile RF product to track design trends and gain a competitive advantage in mobile radio design

Learn how a market leader in 5G mobile platforms uses competitive benchmarking to identify growth opportunities and maintain an edge in the smartphone OEM market.

18 Sep

Using TechInsights Bill of Materials (BOM) Database to Achieve Substantial Savings

Discover how a leading foundry leverages TechInsights' expertise to navigate diverse customer needs, focusing on mainstream semiconductor technologies and strategic growth.

18 Sep

YMTC Xtacking4.0: Breaking New Ground in 3D NAND Technology

Explore the latest advancements in YMTC's Xtacking4.0 (Gen5) 3D NAND technology, including innovations in storage density, speed, and efficiency. Discover how it compares to previous generations.

18 Sep

2024 Compute – SoC Design Video Briefing 2

Join TechInsights’ upcoming SoC Design Analysis video briefing featuring TSMC, Samsung and Intel latest technology nodes, TSMC N3E, Samsung SF3 and Intel 4nm, through the lens of digital gates and standard cell libraries.

18 Sep

YMTC's Memory Developments Highlight China's Strong Position

YTMC’s latest Xtacking4.0 process has been observed in a new memory chip from the Chinese vendor. What can it tell us about the development of the domestic Chinese semiconductor industry in the face of US sanctions?

18 Sep

System-on-Chip Innovation Fuels Rapid Growth Through 2025

The System-on-Chip (SoC) market is entering a period of rapid growth, driven by innovations in chiplet integration, advanced packaging, and AI-powered designs.

17 Sep

Apple Vision Pro Battery Pack: In-Depth Technical Analysis and Performance Review

Discover the technical differences in battery design for Apple Vision Pro, Meta Quest 3, and HTC Vive XR Elite, exploring energy capacity, weight, and thermal management in AR/VR devices.

17 Sep

How is the Automotive Market Evolving? Discover Key Forecasts in Our NEW Reports

Explore the evolving automotive market with TechInsights' latest reports. Get detailed forecasts on key trends in infotainment, ADAS, electric vehicles, and more. Access up-to-date data on semiconductor and system-level components to make informed decisions.

12 Sep

AI Continues to Drive Demand For Memory Solutions

Discover how AI will shape the memory markets by 2025, including growth in HBM, SSD demand, capex shifts, Edge AI impact, and delayed server refresh cycles. Explore these insights for free on TechInsights—sign up for full access and potential updates.

12 Sep

Apple A18: Incremental Upgrade with Strategic Focus

The Apple A18 and A18 Pro processors offer refined performance with minor improvements over the A17 Pro, highlighting Apple's focus on advancing AI capabilities and on-device intelligence.

11 Sep

Apple iPhone 16 Camera Control Button

Discover how the new Apple iPhone 16 Camera Control button impacts the placement of the mmWave antenna. Explore the trade-offs between enhanced photo features and 5G connectivity in our detailed analysis.

11 Sep

Huawei Mate XT: Unveiling the World's First Trifold, Triple-Screen Foldable Smartphone

Discover the Huawei Mate XT, the world's first trifold, triple-screen foldable smartphone with a 10.2-inch OLED display, advanced camera system, and cutting-edge features like satellite communication and fast charging.

10 Sep

Apple Watch is Turning 10: A Decade of Innovation and Evolution

Explore the evolution of the Apple Watch as it marks its 10th anniversary. Discover how Apple has maintained market dominance with innovative designs, consistent features, and cost management strategies through nine generations of smartwatches.

10 Sep

Apple iPhone 16 Series: Riding the AI Wave

Explore Apple’s iPhone 16 series with advanced A18 chipsets, larger displays, and new AI-driven features. Discover how the iPhone 16, 16 Plus, 16 Pro, and 16 Pro Max are set to outperform their predecessors in 2024.

10 Sep

Apple iPhone 16 Series Launch Signals Strong Growth in India but an Uphill Battle in China

Explore how Apple's iPhone 16 series launch is set to boost growth in India with strategic price cuts, while facing significant challenges in China due to local competition and regulatory issues. Discover the implications for Apple’s global strategy and market performance in 2024.

10 Sep

Apple Set to Surpass Samsung as the Largest Smartphone Maker in 2025 for the First Time

Apple is set to surpass Samsung as the world’s largest smartphone maker in 2025. Key factors include aggressive pricing strategies, the launch of the iPhone SE (2025), technological innovations, and favorable macroeconomic conditions. Discover how Apple’s comprehensive approach positions it for historic growth while competitors face their own challenges.

04 Sep

Using TechInsights Market Intelligence to Increase Battery Sales and New Logo Sales

Learn how TechInsights’ Market Intelligence helped a leading battery supplier boost sales and secure new contracts in the smartwatch industry by providing data-driven insights and targeted sales strategies.

04 Sep

How TechInsights’ Compute and Advanced Packaging Drove First-Mover Advantage in the Data Center Market

See how TechInsights’ Compute and Advanced Packaging provided a leading electronics manufacturer with critical insights into the data center ecosystem, enabling them to secure first-mover advantage and align their products with market demands and end-use applications.

03 Sep

How TechInsights’ Memory Analysis Accelerated Market Entry and Strengthened Business Cases for a Fabless NVM Innovator

Discover how TechInsights’ Memory analysis empowered a fabless company to position its embedded NVM technology effectively, accelerate market entry, and build strong business cases for IDM and foundry partnerships through precise process flow and cost modeling.

03 Sep

How TechInsights’ Advanced Packaging Helped a Leading Semiconductor Manufacturer Optimize Thermal Performance and Boost Market Share

Learn how TechInsights’ Advanced Packaging analysis enabled a top semiconductor manufacturer to evaluate and select optimal packaging technologies, enhancing thermal performance and accelerating time to market while boosting reliability and market share in their applications.

03 Sep

How TechInsights’ Memory Offering Helped a Fabless Company Conquer the Embedded NVM Market

Discover how a fabless memory core designer leveraged TechInsights' Memory and Advanced Packaging analysis to gain a competitive edge in the growing embedded NVM market, enhancing product reliability and market share.

03 Sep

Why the iPhone 16 Series Launch Is Crucial for Apple

Discover why the iPhone 16 series launch is crucial for Apple as it aims to compete in the AI smartphone market and secure its place among top industry leaders.

03 Sep

Hyperscalers & Cloud Providers Shaping AI with Custom ASICs

Discover how hyperscalers and cloud providers like Google, Amazon, and Facebook are revolutionizing AI with custom-built AI accelerator ASICs. Learn how this trend is optimizing performance, cutting costs, and reshaping the tech industry.

29 Aug

Global Fitness Band Market Forecast 2012-2029

Explore the shifting dynamics of the global fitness band market, including rising ASPs, regional trends, and future growth prospects amid increasing competition.

29 Aug

Global Smartphone Shipments Slow to 4% YoY Growth

Explore the global smartphone market trends in July 2024, with slowing growth in shipments and sales, inventory insights, and top brands like Samsung and Apple leading the market.

29 Aug

Smartwatch Market Rebounds: 4% Growth in Q2 2024 After Six Quarters of Decline

Discover how the global smartwatch market returned to growth in Q2 2024 after six quarters of decline, driven by brands like Garmin, Huawei, and Google.

28 Aug

Navigating the Future of Semiconductor Sustainability

Discover how the semiconductor industry is navigating sustainability challenges and opportunities, from advanced packaging to automotive electronics, chip manufacturing, and artificial intelligence.

28 Aug

Gaining Transparency into Supplier and Competitor Costs with TechInsights Semiconductor Manufacturing Economics

Learn how procurement professionals and product directors at fabless semiconductor companies can gain transparency into supplier and competitor costs using TechInsights' Semiconductor Manufacturing Economics, enabling them to realize potential revenue gains by securing better pricing and negotiating stronger contracts.

27 Aug

Leveraging TechInsights Semiconductor Manufacturing Economics to Secure Favorable Pricing for Existing and Newly-Designed IC Products

Discover how fabless semiconductor companies can leverage TechInsights' Semiconductor Manufacturing Economics to secure annual savings by obtaining favorable pricing on existing and newly-designed IC products, while mitigating supply-chain risks with advanced cost models and global foundry data.

27 Aug

How a Leading Wireless Audio Developer Used TechInsights to Streamline Procurement, Drive Innovation, and Gain a Competitive Edge

Learn how a leading wireless audio developer used TechInsights' Semiconductor Manufacturing Economics, Executive Insights, and Consumer Electronics products to streamline procurement, drive innovation, and gain a competitive edge, resulting in significant cost savings and strengthened market leadership.

27 Aug

Using TechInsights Semiconductor Manufacturing Economics to Source Discrete Semiconductors and ICs at Favorable Prices

Discover how TechInsights' Semiconductor Manufacturing Economics helps product managers and procurement professionals secure over $1 million in annual savings by sourcing discrete semiconductors and ICs at favorable prices, while mitigating supply-chain risks with detailed cost models and global foundry data.

27 Aug

Apple iPhone 16 Release on September 9 with Debut of Generative AI iPhone

Discover in-depth analysis and insights on the latest Apple innovations, including the upcoming Apple iPhone 16. Log into TechInsights for all the details.

27 Aug

Chiplets and Advanced Packaging: A Deep Dive into Industry Evolution and AI Integration

Discover how chiplets and advanced packaging are revolutionizing the semiconductor industry in our latest eBook. Explore key trends, industry leaders, and future innovations driving AI and performance advancements.

26 Aug

The Role of Efficient Cores in Advanced Processors: Maximizing Performance

Learn how modern processors use diverse core designs to boost performance and efficiency. Explore the evolution from symmetric multiprocessing to advanced architectures like Arm's big.LITTLE and Intel's P/E cores for better performance and energy savings.

23 Aug

Using TechInsights Power Offering to Inform Internal Stakeholder decision making and Company Strategy

Discover how a leading semiconductor company used TechInsights’ Power Offering to inform strategic decisions, optimize product development, and enhance marketing for wide band gap devices.

21 Aug

The Chip Observer (August Edition)

Explore how Intel's CPU warranty extensions, AMD's and NVIDIA's delays, and the CHIPS Act impact the semiconductor landscape. Discover the challenges facing OpenAI and Meta in AI regulation and leadership. Uncover the competitive race among Samsung, TSMC, and Intel in nanosheet and chiplet technology.

21 Aug

MediaTek MT7925 (Filogic 360) Wi-Fi 7/BT 5.4 SoC Floorplan Analysis

Uncover the MediaTek BM11373A1 die inside the Filogic 360 MT7925BEN, a Wi-Fi 7 and Bluetooth 5.4 solution found in the HP Envy x360 laptop with AMD Ryzen 5 CPU and 16GB RAM.

21 Aug

Webinar - Chiplets and Advanced Packaging: Moving the Industry Forward

Join TechInsights' webinar on 'Chiplets and Advanced Packaging: Moving the Industry Forward.' Discover the latest advancements in chiplet technology and advanced packaging, and how they are driving innovation in the semiconductor industry.

20 Aug

Q3 2024 Automotive Infotainment and Telematics Report

Discover how stable vehicle production is shaping the automotive infotainment and telematics market in TechInsights' Q3 2024 update, where the focus is shifting toward software innovation in a mature landscape.

19 Aug

Using TechInsights Analysis and Models to Negotiate Semiconductor Pricing

Learn how a leading luxury automobile company used TechInsights’ semiconductor pricing analysis and models to optimize their semiconductor procurement strategy.

19 Aug

Leveraging TechInsights Manufacturing Equipment Market Analysis to Bolster its Market Position

Explore how a leading Capital Equipment company strengthened investor confidence and bolstered its market position by leveraging TechInsights’ Manufacturing Equipment Market Analysis.

19 Aug

Using TechInsights Advanced Packaging for Market Planning

Discover how one of the world’s leaders in process control leveraged TechInsights' Advanced Packaging solutions to navigate the complex semiconductor industry.

19 Aug

TechInsights’ Sustainability Tools Used to Drive Down Carbon Emissions in the Supply Chain

Learn how TechInsights' Sustainability tools helped a leading fabless semiconductor company drive down carbon emissions across its supply chain.

16 Aug

Securing the Supply Chain

Discover how a leading automotive manufacturer secured a stable semiconductor supply chain with TechInsights' advanced analytics. The client mitigated risks, enhanced visibility, and gained a competitive edge in a volatile market by evaluating market trends, analyzing supplier capabilities, and leveraging predictive tools.

15 Aug

Gaining the Competitive Edge

Discover how a key player in image sensor technology gained a competitive edge with TechInsights' strategic intelligence. Through detailed competitive reports, cost efficiency, and rapid access to critical data, the company enhanced decision-making, optimized resource allocation, and stayed ahead of market trends.

15 Aug

Elevating Product Development

Discover how TechInsights' comprehensive market data and strategic insights help product development teams elevate their planning and growth strategies.

15 Aug

Vivo Hits New High: Fourth Largest Smartphone Brand Worldwide in Q2 2024

Discover how Vivo soared to fourth place in global smartphone rankings for Q2 2024. Explore their shipment growth, market impact, and strategies for future expansion.

15 Aug

Using TechInsights Semiconductor Manufacturing Economics to Ensure Competitive Pricing and Diversify Their Supply Chain

Discover how an Integrated Device Manufacturer for wireless communications utilized TechInsights Semiconductor Manufacturing Economics to secure competitive pricing and diversify their supply chain.

15 Aug

Google’s Pixel 9 Series: Driving Growth and Expanding Horizons

Discover how Google’s Pixel 9 series, with its advanced features and expanded market reach, is driving impressive growth and approaching profitability. Explore the latest innovations and strategic moves boosting Pixel's success in 2024.

14 Aug

Apple Exceeds Expectations: iPhone Shipments Surge in Q2 2024

Apple's iPhone shipments rose in Q2 2024, driven by discounts and growth in emerging markets. While facing challenges in China, Apple's shift to India and new AI advancements set the stage for future success. Explore the key trends and what's ahead.

14 Aug

Huawei Pura 70 Ultra’s 5G Radios: A Deep Dive into RF Components

Explore the advanced 5G radio design of Huawei’s Pura 70 Ultra in this detailed analysis. Discover how Huawei continues to innovate with entirely ‘made in China’ RF components and dual satellite communication technology.

13 Aug

Tablet Market Soars in Q2 2024: Apple, Samsung, and Lenovo Lead the Charge

The global tablet market surged 14% in Q2 2024, with Apple, Samsung, and Lenovo leading the growth. Discover key trends and market insights in our latest report.

12 Aug

Notebook PC Market Sees 4% Growth in Q2 2024 as AI PCs Emerge

Explore the 4% growth in the Q2 2024 notebook PC market, driven by strong commercial demand and the emergence of AI-powered PCs. Get detailed insights in our full report in the TechInsights Platform.

12 Aug

Comprehensive Analysis of Apple Watch Models: 2024 Q2 Insights

Explore Apple's Q2 2024 smartwatch market performance, focusing on shifting sales trends, revenue impacts, and the evolving role of cellular connectivity in the Apple Watch lineup.

12 Aug

Navigating Market Complexity

Discover how strategic insights from TechInsights empowered a marketing leader to overcome market complexities and fortify their intellectual property.

09 Aug

TSMC vs. Fujitsu: A Brief Comparison of 22ULL Embedded ReRAM Technologies

STT-MRAM and ReRAM are leading the charge in the evolution of memory technology, with significant advancements being made in these areas. Both are increasingly used in automotive, IoT, and other high-growth applications, surpassing older memory technologies like FeRAM and PCRAM.

08 Aug

Using TechInsights to Optimize Semiconductor Selection and Costs

Discover how a leading automotive manufacturer optimized semiconductor selection and reduced costs using TechInsights' comprehensive BOM data, advanced cost models, and engineering analysis tools.

08 Aug

Using TechInsights Compute Offering to Mitigate Core Design Risk

Discover how one of the world’s leading CPU providers leveraged TechInsights’ Compute offering to enhance their semiconductor analysis and mitigate core design risk.

08 Aug

Qualcomm's New Mobile Chipset: Making 5G Affordable by Reducing BOM Costs

At MWC2024, Qualcomm announced a groundbreaking development: 5G smartphones priced at $99 and below. Since 5G's debut in 2019, high costs have hindered widespread adoption, with prices rarely falling below $200. The Snapdragon 4s Gen 2 aims to change that by offering cost-optimized technologies.

08 Aug

Smartphone Market Grows 8% in Q2 2024: Emerging Markets Lead Recovery

The global smartphone market grew 7.6% year-over-year in Q2 2024, reaching 289.6 million units. This marks the third consecutive quarter of recovery, driven by strong demand in emerging markets like Africa, Latin America, and Asia-Pacific.

08 Aug

Semi-Solid-State Batteries Made by WELION

WELION's Semi-Solid-State Batteries: Transforming EVs and Small Power Products

NIO, the Chinese electric vehicle manufacturer, recently tested its new semi-solid-state batteries during a 14-hour, 650-mile journey with CEO William Li driving the ET7 sedan. These batteries, developed by Chinese company WELION, boast a 150-kWh capacity, promising extended range and faster charging times.

06 Aug

Battery Breakthroughs in EVs: Chevy Bolt, Tesla Models, and Hyundai IONIQ 5

The electric vehicle (EV) market is rapidly expanding, with millions of new electric cars registered globally, bringing the total on the roads to tens of millions.

30 Jul

Exploring Apple Vision Pro’s Revolutionary Eye Tracking System

In our series on Apple Vision Pro, we now focus on the headset's eye tracking system. This advanced technology allows users to control the interface with their gaze, replacing traditional input methods like a mouse or trackpad.

29 Jul

TDK CeraCharge™ - the First Rechargeable all-Ceramic SMD Battery

TDK CeraCharge™ - the First Rechargeable all-Ceramic SMD Battery Discover the advancements in IoT power sources with TDK CeraCharge™, the first rechargeable all-ceramic solid-state SMT battery. Learn about its innovative materials, performance

29 Jul

Chiplets Moving Into the Fast Lane: Transforming Automotive Processors

Chiplets moving into the Fast Lane: Transforming Automotive Processors Discover how chiplet technology is transforming the automotive industry, offering higher yields, faster development, and reduced costs. TechInsights predicts significant chiplet

25 Jul

Smart Home Device Shipments to Exceed 2.5 Billion in 2030

Discover how the smart home device market is set to exceed 2.5 billion shipments by 2030. Learn about the key drivers, regional insights, and strategic opportunities that will shape the future of smart home technology.

24 Jul

Webinar - Can Sustainability Efforts Withstand the Growing Power Needs of AI, EVs, and Augmented Reality?

Join us as TechInsights’ Sustainability Team discusses these key issues facing the semiconductor industry in 2024 and beyond.

24 Jul

KIOXIA/WD BiCS8 218L CBA 3D TLC NAND

Discover the latest Hybrid Bonding technology with the KIOXIA/WD BiCS8 CBA 3D TLC NAND. Analyzed by TechInsights, this innovative device showcases an advanced edge-XDEC floor plan and a sophisticated 2-deck integration.

23 Jul

Samsung SF3 (2nd Gen 3nm GAA) in Exynos W1000 Processor Confirmed

Initial SEM results confirm Samsung’s 2nd generation 3nm GAA technology in the Exynos W1000 processor. Discover key insights and implications for high-volume manufacturing requirements in our latest analysis on the TechInsights Platform.

22 Jul

AI's Influence on Advanced Packaging: Mid-Year Briefing Highlights and Innovations

Topics covered include TSMC’s recent announcements of an expanded technology offering for system-on-wafer (SoW) and new targets supporting continued interposer scaling in 2.5D chip-on-wafer-on-substrate (CoWoS) technology that is underpinning the AI boom.

19 Jul

Apple Vision Pro: Revolutionizing Face ID with TrueDepth Technology

Spatial computing integrates a user’s virtual environment with their physical surroundings, and Apple's Vision Pro achieves this with a suite of advanced sensors. While LiDAR, or Light Detection and Ranging, plays a significant role in mapping the user's space, the TrueDepth camera system adds another layer of depth sensing.

18 Jul

Exploring the New Samsung Galaxy Watch 7 Ultra: Unboxing

Explore the new Samsung Galaxy Watch 7 Ultra with TechInsights as we unbox and analyze the powerful Exynos W1000 processor. Join us as we uncover the latest in wearable technology and delve into the innovations driving Samsung's newest smartwatches.

18 Jul

Samsung Galaxy Watch 7

Discover the Samsung Galaxy Watch 7 with TechInsights. Explore the latest Exynos W1000 processor, advanced health tracking, AI wellness tools, and our detailed technical analysis.

18 Jul

Samsung Exynos W1000 Processor

Get an in-depth first look at the Samsung Exynos W1000 processor in the Galaxy Watch 7 Series. Discover the 3nm gate-all-around process, critical dimensions, and upcoming detailed analyses on TechInsights.

18 Jul

Taking Monolithic Designs to Disaggregation

The term ‘chiplet’ has come into use to describe an evolved design strategy moving past monolithic system-on-chip (SoC) to the heterogeneous integration of a disaggregated design in a system-in-package (SiP).

15 Jul

Chiplet Technology: Disrupting Chip Design and Fueling Growth

The semiconductor industry is facing a turning point with the rise of chiplet technology (also known as chiplet-based design or semiconductor chiplet technology). This revolutionary approach has been made possible by the advances in chip-to-chip interconnect and is poised to reshape chip production and design, particularly within the computing segment.

15 Jul

Apple R1 Adopts TSMC’s Latest Package

Apple’s R1 sensor hub chip in the Vision Pro AR/VR headset is the first use that TechInsights has seen of TSMC’s InFOM advanced packaging technology. The R1 has a 5nm processor chip plus two LLW DRAMs linked by short very-high-density interconnect to speed up the data processing.

15 Jul

LiDAR Technology in Apple Vision Pro

Spatial computing is a highlight of the new Apple Vision Pro headset. This device uses various sensors to integrate virtual and physical environments by sensing the three-dimensional structure of the user's space and eye movements.

13 Jul

The Chip Observer (June Edition)

Dive into the latest Chip Observer for June 2024! Explore major advancements in AI PCs, competitive shifts in datacenter GPUs, and insights on the recovering memory market. Discover how NVIDIA’s dominance is being challenged and get the scoop on IBM’s strategic moves.

12 Jul

Samsung Foundry's Next-Gen GAA Process Expected in Galaxy Watch 7

Discover the latest innovation from Samsung Foundry with their next-gen GAA process expected in the Galaxy Watch 7. TechInsights analysts provide insights from the Samsung Galaxy Unpacked Conference, building on last year's groundbreaking SF3E process technology.

10 Jul

Webinar - 2024 is the Year of the AI PC: Hype or Reality?

Explore the potential of 2024 as the Year of the AI PC. Join TechInsights’ experts David Watkins and Eric Smith to discuss the emerging AI PC market, sales projections, and the future of computing.

10 Jul

Volkswagen's $5 Billion Rivian Investment

Discover how Volkswagen’s $5 billion investment in Rivian could reshape its CARIAD software division, boost Android Automotive OS adoption, and influence future EV developments.

09 Jul

SEMICON WEST 2024: The Premier Microelectronics Event

TechInsights will be attending and presenting at SEMICON WEST. Join us to explore groundbreaking technologies transforming the microelectronics sector and enabling smart applications.

09 Jul

Scaling Logic for the Future: Unveiling the Next Decade's Evolution - Module 1

In the realm of integrated circuit design, scaling plays a pivotal role in driving technological advancement. Initially spurred by Moore's Law in 1965, which highlighted the economic feasibility of cramming more components into circuits, scaling has since evolved through constant innovation.

08 Jul

FinFET Transistors: Tracing the Path of Evolution

FinFET transistors, or Fin Field Effect Transistors, have revolutionized advanced semiconductor manufacturing by replacing planar FET transistors, starting with Intel's 22nm technology and later adopted by other foundries at the 16nm node.

08 Jul

Intel's i3 Process at the VLSI Technology Symposium: A Comparative Analysis

Intel's i3 Process at the VLSI Technology Symposium: A Comparative Analysis Discover Intel's latest i3 process unveiled at the VLSI Technology Symposium, showcasing advancements in semiconductor technology. With enhanced transistor density and

05 Jul

Revolutionary 32 Gb DRAM Chip: Advanced Node and Unmatched Capacity

TechInsights recently analyzed a new DDR5 DRAM chip from Micron Technology. This 32 Gb chip, capable of speeds up to 5,600 MT/s, doubles the capacity of its 16 Gb predecessor and features a significantly larger die size.

05 Jul

Forecast: Global Wearables Shipments by Type by Vendor by Quarter: 2017 to 2024

Global wearable shipments are forecasted to grow by 5.6% in 2024, after declining by 4.9% in 2023 and before that declining by 6.3% in 2022. Apple, Huawei, and Samsung will remain the market leaders in the global total wearables market.

04 Jul

Global Smartphone Replacement Rate: North America No longer Leading

Global Smartphone Replacement Rate: North America No longer Leading Discover the global shift in smartphone replacement rates as North America loses its lead. Central & Latin America (CALA) will take the top spot in 2024, followed by Central &

02 Jul

Dive into Xiaomi CyberDog 2: How Does It See the World?

Discover the advanced sensory technology of the Xiaomi CyberDog 2. With 19 sensors, including vision and distance measuring cameras, this cyber pet offers impressive face recognition, object avoidance, and mapping capabilities.

28 Jun

End Market Demand for Advanced Packaging

In our latest spotlight series, we delve into the technology advancements that are revolutionizing the datacenter industry.

27 Jun

Evolution of Standard Cell Libraries: Advancements and Innovations

Standard cell libraries are indispensable in modern semiconductor design, providing foundational blocks of Boolean logic functions essential for chip implementation.

27 Jun

Teardown of the Vivo X Fold3 Pro Foldable Smartphone

Join TechInsights as we teardown the Vivo X Fold3 Pro, featuring the Qualcomm Snapdragon 8 Gen 3 processor, 16 GB of RAM, and a cutting-edge camera system. Discover detailed insights into its design, battery technology, and unique features.

26 Jun

Renesas RoX Development Platform for R-Car Processors

Renesas launched its R-Car Open Access (RoX) development platform for software-defined vehicles (SDVs). Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the aim is to speed development, reduce complexity, lower cost, and optimize deployments of next-generation vehicles.

25 Jun

6.18 Online Festival in China: Smartphone Sales Down 2% Annually

The 2024 6.18 Online Festival in China revealed a nuanced picture of smartphone sales. Despite a 2% decline in unit sales, stable market value was maintained thanks to higher average selling prices amid a broader 3% drop in overall online sales.

25 Jun

Teardown Unboxing: Exploring the Vivo X Fold3 Pro

Explore the innovative design and advanced features of the Vivo X Fold3 Pro, the thinnest foldable smartphone on the market. Learn about its durable carbon fiber hinge, Vivo Armor architecture, and premium aesthetics in our detailed Teardown and analysis.

24 Jun

Apple Vision Pro: Exploring the Design and Sustainability of Its Innovative Battery Pack

In 2024, Apple launched its groundbreaking AR/VR system, the Apple Vision Pro, featuring a notable departure from conventional designs with its external battery pack.

24 Jun

Global Smartphone Installed Base Forecast by Operating Systems for 88 Countries: 2007 to 2029

TechInsights smartphone research team predicts global smartphone installed base will grow 2% YoY in 2024 and 2025. The growth rate will be modestly improved from 2026 through 2029 driven by technology innovations and the penetration of on-device AI smartphones. Android and Apple are expected to retain market leadership with shares of 82% and 16% in 2024, respectively.

21 Jun

Intel FIVR gets a new inductor

Explore Intel's latest Coaxial Magnetic Integrated Inductor (Coax MIL) technology, enhancing voltage regulation in high-performance processors like Sapphire Rapids. Discover its impact on Intel's shift from on-motherboard to fully integrated voltage regulation and future developments in processor architecture.

19 Jun

Apple A17 Pro SoC Small CPU Design Analysis

Dig into this analysis of the standard cells comprising 70% of a target logic area in the the Apple A17 Pro CPU2 core, fabricated using FINFLEX methodology by TSMC in N3B process node. Standard cells schematics are extracted to determine routing efficiency, gate density, and global metal usage survey.

19 Jun

Towering Memory: HBM and Verticality

Discover how the AI arms race is driving advancements in high bandwidth memory (HBM) technology, with AMD, NVIDIA, Google, and Meta pushing the limits of DRAM stacking. Learn about JEDEC's updates, hybrid bonding innovations, and their impact on data center performance.

19 Jun

Automotive Market Outlook Report

Automotive Market Outlook Report Automotive Semiconductor Forecast and Vendor Share Discover the latest Automotive Market Outlook Report, analyzing Q1 2024 trends and challenges in the automotive semiconductor landscape. Amid geopolitical tensions

18 Jun

网络研讨会: 2024年是AI PC之年：炒作还是现实？

近年来，全球PC市场经历了一段动荡时期，COVID 强制封锁导致 2020 年和 2021 年PC需求激增，但随后两年又出现大幅下滑。

18 Jun

Navigating the Semiconductor Landscape: Trends, Investments, and Future Outlook (eBook)

Delve into market trends, regional dynamics, and future projections in the semiconductor industry. Discover insights from industry leaders and analysts on key topics like lithography advancements, the rise of Chinese manufacturers, and global investment strategies.

17 Jun

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17 Jun

Introducing TSMC N3E: The Power Behind Apple's M4 SoC

In a recent teardown of the Apple iPad Pro 11-inch, TechInsights revealed details of Apple's latest silicon: the Apple M4 SoC, codenamed TMRV93, built on TSMC's advanced N3E process. This surprise release demonstrates Apple's agility in adopting cutting-edge semiconductor technologies ahead of schedule.

14 Jun

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13 Jun

Insight: Understanding the Impact of EV Demand on the Automotive Semiconductor Market

Electric vehicles (EVs) have significantly higher semiconductor content than traditional gasoline or diesel models. This analysis looks at five different scenarios for vehicle powertrain demand in 2030 and examines what the impact on the automotive semiconductor market will be.

12 Jun

Tracker: Global 5G mmWave Smartphone Shipments Forecast by Vendor by Quarter to 2025

We expect the United Stated (US) and Japan to remain main advocates for mmWave in smartphone use. Apple and Samsung are the biggest mmWave device vendors owing to their share from the US market. This report forecasts global 5G mmWave shipments by 28 vendors by quarter from 2018 through 2025.

12 Jun

2xx-Layer Products from Samsung, SK hynix, Micron, and YMTC

Explore the latest advancements in 3D NAND technology with our comparison of multi-layer products from Samsung, SK hynix, Micron, and YMTC. Understand how Vertical Cell Efficiency (VCE) impacts performance and discover which manufacturers lead in this crucial metric.

11 Jun

Q1 2024 Google: Geographical Expansion and New Product Line-up Expected

Google Pixel smartphone shipments grew by 35.3% YoY in Q1 2024, reaching 2.3 million units. Consequently, Google outperformed the broader smartphone market, which saw YoY growth of only 9.7%.

11 Jun

Global Bluetooth Tracker Device Sales Forecast through 2029

03 Jun

Insight: The Notebook PC Market is Expected to Grow 7% in 2024

The COVID era, which defined the years between 2020 and 2023, had a significant impact on the notebook PC market which will continue to resonate through the end of the forecast period of 2029.

03 Jun

India Smartphone Market Share by Channel by Vendor: Q1 2024

21 May

Infineon BTS7008 Automotive Smart High-Side Power Switch PMIC Essentials

Within the (PROtected FET) PROFETTM+2 12 V family, Infineon's BTS7008-2EPA is examined alongside the utilization of Infineon’s SMART7 high-side switches technology.

Sony claims that the Sony PlayStation Portal CFI-Y1016 has a 4300 mAh battery which can last between seven to nine hours during active use. Compared to the Valve Steam Deck 1010, Valve claims that their device with a 5200 mAh battery can last up to eight hours during active use. Both compared devices use 60 Hz TFT displays.

17 May

Deep Dive Teardown of the Quectel FGH100M Wireless Module

The FGH100M comes in a compact Land Grid Array (LGA) package measuring 13.0 x 13.0 mm, ensuring easy integration into a variety of IoT devices. It has a one pin for connecting a WiFi antenna, allowing for simple antenna connection.

17 May

New iPad Pro Models: One M4 to Rule them All

Discover the latest iPad Pro models - TechInsights dissects the internals of two variants, comparing processors to discern if they share the same M4 chip or if differences lie beneath the surface.

16 May

VALUE SHARE: Global Smartphone Revenue, ASP and Profit by Vendor by Price Tier: Q1 2024

Global smartphone industry wholesale revenue grew 1% YoY thanks to the higher smartphone shipments which increased 10% YoY in Q1 2024, while smartphone shipment ASP went down 8% YoY. Apple maintained leadership but lost revenue share annually. Samsung followed with the improved revenue share from last year. Xiaomi gained revenue share and maintained the third position followed by Huawei.

16 May

Webinar: Made in China? A Deep Dive into the Huawei Pura 70 Ultra

Join TechInsights experts as we explore the impact of the ever-increasing Huawei smartphone range and its implication on the industry and the semiconductor sector.

16 May

The Best Semiconductor Equipment Suppliers of 2024

Explore the top semiconductor equipment suppliers of 2024 as honored by THE BEST Awards.

16 May

China Provides Several Updates to their NEV Policies

The China NEV Policy Update document lists several policies related to the development and regulation of the automotive and transportation sectors in China, with a focus on promoting electric vehicles (EVs), enhancing industry standards, and fostering innovation.

15 May

Huawei Pura 70 Pro Has More Made-in-China Image Sensors than Pura 70 Ultra

This report provides a look into Huawei Pura 70 Pro image sensors. Out of four image sensors, three are Omnivision’s and two of them are made-in-China.

Biweekly update of the Component Price Landscape.

15 May

Qualcomm to breathe life into the PC industry?

Qualcomm’s Snapdragon X family is the most promising attempt to break the PC x86 monopoly and ignite new competition in the market. The Snapdragon X Elite is a mighty piece of silicon, and our hands-on experience and company benchmarks tend to confirm this impression. Qualcomm is reinvesting in the PC market with great ambitions and preparation. Will this be a revolution or just the beginning of a transition?

The Iridium Satellite LLC 9603N is an IoT Module that supports two-way satellite communication connectivity. The Iridium 9603 delivers Iridium Short Burst Data in an extremely small form factor. Iridium Short Burst Data (SBD) - simple, efficient packet-based service for frequent short data transmissions between equipment and centralized host computer systems.

13 May

TechInsights’ Storage Team Takes You Inside the Huawei Pura 70 Ultra Smartphone

TechInsights' teardown of the Huawei Pura 70 Ultra reveals the intricate details of this cutting-edge smartphone. Powered by the Kirin 9010 chipset, this device boasts impressive performance capabilities. Our analysis delves deep into the Kirin 9010, assessing its fabrication process and comparing its efficiency and performance to previous models.

This report presents key DC electrical characteristics for logic NMOS and PMOS transistors located in the CPU1 region of the MediaTek AHJ11236C die found inside the MediaTek MT6989W Dimensity 9300 application processor.

09 May

Appendices – Automotive Electronics System Demand Forecast 2022 to 2031

This market forecast highlights the impact that vehicle architecture change and electrification are having on automotive electronics system demand. Key changes in this update include a substantial upgrade to the forecast model for new vehicle architectures, with High Performance Compute Platforms now included. This update also sees a slowing in the predicted growth for battery electric vehicles.

This report contains highlights from the full data file. A sampling of Integrated Device Manufacturers (IDMs) and foundries important to the automotive industry shows wafer capacity expanded by 9% on average in 2023 after large capital expenditures for fabs since 2020.

08 May

Tracker: Global Wearables Revenue and ASP by Vendor 2023 Q4

Global wearable revenues fell by 4% in Q4 2023 as macroeconomic weakness and geopolitical uncertainty caused lengthening replacement cycles and shrinking volumes for both smartwatches and fitness bands.

The Qualcomm QTM565 antenna in package (AiP) is a 5th generation 5G mmWave antenna solution for mobile handsets. It features simultaneous transmit/receive front-end die and power management functions. The physical packaging of the QTM565 is similar to its predecessor the QTM545, with a central printed wiring board (PWB) hosting the dies and the antenna elements comprising separate laminate blocks.

Global 5G handset industry revenues and shipments grew double digits in Q4 2023. Apple remains the leader of 5G shipments and revenues, but Samsung is growing behind Apple. Samsung is the world’s second-largest 5G vendor in terms of shipments and revenues.

30 Apr

Autonomous Vehicle Carmaker Announcements

This database covers all the major carmaker announcements in regards to autonomous vehicles, for both semi- and fully autonomous technologies. Comments are embedded in the "Release Date" column to give further details, e.g., "End of 2024". In this update, TechInsights has included announcements and releases of different ADAS and automated driving platforms by SAE Levels of automation from automakers and Tier 1 developers worldwide.

Both smartphones also have the same battery charging design with the only exception that Xiaomi 14 Pro has Wireless charging capabilities. It is also similar to the Xiaomi Redmi Note 13 Pro’s design with a difference in which main SoC (SC8551A) was used.

29 Apr

Deep Dive Teardown of the Fitbit Charge 6 G3MP5 Activity Tracker

The Fitbit Charge 6 G3MP5 is the latest activity tracker from Fitbit Inc. and an improved successor to the Fitbit Charge 5 FB421. The Charge 6 has a 1.04” OLED Display. In both devices, the Display/Touchscreen Subsystem is made by Truly Opto-electronics and has the same part number. The Display Panel and touchscreen Module are separated in this subsystem.

29 Apr

Exploring Tesla's Full Self-Driving

Embark on a journey with TechInsights as we explore the world of Tesla's advanced Full Self-Driving (FSD) driving capabilities.

29 Apr

Unlocking Insights: SoC Design Analysis Q1 2024 Briefing

This briefing features key innovations in the latest new technologies: TSMC 3 nm and Intel 4 nm, and the disruptive SMIC 7 nm N+2, through the lens of digital gates and standard cell libraries. Discover our latest benchmarking on scaling and transistor density metrics of leading flagship SoCs like the Apple A17, HiSilicon Kirin 9010, and MediaTek Dimensity 9200.

29 Apr

Samsung K9DYGY8J5B-CCK0 236L 1Tb 3D NAND Internal Waveform Analysis

The Samsung 1 Tb 236L triple-level-cell (TLC) 3D NAND flash memory device (die markings: K9AKGD8J0B) is one of 16 dies packaged inside one Samsung K9DYGY8J5B-CCK0 NAND flash memory package, which was found in the MZ-V9P4T0 990 Pro PCIe 4.0 NVMe M.2 4 TB solid state drive (SSD).

Global smartphone sales declined in 2023. Growth going forward is slow as geopolitical and economic turbulence keeps growth moderate. Asia Pacific will remain by far the world's largest region for 5G smartphone sales.

24 Apr

Forecast: Global 5G Smartphone Installed Base for 88 Countries to 2029

TechInsights estimates that global demand for 5G smartphones is growing and installed base with it. Asia Pacific was the largest region with nearly two thirds share of the installed base in 2023.

24 Apr

Deep Dive Teardown of the Apple Vision Pro A2117 AR Headset

Global fitness band industry revenues plummeted by 44% in Q4 2023. This marks the fifteenth consecutive quarter of year-over-year (YoY) fitness band revenue declines amid macroeconomic weakness and geopolitical uncertainty.

24 Apr

Global Smartphone Wholesale Revenue: 5-Year Growth Projection

In 2023, global smartphone sell-through wholesale ASP hit a historic high, signaling robust revenue growth potential until 2029, as outlined in TechInsights' "Smartphone Revenues and ASP Forecasts by 88 Countries" report.

5G is the biggest technology followed by 4G (LTE). LTE (4G) sales continue to decline as a result of growing interest in 5G devices. LTE still grows in Middle East and Africa region. 3G is in sunset in most of the regions except Middle East and Africa that still has strong 2G/2.5G sales also.

23 Apr

Forecast: Global Handset Sales by 88 Countries and 19 Technologies up to 2029

5G is the biggest technology followed by 4G (LTE). LTE (4G) sales continue to decline as a result of growing interest in 5G devices. LTE still grows in Middle East and Africa region. 3G is in sunset in most of the regions except Middle East and Africa that still has strong 2G/2.5G sales also.

The onsemi AR0341AT CMOS image sensor (CIS) was extracted from the onsemi ONS-AR0341ATSC15XUEA0-DPBR-E part. The onsemi AR034AT is a Bayer color, 2.1 μm, stacked back-illuminated (BI) electronic rolling shutter Hyperlux 2nd Generation Super-Exposure Pixel Technology CIS for automotive applications.

22 Apr

Notebook PC Market Surges: 7% Growth Signals Strong Start to 2024

The first quarter of 2024 witnessed a resilient performance in the notebook PC market, with shipments growing compared to the same period last year.

22 Apr

Touching New Heights: The Booming Smartphone Fingerprint Sensor Market of 2023

In 2023, the Smartphone Fingerprint Sensor market saw a notable 4% annual unit growth, driven by a surge in adoption of Fingerprint-On-Display (FoD) and Capacitive sensor products.

22 Apr

A Tale of Three Phone Chips: Eco Edition

TechInsights discovered a 20% gap in carbon emissions from manufacturing the semiconductors of three flagship phones, despite smartphones being typically evaluated based on screen size, processor speed, and camera resolution.

Smart speakers and smart displays provide smart homes with a convenient and intelligent interface through which to control and manage their smart home needs, spanning entertainment, information, and automation.

19 Apr

Global Fitness Band Sales Forecast for 88 Countries: 2012 to 2029

We expect global fitness band sales to decrease by 8.1% to 16.4 million units in 2024 and further by 3.7% to 15.8 million units in 2025. Following this period of substantial decline is relative stabilization from 2027 (0.6% decline) through 2029 (0.7% decline) globally.

19 Apr

Huawei Pura 70

Discover the inner workings of the Huawei Pura 70 with TechInsights' comprehensive teardown analysis. From processor comparisons to satellite implementation strategies, take a deep dive into the latest tech revelations.

18 Apr

Deep Dive Teardown of the Eero Max 7 V010001 Router

The Eero Max 7 is based on Qualcomm’s WiFi SoC, supporting WiFi 7. The device was equipped with eight antennas, it features both 5 and 6 GHz WiFi 7 with 4x4 MIMO connectivity. Two antennas support 2.4 GHz WiFi 6 and another one for Zigbee, Thread, and Bluetooth LE 5.0.

18 Apr

Deep Dive Teardown of the Samsung Galaxy SM-S921U1 Smartphone

Qualcomm has the most design wins for the Samsung Galaxy S24 SM-S921U1, supplying 20 of the 43 major designs. The Samsung Galaxy S24 SM-S921U1 comes equipped with advanced connectivity features including WiFi 7, Bluetooth 5.3, GPS support for L1 and L5, 5G mmWave technology, NFC, and wireless charging capability.

The Samsung S5M5820A01 die analyzed in this basic floorplan analysis (BFR) report was found inside the Samsung S5820 component. The S5820 component was extracted from the Samsung Galaxy S24+ smartphone.

In March 2023, Tesla CEO Elon Musk said that the electric vehicle maker will use 75% less silicon carbide (SiC) without compromising the performance or efficiency of its models. TechInsights’ Stephen Russell gave predictions on how chip designs could enable this. But at the 2024 Automotive Tech Forum, vendors such as Infineon and STMicroelectronics, presented the answer: The hybrid power electronics module that uses both silicon and SiC devices.

15 Apr

3D NAND – Speed boost between NAND to SSD Controller

As the memory capacity of NAND packages increases with increased stacking of dies, issues such as large capacitive loading, input/output (I/O) speed reduction, and increased power consumption limit the packages from achieving the desired I/O speed, even when paired with a suitable SSD controller. This featured content report explores some recent NAND to SSD controller techniques.

15 Apr

Cockpit Innovations: Streaming, Gaming, Audio and Apps

TechInsights' report on cockpit innovations examines developments of in-car infotainment in audio streaming, video, and gaming, examining announced OEM partnerships, data and content service providers, and trends in displays.

15 Apr

Will there be an Apple M3 Ultra?

Dive deep into the absence of high-density interconnect pads in the M3 Max and its implications for the highly anticipated Apple M3 Ultra.

15 Apr

Research Bulletin – TSMC Climbs to #1, NVIDIA Posts Triple-Digit Growth in Final 2023 Ranking of Top 25 Semi Suppliers

Final calendar year 2023 ranking of the top 25 semiconductor suppliers are presented. No new suppliers broke into the top 25 list in 2023, but there were significant changes in where companies were ranked.

15 Apr

Apple A17 Pro SoC GPU Design Analysis

This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro 3 nm GPU, fabricated using FINFLEX methodology by TSMC. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.

15 Apr

Intel Must Undercut Its Competitors to Win AI Share

At Intel Vision, the company launched a new version of its AI ASIC Gaudi, and a new version of Xeon. The company is in the midst of a strategic shift, moving from a shipper of components to a holistic silicon, software, and engineering firm with generative AI at its very heart. But this isn’t a quick shift and the company appreciates it’ll take time to rekindle its spark. To take on NVIDIA, it has to slash prices to gain traction.

The Toshiba TH58LKT2V46BA8S TLC 3D NAND flash is a 154-ball grid array (BGA), multi-chip package (MCP), measuring 13.5 mm × 11.5 mm × 0.9 mm thick, including solder balls. The TH58LKT2V46BA8S contains eight stacked KIOXIA 162-layer FXZ5 512G dies, arranged in two side by side four die stacks. Bond wires connect the two die stacks to the two wider sides of the printed wiring board (PWB).

11 Apr

Deep Dive Teardown of the Samsung Galaxy S24+ SM-S926NZVEKOO Smartphone

The Samsung Galaxy S24+ is one of Samsung’s flagship S series phones launched at the Galaxy Unpacked event on February 17, 2024. The SM-S926N model is targeted at the Korean market. In the Samsung Galaxy S24+ SM-S926N phone, Samsung provided 15 out of 42 packages in design wins.

11 Apr

Unlocking Tomorrow's Semiconductor Secrets

Unlock the secrets of tomorrow's semiconductor industry with our exclusive fireside eBook featuring G. Dan Hutcheson. Gain invaluable insights into emerging trends, global dynamics, and the transformative impact of technologies like AI.

10 Apr

The Inner Workings: Analyzing Lithium-ion Coin Batteries in AirPods Pro 2 and Huawei Watch Buds

The Inner Workings: Analyzing Lithium-ion Coin Batteries in AirPods Pro 2 and Huawei Watch Buds Uncover the secrets behind the lithium-ion batteries in Apple AirPods Pro (Gen. 2) and Huawei Watch Buds. Learn how cathode composition influences energy

10 Apr

Trackers: TV & Video Services

These quarterly reports provide subscriber, revenue, and market share data for subscription video-on-demand (SVOD) services, pay TV operators, online advertisers, video services, gaming services, and music services by vendor.

09 Apr

Report Overview: Wi-Fi 7 Comes to the Automotive Industry

The unveiling of the Wi-Fi 7 certification marks a notable change in automotive connectivity norms. This overview provides insight into the contents of TechInsights' comprehensive report, "Wi-Fi 7 Comes to the Automotive Industry."

09 Apr

India: Automotive Infotainment and Connected Services 2024 Update

Automakers are consistently incorporating additional connectivity, safety, security, and entertainment features to gain a competitive edge and sell more cars. In the pursuit of expanding their market share, connectivity is anticipated to play a role, as more models currently available in the market are equipped with embedded cellular connectivity, particularly top-end models.

09 Apr

Report Overview: Executive Summary Telecom Predictions for 2024

This report is an overview of what is included within TechInsights Executive Summary – Telecom Predictions for 2024 full report. Telecom operators must make important decisions in 2024 amid transformative waves and emerging challenges.

09 Apr

Transsion Group Tops Middle East & Africa Smartphone Market in Q4 2023

Transsion Group Tops Middle East & Africa Smartphone Market in Q4 2023 Discover the latest insights into the Middle East and Africa smartphone market in Q4 2023. Transsion Group emerges as the dominant player, driving significant growth with its

09 Apr

Automotive Market Outlook Report

Gain the foresight needed to anticipate and adapt to changes in the automotive semiconductor landscape with valuable insights into market projections, emerging technologies, and key drivers.

08 Apr

Unlocking Tomorrow's Semiconductor Secrets

Get ready for an exclusive Fireside Chat with industry expert G. Dan Hutcheson. Explore the latest in semiconductor trends, geopolitics, China's tech advancements, and the impact of AI in 2024.

Global handset shipments grew by 4.9% annually in Q4 2023. The "Sixty" countries tracked in this report accounted for 90% of the handset volumes in the quarter. Apple, Samsung and Xiaomi were the top three vendors by consolidated shipments to these markets.

05 Apr

Q1 2024 DRAM Market Report

This quarterly report provides a comprehensive analysis of the DRAM market, covering key aspects such as supply and demand dynamics across various segments including PC, datacenter, mobile, automotive, and more.

05 Apr

Unlocking the Potential: Qualcomm's Showcase of Windows on Arm

At an exclusive event in New York, they showcased the impressive performance of their Snapdragon X Elite processor, surpassing rivals Apple M3 and Intel Core Ultra in both total compute power and energy efficiency.

05 Apr

Taiwan Earthquake Expected to Have a Short-Term Impact

In the wake of Taiwan's recent earthquake, the semiconductor industry stands resilient, with only short-term disruptions anticipated. Our thoughts are with those affected by this natural disaster, which has garnered attention as the most intense earthquake in Taiwan over the past 25 years.

04 Apr

4Q 2023 Apple A-Series M-Series Processor Market Tracker

Apple's A-series and M-series applications processors (AP) revenue increased 4 percent year-on-year in Q4 2023 and a collective 8 percent year-on-year in 2023. Apple's A-series APs are used in iPhone, iPad, Apple TV, iPod Touch and HomePod while the M-series APs are used in iPad, MacBook, Macs and the Vision Pro devices. This report provides estimates of Apple's A-series and M-series shipments, revenues and ASPs by chip model from Q1 2010 to Q3 2024.

04 Apr

Deep Dive Teardown of the Samsung Galaxy S24 Ultra SM-S928U1 Smartphone

The Samsung S24 Ultra is powered by the Snapdragon 8 Gen 3, which is faster than the Snapdragon 8 Gen 2 found in the S23 Ultra. The S24 Ultra introduces a flat display, moving away from the curved edges of the S23 Ultra. It also uses a more durable Gorilla Glass Armor for protection.

04 Apr

Taiwan Earthquake and the Semiconductor Industry

Discover the aftermath of the Taiwan earthquake on the semiconductor industry and global supply chains. Learn how major players like TSMC are navigating disruptions while prioritizing safety.

03 Apr

Taiwan Earthquake: Billion-Dollar Data Center Fallout

A recent earthquake in Taiwan has disrupted industries, including the data center market, raising concerns about supply chain stability.

03 Apr

DRAM Scaling and Maximum Memory Capacity

Discover the latest advancements from industry leaders Micron, Samsung, and SK hynix, and gain insights into the future of technology.

03 Apr

2023 Automotive Semiconductor Vendor Share: STMicroelectronics Closing in on NXP and Infineon

The automotive semiconductor landscape in 2023 showcased Infineon and NXP retaining their top positions, with Infineon widening its lead over NXP.

03 Apr

Automotive in-Car Commerce 2024 Update

In-car commerce (also commonly called in-vehicle payments) is one of these more recent features that OEMs have been deploying over the last several years. In-car commerce enables vehicle occupants to pay for fuel, charging, parking, and other services from the infotainment system’s display. As of early 2024, 14 automotive brands offer in-car payment features in 15 countries, with more deployments planned.

03 Apr

Huawei's Q4 2023 Resilience in China Market

Despite facing stiff competition from Apple in the mid- to premium-tier segments, Huawei's performance during China's 11.11 online shopping festival solidified its position as a top contender.

02 Apr

Automotive Semiconductor Vendor 2023 Market Shares Data

This datasheet presents TechInsights analysis of 2023 automotive sector revenues and market shares of the leading semiconductor vendors, with revenue splits by major component product category and by region including N. America, Europe, Japan, China, South Korea and ROW. It also includes market shares and revenue splits for previous years extending back to 2010.

02 Apr

Sony IR Eye Tracking 1.8MP Camera from Apple Vision Pro Package Analysis

The Apple Vision Pro augmented reality headset uses four inferred cameras to track its wearer’s eyes. This report catalogues the structure of those camera modules, how they fit into the headset, and provides an overview of the Sony back-side illuminated CMOS image sensor that they house.

02 Apr

OmniVision OX03D4C 1/4" 3MP 2.1μm Pixel CMOS Image Sensor Device Essentials Plus

The OmniVision OX03D4C is a color, 3-megapixel (MP) resolution stacked back-illuminated (BI) CMOS image sensor (CIS) with a 1/4-inch optical format, LED flicker mitigation (LFM), and 140 dB high dynamic range (HDR) for automotive applications.

Global Fitness Band shipments plummeted by over 40% year-over-year (YoY) for the third consecutive quarter during Q4 2023. Slumping demand for the market leading Xiaomi Mi Band line as well as a market exit from Samsung, in addition to macroeconomic weakness, geopolitical uncertainty, and continued high inflation stifling consumer discretionary spending contributed to the downtick. Consumers are trending away from fitness bands and toward smart and feature watches.

27 Mar

Global Smartwatch OS Market Share by Region: Q4 2023

Global smartwatch shipments declined for the fifth consecutive quarter during Q4 2023, after Q4 2022 marked the first year-over-year (YoY) decline since 2016 as the smartwatch space begins to mature and consumers reign in discretionary spending causing a lengthening replacement cycle amid macroeconomic weakness.

27 Mar

North American 5G Smartphones Country Forecast to Q4 2025

5G smartphone shipments in North America in Q4 2023 accounted for over nine in ten of total smartphone shipments in the region. The US accounted for more than nine in ten of all 5G smartphones shipped in the region in the quarter. Apple was the leading 5G smartphone vendor and Samsung was the leading Android 5G smartphone vendor. This report tracks 5G smartphone shipments for the top vendors in the US by quarter from Q1 2019 and forecasts shipments through 2025. It is a valuable tool for all stakeholders who want to track the influential North American 5G market.

27 Mar

AI Notebook PC Forecast: 95% AI-Capable Shipments by 2029

AI-capable notebook PCs– defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) –will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.

27 Mar

Samsung Dominates Latin America's Smartphone Market: Q4 2023 Breakdown

In Q4 2023, Latin America's smartphone market experienced significant growth driven by economic improvements, festive occasions, and the introduction of new Apple iPhone models.

27 Mar

4Q 2023 Smartphone Apps Processor Market Tracker

The global smartphone applications processor (AP) market gained a healthy 17 percent year-on-year in unit growth during Q4 2023 with corresponding revenue increase of 14 percent. Smartphone market has shown renewed strength in the fourth quarter as OEMs and chipmakers looks toward growth after the 2022-2023 industry correction. This report tracks stand-alone and integrated smartphone applications processor unit shipments, revenue market share and ASPs for 18 chip vendors from Q1 2008 to Q4 2023.

27 Mar

France Handset Vendor Marketshare by Operator: Q4 2023

The French handset market in Q4 2023 remained flat by shipment basis. Apple captured the number one positions across all local carriers while Samsung stood at the number two positions. Xiaomi maintained the number three ranking while Oppo kept losing its momentum recently.

27 Mar

Forecasts: TV & Video Services

These reports provide TechInsights latest forecasts on connected TV advertising, subscription TV, and subscription video-on-demand (SVOD) by service. Our advertising forecast includes ad spend by linear TV, SVOD, free-ad-supported TV services (FAST), broadcaster VOD (BVOD), search, social, print, audio, cinema, and out-of-home (OOH). The SVOD forecast includes subscribers, revenues, and market share by service.

27 Mar

ANALYSIS: Global 5G and mmWave Smartphone Shipments Forecast by Region to 2025

The 5G honeymoon period is over. Global 5G smartphone shipment growth remained low in 2023 due to economic turbulence. Growth is stagnating due to Chinese softness, and geopolitical and economic turbulence. Apple leads vendors with an over one-fourth share of all 5G shipments globally, followed by Samsung and Xiaomi. By 2025 Apple’s lead will have shrunk as Samsung grows its shipments faster than the other leading vendors. 5G mmWave devices continue to exist mainly in the North American and Japanese markets.

26 Mar

NVIDIA's Blackwell Platform: Powering AI with Advanced Electronics

NVIDIA's unveiling of the Blackwell Platform at GTC 2024 has sparked industry-wide excitement, showcasing the company's prowess in AI computing.

26 Mar

Data-Center AI Chip Market – Q1 2024 Update

The data-center AI chip market expanded beyond anyone’s wild imagination in 2023. NVIDIA tripled its revenue and reached a two trillion dollar valuation in the stock market. The demand for GPUs continued to make headlines with supply being the constraint for the growth.

25 Mar

Global Smartwatch Vendor Market Share by Region: Q4 2023

Global smartwatch shipments declined for the fifth consecutive quarter during Q4 2023, after Q4 2022 marked the first YoY decline since 2016 as the smartwatch space begins to mature and consumers reign in discretionary spending causing a lengthening replacement cycle amid macroeconomic weakness.

As economic conditions improved in the second half of 2023, so too did tablet demand. However, with a product portfolio not updated since late 2022, low refresh demand for iPad held back a stronger recovery.

25 Mar

NVIDIA Goes All In on Generative AI

NVIDIA's latest unveilings represent a significant leap forward in technological innovation across various domains. The introduction of the Blackwell GPU, while lacking specific performance metrics, hints at enhanced capabilities, especially with its integration into the DRIVE THOR SoC.

22 Mar

Intel SRMZ1 Core Ultra 7 8PNRC (SoC Tile) TSMC 6nm FinFET Digital Floorplan Quick Look

The SRMZ1 is a 3D packaging assembly comprising a side-by-side arrangement of four dies, including system-on-chip (SoC) die with die makings 8PNRC, mounted on a common interposer placed on the package wiring board (PWB) employing Intel’s 3D Performance Hybrid Architecture packaging technology. SRMZ1 application processor was extracted from the Acer 14" Swift Go 14 multi-touch laptop.

22 Mar

Survey Plus Teardown of the Samsung S24 Ultra SM-S928B/DS

The Samsung Galaxy S24 Ultra comes with a custom version of Qualcomm's high-end chipset - Snapdragon 8 Gen 3. This phone has a 5,000mAh battery with support for 45W fast charging. The SIM card tray can handle two nano-SIM cards.

22 Mar

Data-Center AI Chip Market 2023 Year-End and Q4 2023 Update

This document summarizes quarterly update (Q4/23) from companies like DC AI Chips, Nvidia, Intel and AMD, and key yearly updates (2023) for the data center AI chip market.

This report presents an advanced floorplan analysis of the image signal processor (ISP) die from the Prophesee GenX320ES, 1/5″ format, 320 ×320 pixels resolution, 6.3 μm pixel pitch, stacked back-illuminated event-based Metavision® CMOS image sensor for embedded vision and power-sensitive applications.

22 Mar

Beken BK3296 22nm Bluetooth Audio SoC Process Analysis

This report provides an analysis of the structure and materials used in the manufacture of Beken BK3296 22nm Bluetooth Audio SoC manufactured in UMC's 22nm ULP process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.

21 Mar

3D NAND Technology Roadmap

Gain exclusive access to TechInsights' comprehensive 3D NAND Technology Roadmap, guiding you through the ever-evolving landscape of innovation.

21 Mar

Maximizing NAND Capacity per Wafer in 3D NAND Production

19 Mar

Consolidated Datacenter Forecast Q1 2024

The consolidated datacenter forecast aggregates data from multiple TechInsights specialists to produce a single view of the memory, processors, accelerators, and servers required to support the world's data centers over the next five years. The data are further broken down into hyperscaler and public cloud breakdowns.

19 Mar

Top 10 Smartphone Models

Explore the top 10 smartphone models unveiled at MWC 2024, ranging from sleek flagships to budget-friendly alternatives. Discover groundbreaking innovations and cutting-edge features that redefine the mobile experience.

Driven by the comeback in 5G segment and the eased supply constraints, in this quarter, Huawei’s smartphone shipments increased tremendously 84% YoY to 12.5 million units globally, most volumes coming from China market. Along with the rising ASP, Huawei’s wholesale revenue doubled year-over-year.

18 Mar

Deep Dive Teardown of the Dell XPS P91F Mobile Computer

The battery can be charged by using USB Type-C port with support of 130 W charging. A charger is included. The Dell XPS is equipped with a 60 Hz, 15.6” OLED Display with a resolution of 3456 x 2160. It features two WiFi antennas with an Intel module supporting the WiFi 6E. Both of those antennas support Bluetooth 5.3 connectivity.

5G mmWave is the fast high-frequency connectivity method that is part of the bigger 5G family. We expect the United Stated (US) and Japan to remain main advocates for mmWave in smartphone use. Apple and Samsung are the biggest mmWave device vendors owing to their share from the US market.

14 Mar

MWC Post Show Video 1: Insights from Mobile World Congress 2024

Join TechInsights MWC attending analysts as they reflect on some of the biggest surprises and takeaways from the event and discuss which of their pre-show predictions rang true.

13 Mar

Smartphone Display Panel Market Share Q4 2023: Strong Growth in OLED Panel Shipments

The global smartphone display panel market fell nearly 5% percent year-over-year in Q4 2023. The revenue declined on the back of weakening LCD market and fall in OLED panel ASPs due to intense competition in the period. Samsung Display secured top spot with over 55 percent revenue share followed by BOE Technology and LG Display.

13 Mar

LTE / LTE-Advanced Handset Vendor Shipments by Country: Q4 2023

LTE-Advanced handset market has continued to show a descending curve as more 5G smartphones are shipped to major countries recent quarters. 5G dynamics have substantially started to change 4G dynamics. In Q4 2023, India has become the biggest LTE-A handset market in the world for 14 quarters in a row, by volume.

13 Mar

DRAM Market Report Q1 2024

This quarterly report provides a comprehensive analysis of the DRAM market, covering key aspects such as supply and demand dynamics across various segments including PC, datacenter, mobile, automotive, and more. It meticulously maps the entire DRAM market landscape, offering insights into production volumes, pricing trends, technological advancements, and market shares.

13 Mar

Amazon's 30% Market Share: Smart Speaker Leadership in 2023

In the dynamic realm of smart technology, Amazon has maintained its pioneering position in smart speakers and displays since its inception in 2014.

12 Mar

Q4 2023: Lenovo-Motorola: Growth Among All Key Regions

Lenovo-Motorola’s global smartphone shipments grew 33% year-over-year (YoY) in Q4 2023 outperforming the global smartphone market driven by strong performance in its key markets US and Mexico, and strong triple digit annual growth in India.

12 Mar

USI 339M00227 Antenna-In-Package Packaging Analysis

This report presents a package analysis (PKG) on the USI 339M00227 mmWave AiP device. The 339M00227 AiP contains a radio frequency TX/RX transceiver die and an antenna array formed from the metallization layers of a printed wiring board (PWB).

11 Mar

Empowering 5G: Revolutionizing Mobile RF Design Challenges with Acoustic Wave Filters

5G requirements have driven a major shift in Mobile RF technologies and radio design. RFFE designers and engineers now need to contend with a plethora of challenges in radio design, ranging from supporting RF to tighter module integration with an increased number of components, one of which is RF filters.

08 Mar

Decoding the Oura Ring Gen 3: Unraveling the Mystery of Limited Mass Adoption

Our report takes a deep dive into the smart ring market, examining use cases, integration with healthcare systems, regulatory hurdles, user experience, teardown analysis, key current and future vendors, total market size and growth trajectory, as well as an in-depth look at the leading product in this space: the Oura Ring Gen 3.

08 Mar

MWC 2024: Key Takeaways for Mobile Semiconductor

The 2024 (MWC24) edition highlights the industry’s current interest areas and hot topics in a period when 5G is approaching mid-cycle deployment and growth. The topics which drew much of the attention this year in Barcelona were mobile generative artificial intelligence (AI), the emergence of 5G RedCap, and satellite NTNs.

08 Mar

MWC 2024: Telecoms Key Takeaways

This post-event report summarizes the top themes discussed at MWC 2024 (Mobile World Congress 2024) held from 26th Feb till 29th Feb in Barcelona. The report talks about AI the hottest topic this year at MWC across the entire telecom ecosystem and provides TechInsights' views on selected themes.

08 Mar

Tsingteng Micro THN31FWC1 NFC Controller Floorplan Analysis (IoTB)

This report describes a Basic Floorplan Analysis (BFR) of the Tsingteng Micro THN31FWC1 die found inside Tsingteng Micro THN31FWC1 component (a WLCSP). The THN31FWC1 was extracted from the 8849 TANK 3 smartphone.

08 Mar

Samsung K9YYGB8J1C-CCK0 176L QLC 3D NAND Memory Floorplan Analysis

This report presents a Memory Floorplan Analysis of the Samsung K93KGO8J0C 176L QLC 3D NAND found inside Samsung K9YYGB8J1C-CCK0. The K9YYGB8J1C-CCK0 was extracted from the Samsung T5 EVO MU-PH4T0S 4 TB Portable SSD drive.

07 Mar

Deep Dive Teardown of the Xiaomi 14 Pro 23116PN5BC Smartphone

The 32 MP front camera on the Xiaomi 14 Pro 23116PN5BC uses an OmniVision image sensor. Three back cameras are also included. The primary 50 MP wide-angle has an integrated OIS, an AF module, and an OmniVision image sensor. The 50 MP telephoto camera has an integrated OIS and AF module and uses a Samsung image sensor.

07 Mar

Intel Core Ultra 7 155H SRMZ1 Meteor Lake CPU Die Intel 4 FinFET Process Digital Floorplan Analysis

This report presents a Digital Floorplan Analysis of the CPU die (die 1) found inside Intel SRMZ1 (Meteor Lake) component extracted from the Acer 14" Swift Go 14 Multi-Touch Laptop. Meteor Lake processors, the first generation of Intel Core Ultra processors, were launched December 14, 2023. It comprises 16 CPU cores: 6 performance cores (P-cores), 8 efficient cores (E-cores), and 2 low power efficient cores (LP E-cores).

07 Mar

MWC 2024: Key Takeaways for Personal Computing

This report summarizes major personal computing related announcements at Mobile World Congress 2024. Companies mentioned include Qualcomm, Intel, AMD, Arm, Lenovo, Dell, Samsung and Acer. Topics covered include AI, generative AI and sustainability.

07 Mar

Wi-Fi 7 Comes to the Automotive Industry

With the launch of the official certification for Wi-Fi 7, semiconductor companies, for example MediaTek and Qualcomm, have already launched automotive-specific connectivity products that support this new standard. This report discusses Wi-Fi 7, provides TechInsights’ forecasts for automotive Wi-Fi feature adoption, a summary of the new standard’s features and how it compares to previous generations of Wi-Fi.

A comprehensive guide to the ever-changing NAND market, updated every quarter. This analysis covers supplier production trends, market shares, shipment volumes, revenue, and pricing forecasts. It examines the technological and manufacturing innovations influencing the industry and identifies the key developments driving market demand.

06 Mar

Samsung Leads Pro AI Generative Smartphone Revolution

Discover the latest insights on Samsung's leadership in the Pro AI smartphone revolution. Log in now to access the full report and stay informed about the future of mobile technology.

06 Mar

OECD Fixed Broadband Price Benchmarking Q4 2023

The Q4 2023 update of the OECD Fixed Broadband Price Benchmarking service is now available for download and includes over 1,500 fixed broadband tariff plans from more than 120 providers across 38 OECD countries.

06 Mar

Deep Dive Teardown of the Ring A19 Smart LED Bulb SAT1S3 Smart Bulb

Supplied by Nordic Semiconductor’s ANT/BT LE SoC #nRF52832, the Ring A19 Smart LED Bulb supports connectivity protocols such as BT 5.3, BT 2 Mpbs, BT Mesh and does not support Matter Connectivity Protocol, BT Long Range, BT Direction Finding, BT LE Audio or Thread, and Zigbee.

06 Mar

SK hynix H56G42AS8D-X014 8Gb GDDR6 DRAM D1y nm Advanced Memory Essentials

This is the first TechInsights identified DRAM product that has applied a high-k dielectric on periphery transistors in SK Hynix DRAM. This report presents an advanced memory essentials (AME) of the SK Hynix H56G42AS8D-X014 (H56G32CS Die) 8 Gb GDDR6 DRAM D1y nm.

05 Mar

Trackers: Connected TV Devices

These quarterly reports provide timely, tactical shipment, installed base and market share data for connected TV devices overall as well as smart TVs, streaming media players, and game consoles by vendor and TV operating system (TV OS). In addition to global tracking the following regions/countries are covered: North America, Central and Latin America, Western Europe, Central and Eastern Europe, Middle East and Africa, Asia Pacific.

05 Mar

Japan: Smartphone Shipments & Marketshare by Model: Q4 2023

Japan is the world's fourth largest smartphone market by value. It delivers high revenues to device makers, component suppliers, and operators. Our extensive report shows the top-50 best-selling smartphone models in Japan in the fourth quarter of 2023. Besides popular Apple, Google, Sharp, and Sony flagships, which brands and models have made their way into the bestsellers list, and what is the secret behind their success?

05 Mar

RF Industry Review Q4 2023: Financials

With an uptick in mobile phone shipments in Q4, sales increased an average of 5.4% for radio component suppliers reporting results. Despite this, median profitability as defined by net income divided by sales decreased slightly from 10% to 8% sequentially for the companies in our sample.

05 Mar

Consumer Electronics Trends

Dive into consumer electronics trends and expert insights on AI, gaming, smart home tech, and more. Download now and stay ahead of the curve.

04 Mar

Telecom Trends

Unlock the future of telecom with the 2024 Telecom Trends report. Explore 11 key industry shifts, from 5G Advanced to AI integration, offering opportunities and strategies for success.

01 Mar

Toshiba TH58LKT3V46BA8S (KIOXIA/Western Digital Corp. FXZ0_1T die) 162-Layer 3D NAND Flash Memory Advanced Memory Essentials

This is an Advanced Memory Essentials (AME) summary document of the Toshiba TH58LKT3V46BA8S (KIOXIA/Western Digital Corporation FXZ0_1T die). This sixth-generation 3D flash memory based on the bit cost scalable flash technology (BiCS6) features advanced architecture beyond conventional eight-stagger memory hole array.

01 Mar

Survey Plus Teardown of the Samsung Galaxy A25 5G SM-A256E/DSN Smartphone

The Samsung Galaxy A25 5G is a device from the Galaxy A series which is a line of mid-range smartphones. It has a 6.5" Super AMOLED display with a resolution of 1080 x 2340 pixels and a 120 Hz refresh rate.

01 Mar

Deep Dive Teardown of the Huawei MDC Pro 610 ADAS Controller 3600080-EP50 Automotive

The Huawei MDC Pro 610 ADAS Controller is a smart driving domain controller capable of processing environmental information collected by sensors. It performs fusion, identification, and classification tasks. Additionally, it handles map positioning for path planning and driving decision-making, enabling precise control of the vehicle and autonomous driving.

01 Mar

Global Internet Device Installed Base Forecast 2018–2028: A Summary

In 2023 Smart Home devices overtook Smartphones to become the second largest Internet connected device domain after Internet of Things (IoT). This report complements and discusses the recently published Global Connected and IoT device Installed Base forecast report covering the entire universe of Internet connected products including Smartphones, Mobile PC and Tablets, Smart TVs, Game Consoles, Digital Media Streamers, Wireless Speakers, and more.

01 Mar

Basic Floorplan Analysis (BFR) of the Silicon Labs EFR53000A0 Die

This report contains detailed information on the Silicon Labs EFR53000A0 die including selected teardown photographs, measurements of vertical and horizontal dimensions of major microstructural features, and cost of die and tested packaged die.

The Oppo Reno 11 5G PJH110 is one of the latest Oppo smartphones. This device is one of the latest variants from the Oppo Reno line and a successor to the Oppo Reno 10. The 32 MP front camera on the Oppo Reno 11 5G PJH110 uses Sony’s IMX709 image sensor. Three back cameras are also included.

29 Feb

Unveiling the Future: Key Themes and Takeaways from MWC 2024

Mobile World Congress (MWC) 2024 in Barcelona showcased a myriad of innovations and industry trends, setting the stage for the future of technology. Let's dive into the highlights from each day of this year’s influential event.

In a turnaround from its continued net losses, the international ride hail and delivery operator’s aggressive focus on profitability paid off for the full year 2023, particularly in the fourth quarter.

27 Feb

Enterprise and IoT Trends

Unveil the future of telecom with our free download: Explore the 2024 Enterprise and IoT Trends paper, revealing key insights on emerging technologies, challenges, and opportunities shaping the industry.

This is an Advanced Packaging Quick Look (APQ) summary document comparing the Kirin 9000 and the Kirin 9006C processors, provided as a companion deliverable for APQ-2312-802 projects. In 2020, the US government enacted sanctions on Huawei and HiSilicon, constraining their access to manufacturers and markets outside of China.

23 Feb

Apple APL1201 M3 Application Processor TSMC 3nm FinFET HKMG CMOS Process Digital Floorplan Analysis

This report presents a Digital Floorplan Analysis (DFR) of the Apple TMRJ66 die found inside the Apple APL1201 system-in-package (SiP). The Apple APL1201 SiP was extracted from the Apple iMac M3 24-inch display desktop computer (A2874).

23 Feb

Service Provider Trends

Gain insights into the latest telecommunications trends with our Service Provider Trends Full Paper. Download now for strategies to stay ahead in this dynamic industry.

The telecommunications value chain is a complex ecosystem buzzing with innovation. Our premise is that this ecosystem is tightly coupled together, with operator direction and end-user requirements acting as powerful forces, weaving together the various players in this dynamic landscape. In 2024, the technology landscape continues to churn with transformative waves even as if faces some strong undercurrents.

20 Feb

VALUE SHARE: Global Smartphone Revenue, ASP and Profit by Vendor by Price Tier : Q4 2023

Global smartphone industry wholesale revenue grew 6% YoY thanks to the higher smartphone shipments which increased 7% YoY in Q4 2023, while smartphone shipment ASP marginally went down 1% YoY. Apple maintained leadership with the stabilized revenue share annually.

Samsung was the leader in foldable-display smartphone shipments in Q4 2023, followed by Huawei and Honor. Shipments grew YoY, but Samsung declined heavily. Huawei, Honor and Motorola increased share.

15 Feb

MWC Video Series Part 4: Mobile Computing Outlook

Join David Watkins and Eric Smith as they present their predictions for mobile computing at Mobile World Congress 2024 in Barcelona.

14 Feb

Solidigm 29F02P2BMCQLI 192L 1.33T QLC 3D NAND Flash Process Flow (Full) Analysis

This report provides a Synopsys 3D emulation analysis of the process flow and integration used in the manufacture of the Solidigm 192L QLC 3D NAND Flash technology. The emulation includes SPX output files that can be used as input into other Synopsys models.

14 Feb

Qualcomm SDR875

Unlock the power of mobile communication with Qualcomm's SDR875 transceiver in Samsung Galaxy S24 Ultra. Learn about its innovative features and impact in our preliminary analysis on the TechInsights Platform.

13 Feb

Deep Dive Teardown of the Bose 8 Speaker Amplifier from the 2022 Hyundai Tucson

The Bose Premium Series is a high-class audio system. This system is available in the Hyundai Tucson. The Bose Premium system is complete with eight high-performance speakers. Communication between the audio amplifier and the audio elements in the car takes place via one connector.

13 Feb

Global Connected and IoT Device Installed Base Forecast 2018–2028

A total of 32 billion IoT and connected devices were deployed worldwide by the end of 2023, and projected to grow by 8% annually to 46 billion IoT devices by the end of 2028. Enterprise IoT continues to account for half the volume albeit declining slowly in relative terms.

The Huawei Freebuds 3 Pro are wireless binaural stereo earphones. It supports wireless charging, up to 2 W. Battery of charging case has 510 mAhof capacity, and earbuds feature 55 mAh each.

09 Feb

Deep Dive Teardown of the TP-LINK Wireless Visual Cat Eye TL-DB635A Smart Doorbell

The TP-LINK Wireless Visual Cat Eye #TL-DB635A is a smart video home doorbell. Using WiFi connectivity, it is capable of streaming audio and video. The producer used a 180-degree field of view through the design of the lens that tilts down.

08 Feb

Inside Huawei's Technological Revolution

Discover the technological strides of Huawei with TechInsights in our deep dive. From the Mate 60 Pro to the Huawei Qingyun L540 laptop, explore groundbreaking devices and pivotal events shaping China's tech landscape.

08 Feb

Vendor Share: Global Handset Market by Technology: Q4 2023

Global annual handset shipments showed positive growth, the first in ten quarters, in Q4 2023. Global 5G smartphone shipments showed positive growth, while 4G LTE, 3G and 2G shrank. Apple captured the top spot in 5G while Samsung leads in overall global handset shipments.

07 Feb

RF Industry Review Q3 2023: Contracts, Products

Start-up funding and mergers and acquisitions (M&A) activity slowed during the quarter with higher interest rates and regulatory hurdles. A higher than usual proportion of announcements centered on new fab construction and new process technologies including very high frequency acoustic filters, 2 nm complementary metal-oxide-semiconductor (CMOS), and silicon carbide power. Wi-Fi 7, gallium nitride, and non-terrestrial networks were hot topics.

07 Feb

CES 2024: The User Experience of Generative AI Assistants

The user experience (UX) of digital assistants was a focus at CES 2024, where various OEMs and suppliers including Mercedes, BMW, Volkswagen, Cerence, TomTom, and Qualcomm presented generative artificial intelligence (AI) digital assistants.

The Apple Watch Series 9 features a system-in-package (SiP) module that contains a TSMC manufactured integrated fanout package-on-package (InFO-PoP). This configuration has been observed before, but in the S9 the InFO-PoP houses a PMIC die alongside the processor at the bottom of the PoP, in a first for Apple. Multiple second sourced PoP memory packages were documented during analysis.

05 Feb

Samsung Galaxy S24 Ultra Teardown

Explore the next frontier in mobile technology with Samsung's Galaxy S24 series. Unveiling a powerful blend of Qualcomm Snapdragon 8 Gen 3 and Exynos platforms (in select markets), these flagship smartphones redefine excellence. Immerse yourself in AI-driven features, enhanced displays, and an advanced 50 MP Periscope camera system. Elevate your mobile experience with the Galaxy S24 series - where innovation meets unparalleled performance.

Global Wholesale Handset industry revenues grew by 1% annually in Q3 2023. Apple. Samsung and Xiaomi were the top three vendors. Asia Pacific was the largest region both by value and volume in the quarter.

05 Feb

Deep Dive Teardown of the Huawei Watch 4 Pro MDS-AL00 Smartwatch

The main frame is made of titanium, which combines features such as high strength and durability with low weight. Titanium is safe for the skin. Cover Glass is made of sapphire glass, making it scratch-resistant. The manufacturer advertised that the Huawei Watch 4 Pro MDS-AL00has 5 ATM-rated resistance level under the ISO 22810:2010 standard.

05 Feb

TDK Solid-State Micro Battery

Explore the future of batteries with TechInsights as we dive deep into the revolutionary TDK battery, showcasing anode-free advancements and dissecting the material composition through SEM views.

02 Feb

Sony CXD5610 GNSS Receiver with GF 22FDX eMRAM Process Flow (Full) Analysis

This report provides a Synopsys 3D emulation analysis of the process flow and integration used in the manufacture of the Sony CXD5610 GNSS receiver based on GlobalFoundries 22FDK (22 nm FD-SOI) with embedded MRAM. The emulation includes SPX output files that can be used as input into other Synopsys models.

02 Feb

Leading TechInsights' Analysts Going to MWC 2024

Joining the lineup atMWC 2024, TechInsights' premier analysts in Consumer Electronics, Automotive, and Mobile are set to make their mark.

01 Feb

Mobile World Congress 2024: Gateway to Wireless Ecosystem Insights

Unlock the secrets of cutting-edge devices with TechInsights, home to the world's largest teardown library. We pride ourselves on offering unparalleled insights into the inner workings of the latest technology.

01 Feb

Automotive Infotainment Semiconductors Q1 2024 – OEM and Aftermarket Growth Drivers

TechInsights’ Automotive Infotainment & Telematics Q1 2024 Semiconductor Market Report provides a forecast outlook for OEM and aftermarket hardware and applications market from 2020 through 2030. The OEM market opportunity for Infotainment & Telematics chipset vendors increased by 13.8% year-over-year (YoY) in revenue terms in 2023 on the back of strong vehicle production growth of over 10% YoY. Growth in the OEM chipset opportunity in 2024 is expected to be just 6% as vehicle production growth falls to less than 1% YoY.

This report presents a power essentials analysis of the Infineon CYPD7271-68LQXQ that belongs to the CCG7DC family of highly integrated dual-port USB-C power delivery solutions with integrated buck-boost controllers. Near the logic region, two memory blocks, potentially ROM or SRAM, are identified. Additionally, an extra flash memory block is observed, utilizing Infineon's embedded nonvolatile memory technology.

31 Jan

Automotive Video Series Part 4: Post-Show Reflections - Unpacking CES 2024 for Automotive

Hear the analysts reflect on the accuracy of their predictions, their most surprising discoveries, and the implications of all the groundbreaking announcements for the upcoming year. 

31 Jan

Automotive Semiconductor Demand Forecast 2021 to 2030 - January 2024

This TechInsights data forecast provides the latest metrics identifying the size and growth rate of the future semiconductor demand totals across the Powertrain, Body, Chassis, Safety, and Driver Information application domains for the main light vehicle producing regions: North America, Japan, Europe, Russia, South Korea, China, India, Brazil, Thailand, and rest of the world.

30 Jan

Deep Dive Teardown of the Samsung Galaxy S23 FE SM-711B/DS Smartphone

Samsung has the most design wins for the Samsung Galaxy S23 FE with twelve major ICs. Samsung provided the Octa-Core Applications/Baseband Processor developed with 5 nm CMOS technology.

This report presents Key DC characteristics for NMOS and PMOS transistors located in the word line drivers and sense amplifiers regions of the GigaDeviceHUANGSHAN4G die found inside the GDP1BFLM DDR3L SDRAM component extracted from a MiliankeMLK-CA03FPGA development board.

29 Jan

eSIM/iSIM Smartphone Sales Forecast by Region to 2028

Global eSIM and iSIM smartphone sales volumes will grow by double-digit percentages YoY in 2023. Propelled by North America today and by India and eventually China in later years, eSIM/iSIM-enabled smartphones will reduce friction for smartphone customers looking to enable their devices.

Apple's A-series and M-series applications processors (AP) revenue increased 7 percent year-on-year in Q3 2023 due to favorable mix shift towards premium chips.

TechInsights for Product Manufacturer - Mobile Devices Leverage unrivaled technical insights about the continuous cycle of innovation in the semiconductor market to benchmark chip design against competitors. Platform Member? Sign In Start your free

16 Jan

Solidigm 29F02P2BMCQLI 192L 1.33Tb QLC 3D NAND Flash Process Flow Analysis

This report provides an analysis of the process flow and integration used in the manufacture of Solidigm 192L QLC 3D NAND Flash.

16 Jan

Qualcomm SDR753-001 RF Transceiver Floorplan Analysis (RFTF)

The Qualcomm SDR753 is an RF transceiver found inside the Xiaomi 14 Pro. This Basic Floorplan Analysis concentrated on the essential characteristics of the radio frequency (RF) transceiver.

SK Hynix had the overall design wins for the SKHynix PE8110 960GB, supplying both RAM and NAND Flash Memory and the SSD Controller. Texas Instruments provided the temperature sensor. The SK Hynix PE8110 SSD features a PCIe 4.0 x4 with NVMe.

As 2023 draws to a close, the consumer electronics team is looking forward to what is in store for the industry next year. This report provides a set of predictions and anticipated developments across a range of industry sectors including smart home, computing, TV and gaming.

10 Jan

CES 2024 Unveils Breakthroughs in EV Range Estimation

Explore the cutting-edge innovations unveiled at CES 2024 addressing the critical challenge of accurate electric vehicle (EV) range predictions. Delve into groundbreaking solutions presented by industry leaders such as HERE, Valeo, TomTom, and Google, each offering unique approaches to enhance on-route battery range calculations and optimize driving experiences.

10 Jan

VALUE SHARE: Global 5G and LTE Handset Revenue and ASP by Vendor: Q3 2023

Global 5G handset industry revenues and shipments continued to stagnate in Q3 2023. Apple remains the leader of 5G shipments and revenues, but Samsung is growing quickly behind Apple.

10 Jan

CES 2024 Smart Home Highlights

Explore the cutting-edge smart home trends unveiled at CES 2024, featuring revolutionary technologies like Amazon's Matter Casting and Samsung's SmartThings Energy Management.

10 Jan

CES 2024 TV Highlights: A Glimpse into the Future of Home Entertainment

Explore the future of home entertainment with groundbreaking TV innovations unveiled at CES 2024. From Samsung's Micro LED marvels to LG's transparent OLED-T, discover the latest in display technology and redefine your viewing experience. Stay updated on the next wave of TV innovation.

10 Jan

Kia Unveils Futuristic Vision in Action at CES Mobility Media Day with New Concept Vehicle and Platform Showcase

Kia wowed at CES Mobility Media Day, turning futuristic dreams into reality with a stunning display of a new concept vehicle and platform. The showcase showcased Kia's commitment to pushing the boundaries of automotive innovation, offering a glimpse into the exciting future of mobility.

10 Jan

CES 2024 Preview – Infotainment & Telematics

TechInsights' Automotive Infotainment & Telematics CES 2024 pre-show report compiles the relevant exhibitors in the areas of infotainment, telematics, display, and audio technology and components.

TechInsights Autonomous Vehicle Services and ADAS CES 2024 pre-show report compiles the relevant exhibitors in the area of autonomous and ADAS technology and components.

08 Jan

Embedded WLAN (Wi-Fi) CE Device Global Market Forecast 2018-2028

The CE device market has changed significantly since the COVID19 pandemic spread across the globe, as consumers prioritize their working from home and entertainment choices.

08 Jan

Automotive Video Series Part 3: Centralized Architectures, Generative AI: Driving Auto Innovation

The discussion revolves around the key areas of innovation, highlighting the role of Qualcomm, Tier 1 suppliers, and the growing influence of Generative AI.

08 Jan

North America Notebook PC Vendor & OS Unit & Value Market Share by Country: 3Q 2023 Results

Notebook PC shipments in North America totaled 16.9 million units in the third quarter of 2023, a growth of 3% versus the same period a year ago. K-12 purchases remained strong, however continued weak enterprise demand in the United States kept growth rates subdued.

05 Jan

Maxscend Microelectronics Co. Ltd. MXD9122C Diversity Receive Front-End Module Packaging Analysis (RFPK)

The Maxscend MXD9122C is a diversity front-end module removed from the Samsung Galaxy A14 5G mobile handset. It features three dies in a wire bonded land grid array (WB-LGA) package with 24 pins.

05 Jan

YMTC YMN0AQF1B1HCAD 232-Layer QLC 3D NAND Flash Memory Floorplan Analysis

The YMN0AQF1B1HCAD 232L QLC 3D NAND Flash Memory is home to the industry's first quad-level cell (QLC) 3DNAND die with over 200 active word lines.

Global smart speaker and smart display wholesale revenues fell by 3% year-on-year in Q3 2023 to reach $2.4 billion. Meanwhile, average selling prices grew by 5% compared to the previous year quarter as a result of new higher priced model releases from Apple (HomePod 2) and Sonos (Era 100 and Era 300) in previous quarters.

The Tecno Phantom V Flip AD11 is the first flip version of smartphone from Tecno. It was released on September 24, 2023. The mobile runs on HIOS 13.5 (Based on Android 13). This model (AD11) was made for all regions.

02 Jan

Deep Dive Teardown of the Apple iPhone 15 Pro Max A2849 Smartphone

The iPhone 15 Pro Max A2849 is the highest model in the newest generation of Apple’s smartphones. It’s intended for the American market as it’s packed with 5G mmWave antennas and chips.

The iPhone 15 A3092 features 64-bit ARM based Apple A16 Bionic Applications Processor APL1W10, which is built on a TSMC 4nm process node and an updated version of A15 Bionic. Additionally, A3092 also comes with Qualcomm’s Baseband Processor SDX70M-000.

21 Dec

Deep Dive Teardown of the Samsung Galaxy Tab S9 Ultra SM-X910 Tablet

The Samsung Galaxy Tab S9 Ultra SM-X910 is one of the latest models in Samsung’s flagship Tab S series. The Tab S9 Ultra features a new generation processor (Snapdragon 8 Gen 2), a new Bluetooth standard (5.3), and WiFi6E with extended spectrum like Samsung Galaxy Tab S9+ 5G SM-X816B.

This annual update to TechInsights Autonomous Vehicles and Sensors Market Scenarios sees a boost for the expected penetration of L3 vehicles, but a small delay to the predicted adoption of fully autonomous L4 solutions.

19 Dec

TechInsights Forecasts that Consumer Electronics Industry Revenues Will Exceed One Trillion Dollars in 2024

TechInsights forecasts a historic moment for the Consumer Electronics industry, projecting it to exceed one trillion dollars in revenues for the first time in 2024. This blog post offers a concise overview of the key insights and trends shaping this groundbreaking forecast.

This report contains the results of the process analysis of the unknown manufacturer surface acoustic wave resonator (SAW) filter die S111131C 2+66 from the S111131C RF front-end (RFFE) module.

14 Dec

Deep Dive Teardown of the Google Pixel Watch 2 LTE GC3G8 Smartwatch

The Google Pixel Watch 2 LTE GC3G8 is the improved successor to the Google Pixel Watch GWT9R. The latest Google smartwatch is available in two variants 4G LTE + Bluetooth/WiFi or Bluetooth/WiFi. The Google Pixel Watch 2 LTE GC3G8 is based on Wear OS 4.0, like its predecessor GWT9R.

13 Dec

Apple Watch Metal-Can Battery

Dive deep into the heart of your Apple Watch with our exclusive webinar, "Understanding the Apple Watch Metal Can Battery: Design, Characterization, and Cycle Life," featuring TechInsights' Subject Matter Expert, Ali Khazaeli.

13 Dec

Consumer Electronics Video Series Part 2: Connected Entertainment

Will the Smart TV operating system arena see the emergence of new entrants? What new OEM/streaming platform partnerships will emerge, and which companies will be best placed for growth in 2024?

13 Dec

Desay A2663 Metal Can Battery (Apple Watch Series 7 41mm) Battery Cycle Life

The smaller version of the Apple Watch Series 7 uses a battery encased in metal instead of in a black foil pouch, as is typical for lithium-ion batteries. By using a metal casing, the battery can be sized to optimize the available space in the electronic device without the need for spacing between the battery housing and other components within the device.

13 Dec

Unknown Manufacturer 0957EFW Lithium Ion Battery (Huawei Watch Buds) Battery Essentials

Huawei Watch Buds is a smartwatch combined with earbuds, which are housed under the screen. Each earbud has a 30 mAh battery that can run for up to 4 hours of audio playback (or 2.5 hours of phone call).

Global shipments of TV streaming devices declined by 0.3% year-on-year during Q3 2023 with Game Console growing at +11% while both Smart TVs and Digital Media Streamers were declining at –2% and –1% respectively.

08 Dec

Mate 60 Pro mobile RF architecture proves Huawei can compete with top-tier smartphone OEMs

China's strides in circumventing technological embargoes are evident in the Huawei Mate 60 Pro. TechInsights highlights significant progress not only in the application processor system-on-chip (SoC) but also in the 5G BaseBand processor and mobile RF technologies, showcasing China's resilience in key smartphone technology domains.

08 Dec

Japan: Smartphone Shipments & Market Share by Model: Q3 2023

Japan is the world's third largest smartphone market by value. It delivers high revenues to device makers, component suppliers, and operators. Our extensive report shows the top-50 best-selling smartphone models in Japan in the third quarter of 2023. Besides popular Apple, Google, Sharp, and Sony flagships, which brands and models have made their way into the bestsellers and what is the secret behind their success?

08 Dec

Connected TV Device Vendor and OS Market Share: Q3 2023 (30 Countries)

Global shipments of TV streaming devices declined by 0.3% year-on-year during Q3 2023 with Game Console growing at +11% while both smart TVs and digital media streamers were declining at –2% and –1% respectively.

08 Dec

Digital Media Streamer Vendor Market Share: Q3 2023 (30 Countries)

Global shipments of streaming media players grew by 4% year-on-year to 17.3 million units during Q3 2023, driven by strong shipments from Amazon and Apple. Amazon upgraded its 4K devices with superior Wi-Fi technology and Apple continued to make strong strides following the latest Apple TV launched last year at a more affordable price than its predecessors.

08 Dec

TechInsights Predicts Semiconductor Market to Double in 10 Years

TechInsights forecasts a record-breaking year for the semiconductor industry in 2024, surpassing the peak of 2022. The projection indicates the market will more than double over the next decade, generating over a trillion dollars in revenue.

07 Dec

Deep Dive Teardown of the Asus Rog Ally 2023 RC71L Handheld Gaming Console

There are two variants of the Asus Rog Ally series. The primary distinction between the models is in the AMD processor. Asus offers one version of the Rog Ally featuring the standard Ryzen Z1 processor and another equipped with the Ryzen Z1 Extreme processor.

07 Dec

Deep Dive Teardown of the Xiaomi Redmi K60 Ultra 23078RKD5C Smartphone

TechInsights found the following ICs for the first time: Multichip Memory - 24 GB Mobile LPDDR5 SDRAM SK Hynix #H58GJ6BK8HX151, Multichip Memory - 1 TB 4D NAND Flash, Memory Controller (UFS 4.0) Samsung #KLUGGARHHD-B0G1, X7 Visual Processor Pixelworks, Inc. PX8768, and RxD Front-End Module Qorvo QM66210.

Global smartwatch shipments declined for the fourth consecutive quarter during Q3 2023, after Q4 2022 marked the first YoY decline since 2016 as the smartwatch space begins to mature and consumers reign in discretionary spending causing a lengthening replacement cycle amid macroeconomic weakness.

07 Dec

TechInsights' Semiconductor Analytics Report

Weekly Semiconductor Sales Increased 8% the Week Ending Dec 1, 2023

07 Dec

Deep Dive Teardown of the Huawei Watch Ultimate CLB-B19 Smartwatch

The Design Wins are shared by several manufacturers. Similar to the Huawei P60 Pro and Mate 60 Pro this device is equipped with MSS Satellite Messagind Chip manufactured by CETC.

06 Dec

2023 Connected Services in Car Report

TechInsights undertook a worldwide internet-based survey to investigate consumers’ usage and willingness to pay for connected services in cars. A total of 4,824 car owners across the US (1,735), UK, France, Germany and Italy (1,514 combined), and China (1,575) were surveyed.

06 Dec

RF Industry Review Q2 2023: Contracts, New Products

Economic uncertainty and weakness in smartphone sales led Oppo to close its Zeku radio chipset development venture. Start-up funding and M&A activity also slowed during the quarter.

06 Dec

Deep Dive Teardown of the Apple iPhone 15 Plus A3094 Smartphone

The iPhone 15 Plus features the 64-bit ARM based Apple’s A16 Bionic APL1W10 - the hexa-core applications processor, combining two Everest high-performance cores with four Sawtooth energy-efficient cores built on a TSMC 4nm process node die (N4P).

TechInsights has slightly upwards adjusted global smartphone forecast numbers in 2023 and 2024 to factor the better-than-expected Q3 2023 performance, the normalized inventory status, as well as the improved macroeconomic outlook.

01 Dec

TechInsights' Semiconductor Analytics Report

Analog and Power IC sales on track to decrease 5% YoY .

The global smartphone image sensor market grew annually to cross USD 3 Billion in Q2 2023. The market saw demand for high-end CIS products that aided in the growth.

30 Nov

Deep Dive Teardown of the Apple iPhone 15 A3090 Smartphone

The iPhone 15 A3090 is the least expensive iteration of the newest line-up of Apple’s flagship smartphones. This model was designed for the European region.

30 Nov

Automotive Video Series: Previewing CES® 2024

As we step into the exciting world of CES 2024, it’s important to recognize the impact that automotive trends will have on the tech landscape.

29 Nov

Analysis: Smartphone Image Sensor Market Share Q3 2023

The smartphone image sensor market registered a 3% decline in revenues in Q3 2023. The effects of inventory correction and slow demand affected the market annually.

29 Nov

Leading TechInsights' Analysts Going to CES® 2024

Joining the lineup at CES® 2024, TechInsights' premier analysts in Consumer Electronics, Automotive, and Mobile are set to make their mark.

Apple remains the shipment and revenue leader in Bluetooth True Wireless Stereo (TWS) headsets in Q3 2023.

28 Nov

Codasip Protects Memory With Cheri

Codasip’s new A730-Cheri RISC-V application CPU is the first commercial implementation of the Cheri fine-grained approach to memory protection that enables omission of a large memory-protection unit

27 Nov

Mobile AI Builds An Installed Base

Deployment of powerful AI hardware establishes an installed base for new software, which is more important than showy generative-AI demos.

The Huawei Mate X5 is a new foldable smartphone from Huawei. It is 14.76 mm thick at the thickest part when folded and 8.82 mm thick when unfolded.

24 Nov

Survey Plus Teardown of the Apple iPhone 15 A2846 Smartphone

The iPhone 15 features the 64-bit ARM based Apple’s A16 Bionic APL1W10 - the hexa-core applications processor, combining two Everest high-performance cores with four Sawtooth energy-efficient cores built on a TSMC 4nm process node die (N4P).

24 Nov

TechInsights' Semiconductor Analytics Report

23 Nov

Global Smartphone Monthly Shipments (Sell In), Sales (Sell Through) and Inventory Variance by Vendor: November 2023

TechInsights tracked global smartphone shipments (sell in) and they increased 5% YoY in October 2023 and global smartphone sales (sell through) grew 2% YoY.

23 Nov

Japan Handset Vendor Marketshare by Operator : Q3 2023

Japan handset shipments grew by 8% annually in Q3 2023. As usual, Apple continued to capture top positions through all local Japanese operators including Rakuten Mobile.

23 Nov

Autonomous Vehicles and Sensors Market Scenarios - Nov 2023

This annual update to the TechInsights Autonomous Vehicles and Sensors Market Scenarios sees a boost for the expected penetration of L3 vehicles, but a small delay to the predicted adoption of fully autonomous L4 solutions.

23 Nov

onsemi Automotive M3S EliteSiC 1200V SiC Process Flow Analysis

This report provides an analysis of the process flow and integration used in the manufacture of the onsemi NVH4L022N120M3S Automotive M3S EliteSiC 1200 V 22 mΩ N-Channel SiC Power MOSFET module.

We were invited to Qualcomm’s Snapdragon Summit in Maui this year, where the company revealed its upcoming computing platform, Snapdragon X Elite, powered by the new Oryon CPU.

21 Nov

Made in China: Mobile RF Front-End Design Solutions

Seminar Made in China: Mobile RF Front-End Design Solutions November 21, 2023 10:00 a.m. EST Register Today Details: Made in China: Mobile RF Front-End Design Solutions New at TechInsights: RF IC Packaging, Process and Acoustic Wave Filters for

21 Nov

Global Foldable Display Smartphone Shipments by Region and Type Q3’2023

20 Nov

Innoscience INN650D080BS 650 V 60 mΩ GaN

This report provides an analysis and emulation of the process flow and integration used in the manufacturing of the Innoscience INN650D080BS 650 V 60 mΩ GaN-on-silicon enhancement mode high-electron mobility transistor (HEMT).

17 Nov

Deep Dive Teardown of the Garmin Forerunner 965 A04578 Smartwatch

The Garmin Forerunner 965 is the successor of Forerunner 955. Both smartwatches support WiFi, Bluetooth, NFC, and GPS connectivity but not LTE communication.

17 Nov

The Apple iPhone 15 Pro device is one out of four flagship phones introduced by Apple in 2023. They were unveiled on September 12, 2023, and became available in the market on September 22, 2023. The Model A3102 is for the European market.

17 Nov

Deep Dive Teardown of the Samsung Galaxy Watch6 LTE SM-R945F Smartwatch

Comparing the Samsung Galaxy Watch6 LTE to its predecessor the Samsung Galaxy Watch5 Pro LTE SM-R925F, the latest model has a faster processor and 500MB more RAM capacity (mobile LPDDR4X SDRAM).

17 Nov

TechInsights' Semiconductor Analytics Report

17 Nov

Unveiling the Power of TechInsights’ Component Price Analyzer (CPA) Tool

Join TechInsights experts, Jagrut Patel and Barbara Slabinski, for our latest webinar Unleashing the Powers of TechInsights’ Component Price Analyzer (CPA) Tool.

16 Nov

North American Pay TV Provider Benchmarking (3Q 2023)

This database tracks the quarterly performance of the top pay TV providers in North America for the 1Q 2018 to 3Q 2023 time-period.

16 Nov

ADAS Semiconductor Demand Forecast 2021 to 2030 - Nov 2023

This market forecast highlights the growth opportunities for semiconductors used in Advanced Driver Assistance Systems (ADAS). Key changes include an acceleration of the demand for blindspot detection systems.

In Q3 2023, Honor’s smartphone shipment increased by +14% YoY worldwide, driven by the solid growth in the overseas market. Its global smartphone volume share broke last quarter’s record and reached a record high level at 5.4%.

13 Nov

AI: Product or Foundational Technology?

The Chip Insider® - As you know, McKinsey has talked up how huge the AI market will be in the future. They project it could be on a scale of trillions of dollars with the high end matching the GDP of today’s Germany ($4.4T).

13 Nov

Cadence Upgrades DSPs To LX8

Cadence has updated its DSPs to use the latest platform while making further improvements to two audio and two vision models.

13 Nov

Axelera Offers 210 TOPS For The Edge

Axelera’s Metis AI accelerator achieves over 200 TOPS using digital in-memory computing for high-end edge applications. Typical power is less than 10 W; module pricing is below that of incumbents.

13 Nov

Global Foldable Display Smartphone Vendor Market Share by Design Type: Q3 2023

Samsung was the leader in foldable display smartphone shipments in Q3 2023, followed by Huawei and Motorola. Shipments grew YoY but major markets North America and Western Europe declined heavily ongoing geopolitical and economic turbulence and Samsung's softness.

13 Nov

Global Foldable Display Smartphone Vendor Market Share by Region: Q3 2023

Samsung was the leader in foldable display smartphone shipments in Q3 2023, followed by Huawei and Motorola. Shipments grew YoY but major markets North America and Western Europe declined heavily ongoing geopolitical and economic turbulence and Samsung's softness.

13 Nov

Global MacBook Shipments by Model: 3Q 2023 Results

Apple has not been immune to the lull in demand and macroeconomic woes that have plagued the notebook PC industry following the COVID-19 era. In 2023, Apple's MacBook shipments are expected to decline 18% from their height in 2022 (24.7 million units).

13 Nov

Reticles Forecast: Latest Updates

The latest update of the Reticle Forecast covers yearly reticle sales, shipments, average selling prices, and reticle shipments by stepper type through 2027.

10 Nov

This report presents a Digital Floorplan Analysis of the Intel SPRHBMXLC or SPRHBMXRC dies found inside the Intel SRMJF (formerly Sapphire Rapids HBM) Xeon CPU Max 9462 Processor.

09 Nov

Order Activity is Edging Higher as Memory Pricing Recovers

The Chip Insider Graphics

09 Nov

Global Smartphone Vendor and OS Market Share by Region: Q3 2023

Global smartphone shipments shrinks -0.3% YoY in Q3 2023, largely improved from previous quarters. It indicates the ending of inventory corrections, as well as reaching bottom for smartphone industry.

09 Nov

Deep Dive Teardown of the Apple Watch Series 9, WiFi Only A2980

The Apple Watch A2980 is the 45 mm version of the Series 9 watch. It is very similar to its predecessor—the Apple Watch Series 8. Both watches are similar in design, battery, and sensors. They are water and dust resistant(IP6X).

This report presents a Memory Floorplan Analysis of the SK Hynix MDHD5E_20104 die found inside SK Hynix H58G66AK6H-X132. The H58G66AK6H-X132 was extracted from the Apple iPhone 15 Pro 5G smartphone.

Smartphone market in India declined by -5% annually and grew 26% sequentially in Q3 2023. Xiaomi topped and was followed by Samsung and Vivo in the second and third positions.

07 Nov

Global Smartphone Market Shows Signs of Stability: Q3 2023 Insights

The global smartphone market saw a notable shift in Q3 2023, marked by the ninth consecutive quarter of annual shipment declines. However, there are signs of market stabilization, offering hope for a mild rebound in 2024, with implications for industry players and consumers.

07 Nov

D-Matrix Samples AI Chiplet

Silicon Valley startup D-Matrix is trying to accelerate LLMs with its digital in-memory compute (DIMC) chip. The company’s Corsair card provides up to 9,600 TOPS at 600 W.

06 Nov

Qualcomm’s Oryon CPU Powers Laptops

Qualcomm’s new Snapdragon X Elite for laptops finally achieves competitive Arm-architecture performance while keeping power low. It’s the company’s first use of its Nuvia-originated CPU.

06 Nov

Snapdragon 8 Gen 3 Runs BIG AI Models

Qualcomm’s Snapdragon 8 Gen 3 uses more, faster CPUs and fewer power-efficient CPUs to boost performance. The company’s glitzy AI demos highlight’s what’s now possible on a phone.

Samsung shipped 59.5 million smartphones worldwide and phased out feature phones in Q3 2023.

03 Nov

This TechInsights data forecast provides the latest metrics identifying size and growth rate of the future semiconductor demand total across the Powertrain, Body, Chassis, Safety, and Driver Information application domains for the main light vehicle producing regions: North America, Japan, Europe, Russia, South Korea, China, India, Brazil, Thailand and ROW. In 2023, automotive semiconductor is forecast to grow by 23.9%.

The Vivo Y27 features a Tianma display, which is an LCD display known for its competitive price compared to other types of displays on the market.

30 Oct

HiSilicon Kirin 9000s Hi36A0 GFCV120 SMIC 7 nm N+2 FinFET Process Digital Floorplan Analysis

This is a Digital Floorplan Analysis (DFR) of the Hi36A0 GFCV120 die found inside the HiSilicon Kirin 9000S processor.

This TechInsights data model presents a view of the East Europe outlook for xEV systems and associated semiconductor and sensor demand.

30 Oct

China xEV System, Semiconductor and Sensor Demand Forecast 2021 to 2030 - October 2023

This TechInsights data model presents a view of the China outlook for xEV systems and associated semiconductor and sensor demand.

This report forecasts global smartphone sales volume, revenues and wholesale ASPs by six major regions and five price-tiers from 2008 to 2028. Extensive analysis of the premium, high, mid, entry and ultra-low price-bands is included.

30 Oct

Analysis: Global Bluetooth TWS and Banded Headset 88 Country Forecast to 2028

Bluetooth headsets have become must-have product for many smartphone owners as vendors remove the 3.5 mm plug from their smartphones.

30 Oct

Order Activity is Slowly Increasing Despite Low Utilization (October Update)

The Chip Insider Graphics

30 Oct

TechInsights' Semiconductor Analytics Report

30 Oct

Automotive Infotainment & Telematics - Systems Q4 2023 - Presenter

Automotive Infotainment & Telematics - Systems Q4 2023 - Presenter Share This Post The Automotive Infotainment & Telematics - Systems Q4 2023 – Presenter file is a companion slide presentation to the Automotive Infotainment & Telematics - Systems &

30 Oct

Partial Certs Complicate Auto Safety

Automotive safety assessment isn’t as simple as declaring an ASIL level. Some ASIL D certifications cover more than others. The details matter.

This is a device essentials folder (DEF) of Sony IMX591, 10.1 µm pixel pitch, stacked back-illuminated direct-Time of Flight (d-ToF) SPAD sensor, extracted from the Apple iPhone 15 Pro Max LiDAR camera.

25 Oct

China Does It Again: A NAND Memory Market First

TechInsights has uncovered the world's most advanced 3D NAND memory chip in a consumer device, a surprise achievement from China's YMTC, a top 3D NAND manufacturer. This chip is crucial for high-performance computing, especially in AI and machine learning, and marks a significant leap in technology, being the first quad-level cell (QLC) 3D NAND die with over two hundred active word lines detected by TechInsights.

24 Oct

Conference Shows Electrification Plays Critical Role in Driving Shared Mobility

Speakers at the Move America 2023 conference expressed an urgency to establish more reliable public charging for advancing all transportation modes.

24 Oct

Analysis: Global Refurbished Devices Forecast to 2028

Global refurbished handset sales volumes are growing at a healthy pace in 2023 and will continue to grow through the next several years.

24 Oct

Deep Dive Teardown of the ring Ring Bridge 5C28S8 Smart Home

The Ring Bridge 5C28S8 is a LoRa hub which controls Ring lights, doorbells and Ring cameras that are connected to same network in the one Ring App. If one Ring device detects motion, it can turn on lights, activate cameras, and connect to Alexa-enabled devices.

24 Oct

Samsung S5KHP2S 0.60 µm Pixel Pitch Device Essentials Plus

The Device Essentials Plus analysis of Samsung's S5KHP2S, a 200 MP, 0.60 μm Pixel Pitch, Back-Illuminated CMOS Image Sensor found inside the Galaxy S23 Ultra rear wide-angle camera.

23 Oct

Video Series: Embedded and Emerging Memory

Interested in all things emerging and embedded memory? Don’t miss this video series featuring Dr. Jeongdong Choe.

23 Oct

TSMC OIP 2023 Silicon Valley

The Chip Insider®

23 Oct

Deep Dive Teardown of the Amazon Echo Buds A7W95C/A7W3HR/A7W3HL Wireless Earbuds

The Amazon Echo Buds Pro were released on July 7, 2023. They work with Amazon Alexa. Compared to the second-generation Amazon Echo Buds, they are inexpensive and support Bluetooth 5.2 instead of 5.0

23 Oct

Automotive Infotainment & Telematics – Vendor Market Shares & OEM Features Q4 2023

TechInsights Automotive Infotainment & Telematics Q4 2023 Vendor Market Shares & OEM Features report provides an overview of System Vendor and Chipset Vendor market shares, as well as a range of key features by OEM including Telematics, Navigation, Smartphone Projection, Displays, and Operating Systems, etc.

23 Oct

Automotive Infotainment & Telematics – Systems & Features Q4 2023

TechInsights Automotive Infotainment & Telematics Q4 2023 System Market Spreadsheet provides a forecast outlook for the OEM and aftermarket hardware and feature market from 2020 through 2030.

23 Oct

Automotive Infotainment & Telematics – Semiconductors Q4 2023

TechInsights’ Automotive Infotainment & Telematics Q4 2023 Semiconductor Market Spreadsheet provides a forecast outlook for OEM and the aftermarket hardware and applications market from 2020 through 2030.

23 Oct

Intel Reconsiders FPGAs

Intel is spinning its FPGA division out into a separate reportable division. After a couple of years, it may issue public shares in a portion of the new company, maintaining a controlling stake for itself.

23 Oct

Raptor Redux Delivers Little To Desktop

Code-named Raptor Lake Refresh, Intel’s 14th-generation Core processors add little to the 13th-generation Raptor Lake. We expect them to mainly target desktop PCs while Meteor Lake addresses mobile-PC designs.

23 Oct

SK hynix H5CGD8MHBD-X021 D1a EUV 24Gb DDR5 DRAM Memory Floorplan Analysis

This is a Memory Floorplan Analysis (MFR) of the SK Hynix MDHD5C21001 die found inside SK Hynix H5CGD8MHBD-X021. The SK Hynix H5CGD8MHBD-X021 was extracted from the G.Skill Trident Z5 RGB 24 GB DDR5 DRAM.

23 Oct

Intel Alchemist SRLFZ Graphics Processor TSMC N6 FinFET HKMG CMOS Process Digital Floorplan Analysis

Intel Alchemist SRLFZ Graphics Processor TSMC N6 FinFET HKMG CMOS Process Digital Floorplan Analysis Share This Post This is a Digital Floorplan Analysis (DFR) of the Intel DG2128B0 die found inside the Intel SRLFZ graphics processor. The Intel SRLFZ

20 Oct

Deep Dive Teardown of the Apple MacBook Air 15 inch A2941 Laptop

With the New MacBook M2 A2941, Apple continues its design tradition of using an aluminum enclosure fitted to all internal components.

20 Oct

Apple U2 (TMQE08 die) Ultra-Wide Band Chip Floorplan Analysis (IoTB)

This report provides basic floorplan analysis (BFR) of the Apple U2 UWB transceiver TMQE08 die found in Apple iPhone 15 Pro, which is the most recent development to the Apple U1 UWB transceiver TMKA75 die found in Apple iPhone 11 analyzed by TechInsights in 2019 (BFR-1910-801).

20 Oct

Chinese OEM Autonomous Vehicle Strategies (2023 Update)

China leads the charge in automotive innovation with cutting-edge ADAS and AD solutions. TechInsights tracks this dynamic landscape, showcasing China's unique approach marked by innovation, strategic partnerships, and a commitment to self-reliance.

20 Oct

Chinese OEM Autonomous Vehicle Strategies: 2023 Update

In this update, TechInsights explores Chinese OEMs' high-end advanced driver-assistance system (ADAS) and autonomous driving (AD) strategies used to develop safer and more profitable vehicles.

20 Oct

Chinese OEM Autonomous Vehicle Strategies: 2023 Update

This field is used for the Short Desc in the eStore Report Store Item.In this update, TechInsights explores Chinese OEMs' high-end advanced driver-assistance system (ADAS) and autonomous driving (AD) strategies used to develop safer and more profitable vehicles.

20 Oct

The Calm before Earnings Season

The Chip Insider Graphics

20 Oct

TechInsights' Semiconductor Analytics Report

20 Oct

Vendor Update: Ciena Becoming A Force in PON Network Equipment

Seven vendors presently dominate the mature global PON network equipment market. Of them, three are excluded from several Western-aligned countries.

20 Oct

Handset Revenue & ASP By Vendor by Region : Q2 2023

Global Wholesale Handset industry revenues declined by -6% annually in Q2 2023. Apple. Samsung and Xiaomi were the top three vendors. Asia Pacific was the largest region both by value and volume in the quarter.

The French handset market in Q2 2023 declined by -7% YoY by shipment basis. Samsung captured no.1 positions across all local carriers while Apple stood at no.2 positions.

18 Oct

Survey Plus Teardown of the Samsung Galaxy A04e SM-A042F/DS Smartphone

The main difference between the Samsung A04e SM-A042F/DS and A04 SM-A045F/DS is the cameras used. The Samsung Galaxy A04e SM-A042F/DS features two rear cameras (13MP Main Camera and 2MP Depth Camera) and a 5MP Front Camera.

17 Oct

Deep Dive Teardown of the TP-LINK BE24000 Quand-Band Wi-Fi 7 Router Archer BE900 Wireless Router

Wi-Fi 6E offers a maximum throughput of up to 9.6 Gbps, while Wi-Fi 7 offers up to 46 Gbps. This means that Wi-Fi 7 is more than four times faster than Wi-Fi 6E.

16 Oct

China’s SMIC Plays 7 nm Card

Huawei launched the Mate 60 Pro phone with a 7 nm processor fabricated in China, seemingly in contravention of Western sanctions. They did it by employing multiple-patterning lithography.

16 Oct

AMD Epyc 8004 Extends Temp Range

The AMD Epyc 8004 (Siena) processor targets telco and other embedded designs. Employing the Zen 4C CPU, it’s similar to the recent Bergamo server processor but has fewer CPUs and DRAM interfaces and a smaller package.

16 Oct

Can China Dominate the Power Semiconductor Market?

This webinar explores how China's semiconductor industry, particularly in the power semiconductor market, could outpace the West amid global pressures. It examines innovation in consumer electronics by companies like Huawei, Xiaomi, and BBK Electronics, as well as the rise of disruptive players like Innoscience in wide bandgap semiconductor and power management integrated circuit (PMIC) manufacturing.

16 Oct

Deep Dive Teardown of the Samsung Galaxy Z Fold5 SM-F946B Smartphone

The 120Hz Main Display/Touchscreen Subsystem probably has a 'Shock Dispersion layer.' The hinge consists of three parts ("Triple Rail structure"), each hinge has four springs and four side mountings by which the hinge is attached to the housing (two for each housing).

16 Oct

Value Share: Global Smartphone Vendor ASP and Revenue Share by Region: Q2 2023

Global smartphone industry revenues declined by -6% annually in Q2 2023. Apple, Samsung and Xiaomi were the top three vendors and together accounted for 70% of the revenues.

13 Oct

YMTC 1Tb 232L TLC 3D NAND Internal Waveform Overview

The YMTC 1 Tb 232L TLC 3D NAND is featured in this internal waveform overview (IWO), which provides an analysis of the program, read, and erase waveforms.

12 Oct

Unknown RTFQ4B1V3 FR1 Transceiver from Huawei Mate 60 Pro Floorplan Analysis (RFTF)

The unknown manufacturer of RTFQ4B1V3 and RTFQ1B7S5 are FR1 transceivers found in the ALN-AL00 and ALN-AL80 128 GB RAM 512 GB ROM versions of the Huawei Mate 60 Pro 5G.

12 Oct

Order Activity is Edging Higher

The Chip Insider Graphics

12 Oct

TechInsights' Semiconductor Analytics Report

12 Oct

Automotive LiDAR Market Update: Chinese Vendors Take Early Lead

By 2025 TechInsights predicts that Hesai will maintain its market lead with 28% of the global automotive LiDAR market share, followed by RoboSense at 20%.

12 Oct

Analysis: Mobile Computing Vendor Market Share Q2 2023 Results

The mobile computing market was down 17% year-over-year in Q2 2023 in both shipments and revenue. While the notebook market showed signs of stabilization with sequential growth between the first and second quarter, the tablet market continued to see declines.

12 Oct

Smart Speaker and Smart Display Shipment and Installed Base Forecast for 88 Countries : 2014 to 2028

Global demand for smart speakers and smart displays is stalling and shipments are expected to decline by 7% in 2023 following a 2% drop in 2022.

12 Oct

Chip Observer (October 2023)

In TechInsights' Chip Observer, a publication dedicated to monitoring the semiconductor market from production facilities to consumer endpoints, the focus of this article is sustainability.

12 Oct

MicroBT KF1978E ASIC Miner Samsung SF3E GAA Process Advanced CMOS Essentials

The MicroBT WhatsMiner M56S++ cryptocurrency miner die features the first high-volume manufactured gate-all-around (GAA) CMOS technology, produced using Samsung's SF3E process, Samsung’s early version of their 3 nm process.

11 Oct

VR Headset Forecast by Price Tier 2014-2028 3Q 2023 Publication

TechInsights expects the VR headset market to be worth just under $8 billion and grow to an installed base of 37 million units by 2028.

11 Oct

VR Headset Forecast by Device Type 2014-2028 3Q 2023 Publication

TechInsights expects the VR headset market to be worth just under $8B and grow to an installed base of 37 million units by 2028.

10 Oct

Deep Dive Teardown of the Luminar Technologies Iris LiDAR 70-0034-00102203A15650 Automotive

The Luminar Iris seems to have different versions. The latest one is equipped with the flagship EX90 electric car from Volvo as the main sensor supporting autonomous driving system.

The Supermicro server contains two Intel Xeon Sapphire Rapids processors. It has a mechanical structure typical of professional servers in this class.

10 Oct

Deep Dive Teardown of the Honor X50 ALI-AN00 Smartphone

The Honor X50 was supplied for the first time by Qualcomm octa-core Snapdragon 6 Gen 1 processor SM6450-500-AB with package size 12.54 × 12.04 mm while the die size was 8.05 × 6.65 mm.

10 Oct

Driving Towards a Sustainable Future with Electric Vehicles

The global automotive landscape is transforming as the push for sustainability grows. Governments and consumers are driving the shift to electric vehicles (EVs), with countries like the EU, U.S., and China leading the way.

09 Oct

Cadence Boosts DLA Speed By 20×

Cadence’s Neo AI licensable IP block provides up to 80 TOPS of performance. Its NeuroWeave SDK unifies AI design across all Cadence IP options.

09 Oct

Intel Core Ultra Accelerates AI

Accelerated AI is a key feature of Intel’s forthcoming Core Ultra (Meteor Lake) processors.

09 Oct

Hexagon Adds INT4 Support

Peak raw performance of the Hexagon-based AI accelerator in Qualcomm’s newest flagship smartphone processor is 4× greater than that of the previous generation.

09 Oct

Generative AI Takes Alexa and its Smart Home Ecosystem to The Next Level

Generative AI Takes Alexa and its Smart Home Ecosystem to The Next Level Share This Post On September 20, Amazon hosted its annual devices and services event that evolved at a notably slower pace, and with fewer new product announcements than in the

05 Oct

TechInsights' Semiconductor Analytics Report

05 Oct

SK hynix H56G42AS8D-X014 D1y 8Gb GDDR6 HKMG DRAM Memory Floorplan Analysis

This is a Memory Floorplan Analysis (MFR) of the SK hynix GDDR6 H56G32CS die with a memory capacity of 8 Gb and a D1y generation node.

04 Oct

Order Activity is Cautiously Warming up

Order Activity is Cautiously Warming up Shereen Vaux Order activity for semiconductor equipment increased to 56 °F. Order activity continues heating up for subcontractors/advanced packaging to alleviate the bottlenecks still seen there. Micron’s

04 Oct

2023 Infotainment Report: Streaming Makes Great Gains

2023 Infotainment Report: Streaming Makes Great Gains Share This Post TechInsights surveyed 5,106 car owners in the United States (1,760), China (1,611), and Western Europe including France, Germany, Italy and the United Kingdom (1,735) covering

04 Oct

North America Tablet Vendor & OS, Unit & Value Market Share by Country: Q2 2023 Results

Consumers are pulling back on consumer electronics purchases this year due to budgetary constraints. In the tablet market, this has been compounded by a glut of tablet ownership during the COVID era.

04 Oct

Deep Dive Teardown of the QuietOn 3.1 Wireless Earbuds

The TechInsights Platform includes many reports analyzing sets of wireless headphones, including Google Pixel Buds Pro, Samsung Galaxy Buds Pro, and Apple AirPods Gen. 2.

Moving to the Apple A16 Bionic processor from the A15 processor used in the Apple iPhone 14 impacted the BoM total by $12. IC#13 found on the Main Board appears to be the new UWB U2 module Apple announced would be in all new iPhone 15 models at the Apple launch event.

03 Oct

Survey Plus Teardown of the Oppo Reno 10 5G PHW110 Smartphone

The Oppo Reno 10 5G PHW110 is one of the latest Oppo smartphones. This device is one of the latest variants from Oppo Reno line and a successor to the Oppo Reno 9.

02 Oct

Intel Gaudi2 Nears Nvidia H100 on LLMs

Industry leaders duke it out on the new LLM test included in the new version of the MLPerf data-center inference benchmark while also pursuing efficiency gains.

02 Oct

More Optics Head for the Data Center

Intel, Ayar Labs, and Lightelligence ran experiments demonstrating the benefit of fiber in an optical mesh network and its use in accessing remote memory via CXL.

This report presents a power essentials summary (PEF) of the Infineon TLE9012DQU Automotive Li-ion Battery Management PMIC, featuring a modern Infineon 0.13 um BCD process using deep and shallow device isolation and polysilicon shielded LDMOS gates.

29 Sep

TechInsights' Semiconductor Analytics Report

29 Sep

Deep Dive Teardown of the Withings Body Scan WBS08-Black-All-Inter Health Monitor

Aside from weight, the Withings Body Scan WBS08 scale can also measure body composition, heart rate, and ECG.

28 Sep

Memory Spot Prices are Starting to Warm up

Memory Spot Prices are Starting to Warm up Shereen Vaux Order activity for semiconductor equipment increased to 55 °F with most segments jumping a degree. Memory fundamentals are improving due to supply reductions for both DRAM and NAND. Memory

28 Sep

Samsung K4C6E1K6MB 3rd Gen. 16Gb HBM2E DRAM Memory Floorplan Analysis

This report (MFR) provides an analysis of the floorplan design used in the Samsung K4C6E1K6MB 3rd Gen.

The global smartphone memory market remained muted and recorded a revenue decline of 41 percent in Q2 2023. Despite the slowdown, memory content demand grew with increased Petabyte shipments.

26 Sep

Nuclei Achieves Top Auto Safety

Nuclei Systems, a Chinese RISC-V processor vendor, announced a licensable RISC-V CPU core certified for ASIL D automotive applications, the most stringent level.

25 Sep

Post IPO, Arm Faces New Challenges

Arm is publicly traded again, concluding a three-year effort by SoftBank to sell it. The IPO is a better outcome than if Nvidia had acquired it.

25 Sep

Huawei Strikes Back: What TechInsights found, how it did it, why it matters, and what it means

The Chip Insider®

25 Sep

Micron LPDDR5 Found in Apple iPhone 15 Pro

Micron LPDDR5 16 Gb Non-EUVL Chip Found in Apple iPhone 15 Pro

In a recent teardown of the Apple iPhone 15 Pro, TechInsights has discovered a remarkable find - Micron's cutting-edge D1β LPDDR5 DRAM chips. These chips mark the industry's first foray into the D1β generation, and they are nothing short of impressive.

25 Sep

Deep Dive Teardown of the Tesla FSD Computer HW4.0 1960600 Automotive

The FSD Computer HW4.0 was the latest version of Tesla’s Self-Driving device. In comparison to the previous model analyzed by TechInsights, the HW4.0 costs three times the price of the last one, but the manufacturing cost only increased by ~32%.

25 Sep

CXMT NA45B61GX8 D1x 22nm 8Gb DDR4 DRAM Memory Floorplan Analysis

This report (MFR) provides an analysis of the floorplan design used in the CXMT NA45B61GX8 D1x 22 nm 8 Gb DDR4 DRAM and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.

25 Sep

China is Turning up the Heat in this Cold Market (September Update)

The Chip Insider Graphics

25 Sep

Apple iPhone 15 Pro Teardown

TechInsights is thrilled to offer you an exclusive opportunity to uncover the secrets of Apple's latest marvel – the iPhone 15 Pro, equipped with the groundbreaking A17 Pro processor.

22 Sep

Apple APL1V02 A17 Pro Processor TSMC 3nm FinFET Process Advanced CMOS Essentials – First Look

This first look report provides an early analysis of the structure and materials used in the manufacture of Apple A17 Pro (TSMC 3nm FinFET process).

22 Sep

Car Audio Hardware & Software – Pursuit of Efficiency Driving Innovation

Car Audio Hardware & Software – Pursuit of Efficiency Driving Innovation Share This Post In TechInsights’ automotive audio hardware and software report, TechInsights forecasts that automotive Ethernet demand will grow by 16.7% between 2022 and 2030

Xiaomi releases different models of smartphones from different series every year. The offer includes both 4G and 5G models. One of the models that support the 5G standard is the Xiaomi Redmi Note 12 5G model released in 2022.

21 Sep

MicroBT Whatsminer M56S++ Transistor Characterization

This report presents key DC electrical characteristics for logic NMOS and PMOS transistors located in the core region of the crypto-miner cryptocurrency ASIC die (KF1978) found inside the MicroBT KF1978E component.

21 Sep

TechInsights' Semiconductor Analytics Report

21 Sep

Deep Dive Teardown of the Mobvoi TicWatch Pro 5 WH12088 Smartwatch

The Mobvoi TicWatch Pro 5’s main frame is made of Aluminum 7000, the bezel is made of Stainless Steel, and the bottom housing is made of a combination of Nylon and Fiberglass.

19 Sep

Qualcomm BB91C Surface Acoustic Wave (SAW) Filter Die from the Qualcomm QPM7815 MHB FEM Process Analysis

This report presents an acoustic wave filter process analysis of the Qualcomm BB91C Surface Acoustic Wave (SAW) Filter Die, from the Qualcomm QPM7815 MHB front end module. The die and module were extracted from the Samsung Galaxy S23 Ultra 5G smartphone.

19 Sep

Webinar: Sustainability in the Semiconductor Industry: A TechInsights Perspective

Industries around the world are focused on ways to reduce carbon emissions in their own production processes but also in their supply chain. This is no different for the semiconductor industry which is heavily dependent on chemicals, power, and water to manufacturer the increasingly smaller process nodes.

19 Sep

Goodix 0.036 MP, 7.45 μm Pixel Pitch, Front-Illuminated In-Display Fingerprint CMOS Image Sensor Device Essentials Folder

This report presents a device essentials folder (DEF) of the Goodix 0.036 MP, 7.45 μm Pixel Pitch, Front-Illuminated In-Display Fingerprint CMOS Image Sensor, extracted from the IQOO Z7 5G smartphone.

19 Sep

GlobalFoundries’ GTC 2023

GlobalFoundries’ GTC 2023 G. Dan Hutcheson The Chip Insider® Summary: GlobalFoundries’ GTC 2023: News out of last month’s GF Global Technology Conference in San Jose was quickly overtaken by this month’s events, including GF’s 450K 300mm WSPY fab

19 Sep

Arm Licenses Neoverse N2 Subsystem

Arm’s new licensable Neoverse CSS N2 provides an entire compute subsystem implemented and verified on TSMC’s 5 nm process. It may save customers months of work.

The Honor 90 5G Front Camera is a 50 MP CMOS BSI Sensor from Samsung (S5KJN1). The whole subsystem is 5.32 mm height, and the dimensions of the sensor housing are 8.85 x 8.24 mm.

15 Sep

SK hynix Powers Huawei Mate 60 Pro

As of our latest analysis, the Mate 60 Pro exclusively features SK hynix memory components. This blog breaks down the key findings along with exclusive images.

14 Sep

Analyzing the Global Apple iPhone Shipment Volume and Market Share

In this analysis, we'll delve into the data provided by WSS TechInsights, exploring key takeaways from the chart depicting Apple's iPhone shipment volume and market share from 2007 to a forecasted 2024.

14 Sep

Qorvo EG9381 Bulk Acoustic Wave Solidly Mounted Resonator (BAW-SMR) Filter Die Acoustic Wave Filter Process Analysis

This report presents a process analysis (AFB) of the Qorvo EG9381 Bulk Acoustic Wave Solidly Mounted Resonator (BAW-SMR) Filter Die from the Qorvo QPQ5600 Band-Pass Filter.

14 Sep

Apple's New iPhone 15 Series

Global shipments of TV streaming devices grew by 4% year-on-year(YoY) during Q2 2023 driven by a healthy 19% YoY growth in Gaming Consoles and 4% (YoY) growth in Smart TV category despite high inflation and macro economic uncertainties.

13 Sep

Order Activity is Improving, Despite the Cold Temperatures

Order Activity is Improving, Despite the Cold Temperatures Shereen Vaux Order activity for semiconductor equipment increased to 54 °F; generative AI remains a bright spot as capacity constraints remain for CoWoS. August sales are in from the

13 Sep

OmniVision OX03D4C, 1/345″ Format, 3.0MP Resolution, 2.1μm Pixel Pitch, Stacked Back-Illuminated CMOS Image Sensor Device Essentials Folder

This report presents a device essentials (DEF) of the OmniVision OX03D4C, 1/345″ Format, 3.0MP resolution, 2.1μm pixel pitch, stacked back-illuminated CMOS image sensor. A stacked system-on-chip (SoC) image sensor with HDR, LFM capability, RCCB CFA, 140dB, and low power consumption below 500 mW.

12 Sep

Deep Dive Teardown of the Hewlett Packard Enterprise HPE MU NVMe SCN 1.6TB MO001600KXAVT SSD

Deep Dive Teardown of the Hewlett Packard Enterprise HPE MU NVMe SCN 1.6TB MO001600KXAVT SSD Share This Post The HPE MU NVMe SCN 1.6TB SSD features a PCIe 4.0 x4 with NVMe. The SSDs in this series are also available in capacities of 800, 1600, 3200

12 Sep

Qualcomm QCC5181 Bluetooth 5.4 Audio SoC Basic Floorplan Analysis

This report presents a Basic Floorplan Analysis of the Qualcomm HG11-CH383-210 found inside Qualcomm QCC5181.

12 Sep

Apple iPhone 15 RF Front-End: A Familiar Face

Anticipation for Apple's iPhone 15, launching on September 12, 2023, is soaring. However, when it comes to RF Front-End technology, don't expect groundbreaking innovations, except for a possible Antenna-in-Package upgrade.

12 Sep

Assessing the Value of Sustainable Silicon Carbide Technology

In the quest for sustainability and greenhouse gas reduction, power electronics have emerged as a critical player, with silicon carbide (SiC) at the forefront of innovation.

08 Sep

UX Benchmark: 22MY VW ID.5

TechInsights conducted an evaluation of the infotainment system in the 22MY VW ID.5. Volkswagen have created a playful user experience with some serious technology in the ID.5 provided by the AR HUD when fitted which should be appealing to consumers considering a BEV.

08 Sep

Global Wearables Shipment Forecast by Type by Vendor by Quarter : 2017 to 2024

TechInsights predicts global wearable shipments will grow by 3.6% in 2023, and by 6.5% in 2024, a notable improvement after a 6% decline in 2022 due to steep declines in fitness bands and slowing growth for smartwatches, only partly offset by feature watch and hearables growth.

08 Sep

Notebook PC Vendor & OS Unit & Value Market Share by Region: Q2 2023 Results

Notebook PC shipments declined -13% in the second quarter of 2023 versus the same period a year ago and totaled 47.6 million. While the PC market has continued to contract versus its high point during the COVID era, there are early signs of stabilization.

08 Sep

SMIC 7nm N+2 in Huawei Mate 60 Pro - Uncovering the innovation inside the chip

Following the weekends breaking news by TechInsights, our Disruptive Event Briefing is now available to access for FREE (Registration Required).

08 Sep

Signs of a Soft Landing in 2H23 Abound Shereen Vaux Order activity for semiconductor equipment jumped higher to 50 °F as the 2H23 outlook for equipment suppliers is shaping up to be better than feared. The improvement in 2H23 is driven by China

The display has a 6.6" TFT screen with a 120 Hz refresh rate and a touchscreen controller integrated into the display driver from Novatek. The battery had a 4900 mAh capacity.

29 Aug

Samsung Exynos 5300 5G Modem Samsung 4nm FinFET Process Digital Floorplan Analysis

This report presents a digital floorplan analysis (DFR) of the floorplan design used in the Samsung Exynos 5300 5G Modem and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets.

29 Aug

Survey Plus Teardown of the Xiaomi Redmi A2 23028RNDI Smartphone

The Xiaomi Redmi A2 23028RN4DI is a low-budget phone from Xiaomi’s Redmi A series. It's equipped with the Mediatek Octa-Core Helio G36. It leads in terms of price because it has three cameras: 8 MP rear camera, 0.08 MP rear depth camera, and a 5 MP front (selfie) camera.

29 Aug

Public-Private Partnerships in Semiconductors: Do they work?

Public-Private Partnerships in Semiconductors: Do they work? G. Dan Hutcheson The Chip Insider® Summary: Public-Private Partnerships in Semiconductors: Do they work? I recently had the honor of addressing the National Academies of Sciences

Global Fitness Band shipment declines re-accelerated in Q2 2022, tumbling by over 40% once again during the quarter. This comes after volumes dropped just 12% in Q1 2023, after collapsing by roughly 40% for the four prior consecutive quarters.

28 Aug

Kalray Speeds Up Its Data Processor

Kalray's Coolidge v2 chip targets network processing for the storage market. It’s based on the company’s massively parallel processor array (MPPA) architecture; it’ll enter production in 2024.

28 Aug

Q2 ’23: HMD (Nokia): Highest Ever Handset ASP

HMD (Nokia) delivered high handset wholesale ASP ever in Q2 2023. First time after fourteen quarter with continuous declining total handset volumes, HMD (Nokia) shows double digit growth rate, a result of the rising smartphone segment.

28 Aug

United Kingdom : Smartphone Shipments & Marketshare by Model: Q2 2023

The United Kingdom is Western Europe's second largest smartphone market. It delivers high volume and revenue to device makers, component suppliers and operators.

28 Aug

Ambiq Microcontrollers Get Healthy

Ambiq’s Apollo4 Lite and Blue Lite target lower-cost fitness bands that require less graphics and display processing. Power is less than that of competitors, although pricing is higher.

28 Aug

Analysis : India Smartphone Market Share by Channel by Vendor : Q2 2023

India Smartphone market declined by -5% annually in Q2 2023. Vivo, Xiaomi and Samsung were the top three vendors. Offline channels held the upper hand in the second quarter of the year too.

28 Aug

Canada Smartphone Vendor Marketshare by Operator : Q2 2023

Smartphone shipments in Canada contracted by double-digits in Q2 2023 compared to the year-ago quarter, with just one of the leading vendors seeing shipments improving year-on-year.

28 Aug

Global Smartwatch OS Market Share by Region : Q2 2023

Global smartwatch shipments declined for the third consecutive quarter during Q2 2023, after Q4 2022 marked the first YoY decline since 2016 as consumers reigned in discretionary spending causing a lengthening replacement cycle amid macroeconomic weakness.

28 Aug

Q2 ’23: Transsion: Nudged Up the Fifth Largest Smartphone Vendor Globally

Transsion nudged up the fifth position with 9% market share. It is the first time the Chinese brand entered the top five list by smartphone shipments growing +31% YoY.

28 Aug

Five Companies Collaborate on RISC-V

Bosch, Infineon, Nordic, NXP, and Qualcomm are investing in a joint venture to advance RISC-V. Initially focusing on the automotive industry, the venture could address RISC-V’s fragmentation and accelerate its adoption.

28 Aug

Q2 ‘23: Xiaomi: Soft in Asia Pacific

Synopsis: Xiaomi’s smartphone shipments fell -16% YoY in Q2 2023. Though its performance improved from a quarter ago, Xiaomi still posted decline in most regions with its smartphone operations.

28 Aug

Survey Plus Teardown of the Oppo A78 5G CPH2495 Smartphone

Released in January 2023, the Oppo A78 (CPH2495) is equipped with MediaTek’s Octa-Core Dimensity 700 Applications/Baseband Processor #MT6833V, made in 7nm technology, while in the A1 5g Qualcomm's Octa-Core Snapdragon 695 was used.

28 Aug

Deep Dive Teardown of the Xiaomi Pad6 Pro 23046RP50C Tablet

Xiaomi also provides a multi-touch TFT display compared to the Apple iPad Pro A2437 and iPad 10th Gen A2757. Based on the 45 white LEDs backlight scheme design is like the one in iPad 10th Gen A2757 (featuring 40 LEDs).

28 Aug

Deep Dive Teardown of the Neoway 5G Module N511-CA Wireless Module

The Neoway N511-CA module emerges as a 5G wireless communication module introduced to cater to the worldwide market. This module is proficient in facilitating both the 5G standalone network (SA) and non-standalone network (NSA) network architectures.

28 Aug

Global Game Console Forecast 2012-2028

Global game console shipments declined by -4.7% to reach 40.8 million units in 2022 due to supply chain constraints and macro economic uncertainties.

23 Aug

What’s Powering the NVIDIA H100 Artificial Intelligence Accelerator?

Global annual handset shipment growth was once again down, in Q2 2023. Global 5G smartphone shipments are still (slowly) growing, but that improvement is not enough to make up for steep declines in 4G LTE, 2G and the nearly dead 3G markets.

In 2023, cellular connected notebook PCs are expected to decline along with the wider PC market, down 13% versus 2022 to 8.8 million units.

14 Aug

Significant Advancements for Mobile RFFE Technologies and Design Strategies

2023 IEEE International Microwave Symposium and RFIC Conference

14 Aug

Deepx's AI Chip Targets Cameras

Yet another South Korean AI chip startup, Deepx, has emerged from stealth mode. The company’s products target computer-vision applications and provide performance from 2 to 184 TOPS.

14 Aug

Neo Takes DRAM To a New Dimension

Neo’s 3D X DRAM technology promises an 8× increase in DRAM capacity with a per-bit cost one-sixth that of conventional DRAM. The company seeks a partner for silicon implementation.

14 Aug

Snapdragon GPU Area Efficiency Slides

TechInsights’ floorplan analysis reveals MediaTek and Qualcomm have increased GPU size in their flagship smartphone processors while Apple has held its GPU size constant.

This report presents a device essentials plus (DEP) summary of the Sony 1/1.35” Format, 48 MP, 1.12 μm Pixel Pitch, Stacked Back-Illuminated Exmor T (2-Layer Transistor Pixel) CMOS Image Sensor with Dual Photodiode (Octa PD).

This report presents an advanced memory essentials (AME) of the Sony CXD5610GF GlobalFoundries 22FDX eMRAM, extracted from the Telit SE868SYD110T001000 global navigation satellite system (GNSS) receiver.

08 Aug

Analysis : India Smartphone Vendor & OS Marketshare : Q2 2023

Smartphone market in India declined by -5% annually and grew 12% sequentially in Q2 2023. Vivo topped for the second time ever and was followed by Xiaomi and Samsung in the second and third positions.

08 Aug

Bluespec Adds Custom RISC-V Instructions

Bluespec’s licensable RISC-V MCUX CPU IP adds custom instructions to its existing ultralow-footprint CPU, branded MCU. Optimized for FPGAs, these CPUs occupy fewer lookup tables than any other commercial RISC-V core.

08 Aug

China Smartphone Vendor & OS Marketshare : Q2 2023

China smartphone shipments dropped -5% YoY in Q2 2023. It has been the worst second quarter in the past ten years. The encouraging side is that the decline rate narrowed down in Q2 from the previous quarters, signaling the stabilization and the start of the recovery cycle of China smartphone market in the upcoming quarters.

08 Aug

Tesla Dojo Opens for AI Training

Tesla has started deploying its Dojo supercomputer that employs unusual technologies to pack AI-training performance in a smaller volume than Nvidia-based systems.

08 Aug

This report presents a power essentials summary (PEG) of the Xinguan Technology XG65T230HS1B650 V 230 mΩ GaN-on-Silicon Depletion Mode HEMT, extracted from the Satechi 200 W USB-C Charger.

08 Aug

Amperex Technology Limited (ATL) BLP973 Lithium-Ion Battery with Battery Health Engine (Oppo Reno 9 Pro) Battery Characterization

This report presents a battery characterization (BCR) of the Amperex Technology Limited (ATL) BLP973 Lithium-Ion Battery with Battery Health Engine, extracted from the Oppo Reno 9 Pro smartphone.

This report examines and forecasts the global market for V2V (Vehicle to Vehicle) communication and the continued rivalry between two V2X protocols: Wi-Fi-p/DSRC/ITS-G5 and cellular based C-V2X.

03 Aug

Autonomous Vehicle Start-ups & Small Companies

This database covers the key start-ups and small companies that collectively are playing an important role in the development of autonomous vehicle technology.

03 Aug

Unleashing the Future of DRAM: The Quest for 1Tb Chips with 3D X-DRAM

Are we ready for a groundbreaking leap in memory capacity? Dr. Jeongdong Choe explores the possibility of a 1Tb DRAM chip, akin to NAND, and unveils the potential of 3D X-DRAM in the latest TechStream article.

The following is a report of the VanChip VC7643-63/H Multi-Mode Multi-Band (MMMB) Power Amplifier Module (PAM) Architecture Analysis.

01 Aug

Providing Good Service to the Semiconductor Industry Matters

Providing Good Service to the Semiconductor Industry Matters Share This Post TechInsights invites you to learn about each award recipient in the 2023 Customer Satisfaction Survey. This week: HANMI and ASMPT Limited. Delve into the top rankings of the

01 Aug

Deep Dive Teardown of the Google Pixel 7a GHL1X Smartphone

The GooglePixel 7a GHL1X is the latest budget smartphone from Google, succeeding the Pixel 6a. It was released on December 5, 2022. The mobile runs on the Android 13 operating system. This model (GHL1X) was made for Europe region.

This report provides an analysis of the floorplan design used in the SunLune Technology Jasmier X4 Ethereum Miner ASIC, fabricated on the XMC 40nm CMOS process, which incorporates DRAM DBI interconnect and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets.

31 Jul

MediaTek MT6985W Dimensity 9200 Processor Package-On-Package with Integrated Organic Interposer Advanced Packaging Quick Look Analysis

This quick look report provides insight on the advanced packaging innovations used in the manufacturing of the MediaTek MT6985W Dimensity 9200 Processor, using TSMC's InFO-B process.

31 Jul

SEMICON West Highlights

SEMICON West Highlights G. Dan Hutcheson The Chip Insider® Summary: SEMICON West Highlights: Downturn Shock: Zombie-land facial expressions were characteristic of this year’s show. Back in December, few believed us when TechInsights analysts

31 Jul

IoT Connectivity’s Role in Sustainability

The recent extreme climate events worldwide have increased the focus on the importance of environmental sustainability.

31 Jul

Deep Dive Teardown of the HTC Vive Elite XR 2QBB100 VR Headset

The HTC Vive Elite XR is HTC’s latest VR Headset which doesn’t require a base station. This model features five cameras instead of six as in the HTC Vive Cosmos.

31 Jul

Deep Dive Teardown of the Harman GMC Sierra Head Unit INFO3.7-3.8 CSM Automotive

The GMC Sierra is a full-size pickup truck manufactured by GMC (General Motors Truck Company). The Harman INFO 3.7-3.8 CSM is an infotainment system developed by Harman, a global technology company specializing also in automotive solutions.

31 Jul

i.MX91 Targets Simple Edge Systems

NXP’s i.MX91 addresses simple edge applications with a feature subset of the i.MX93, maintaining pin compatibility and reducing power.

31 Jul

Cortex-X3 Proves Its Area Efficiency

TechInsights’ floorplan analyses of smartphone processors reveal the size of CPUs and caches.

31 Jul

NVIDIA H100 Hopper TSMC CoWoS-S Flip Chip Ball Grid Array

This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the nVIDIA Hopper GH100 GPU.

31 Jul

Dimensity 6100+ Lags at Low End

Qualcomm’s Snapdragon 4 Gen 2 offers more-powerful CPUs and faster DRAM than MediaTek’s Dimensity 6100+, but neither new chip delivers much improvement to low-cost smartphones.

31 Jul

Lead-Sheathed Cable Risks Greatly Exaggerated

An investigative report in the Wall Street Journal claims that lead-sheathed cable in US telecom outside plant represents a public health and environmental hazard.

31 Jul

Preliminary Global Notebook PC Shipments and Market Share: Q2 2023 Results

Notebook PC shipments declined -13% in the second quarter of 2023 versus the same period a year ago and totaled 47.4 million.

31 Jul

GaN and Microwave Acoustics Take Center Stage at IMS 2023

GaN and Microwave Acoustics Take Center Stage at IMS 2023 Share This Post Advances in GaN devices for the millimeter wave took center stage at IMS 2023 with new products and R&D results from BAE, HRL, Intel, NGC Qorvo, Wolfspeed, and others. Acoustic

31 Jul

Solidigm 29F02P2BMCQLI 192-Layer 1.33 Tb QLC 3D NAND Flash Memory Floorplan Analysis

Solidigm 29F02P2BMCQLI 192-Layer 1.33 Tb QLC 3D NAND Flash Memory Floorplan Analysis Share This Post This report (MFR) provides an analysis of the floorplan design used in the Solidigm 29F02P2BMCQLI 192-Layer 1.33 Tb QLC 3D NAND Flash, and includes

28 Jul

TechInsights' Semiconductor Analytics Report

28 Jul

Near-term order visibility remains limited as caution drives decision making

Near-term order visibility remains limited as caution drives decision making Shereen Vaux Order activity for semiconductor equipment held at a chilly 43 °F as customers remain cautious because of the macro headwinds and slow inventory burn off

28 Jul

Semtech LR1121 LoRa Transceiver Floorplan Analysis (IoTB)

This report presents a basic floorplan analysis (BFR) of the Semtech LR1121 Long Range (LoRa) Transceiver.

27 Jul

Automotive Semiconductor Demand Forecast 2021 to 2030 - Q2 2023 Executive Summary

While the remnants of the COVID situation and the war in Ukraine, and subsequent fears over the global economy remain dominant factors impacting vehicle output in this update, TechInsights sees signs that semiconductor supply is starting to become less of an issue.

27 Jul

Qorvo QPG7015M Zigbee/Thread/BT 5.0 Controller Floorplan Analysis (IoTB)

This report presents a basic floorplan analysis (BFR) of the Qorvo QPG7015M Zigbee/Thread/BT 5.0 controller, extracted from the eero Pro 6E wireless router.

The 2020-2021 COVID-19 wave gave a huge boost to online channel but as the situation eases out in the different regions, offline started to gain back some of its lost share leading to online sales % decline in 2022 and it is expected remain the downwards track for 2023 as well.

26 Jul

Connected CE Devices Market Forecast: ASIA PACIFIC 2018-2028

This report forecasts major Consumer Electronics device shipments, installed base, revenues and ASPs globally and across six major regions from 2018 to 2028 as a total of all devices and those that are IP-enabled.

26 Jul

The Silicon Bridge and Heterogeneous Integration Webinar

Webinar: The Silicon Bridge and Heterogeneous Integration

Featuring TSMC, Apple, Samsung, and the Jasminer X4—the first-ever observed DRAM-to-Logic hybrid bonding.

25 Jul

TechInsights’ McClean Report is Now Brought to You Monthly

Also benefit from the traditional TechInsights McClean Report Research Bulletins in the complimentary section.

25 Jul

Automotive: Generative AI in the Infotainment Market and Beyond

Talk of generative AI is everywhere these days. But what does it mean for the automotive industry?

25 Jul

OmniVision OS12D40 Device Essentials

This report presents a device essentials (DEF) of the OmniVisionOS12D40, 1/2.49″ Format, 11.3 MP Resolution, 1.4 µm Pixel Pitch, Stacked Back-Illuminated CMOS Image Sensor.

25 Jul

Deep Dive Teardown of the Schlage Encode Plus Smart WiFi Deadbolt BE499WB WiFi Smart Lock

When compared to the Schlage Encode Plus model BE499WB, the Securam Wi-Fi Smart Lock model SH-WB01 has differences.

TechInsights’ Automotive Infotainment & Telematics Q3 2023 Semiconductor Market Report provides a forecast outlook for OEM and Aftermarket hardware and applications market from 2020 through 2030.

24 Jul

IBM’s Strategy, Vision, and Ecosystem

IBM’s Strategy, Vision, and Ecosystem G. Dan Hutcheson The Chip Insider® Summary: IBM’s Strategy, Vision, and Ecosystem: Eight years ago… I visited IBM at Albany NanoTech Complex, which contains the company's semiconductor research center, to answer

24 Jul

Editorial: Intel Refocuses Manufacturing

Intel’s new accounting approach gives financial responsibility to manufacturing, treating business units as internal customers. This greater accountability should help the overall profitability and competitiveness of its foundry business.

24 Jul

Tiny AI Benchmark Matches Up MCUs

Microcontrollers from STMicroelectronics feature prominently in MLPerf Tiny v1.1 results, and Plumerai’s inference engine demonstrates how it speeds up model execution.

While the remnants of the COVID situation and the war in Ukraine, and subsequent fears over the global economy remain dominant factors impacting vehicle output in this update, TechInsights sees signs that semiconductor supply is starting to become less of an issue.

21 Jul

TechInsights' Semiconductor Analytics Report

TechInsights' Semiconductor Analytics Report Shereen Vaux Semiconductor sales increased 9% last week but were down 6% from this time last year; however, the yearly declines are starting to moderate. Zooming in on NAND IC this week, the 13-week MA is

21 Jul

3D NAND – Q2 2023 Update

Chi Lim Tan, Senior Process Analyst and NAND expert with TechInsights, has compiled a quick review of major happenings in the second quarter of 2023.

The TV operating system (OS) is emerging as a key point of differentiation for TV OS vendors with control of the TV OS becoming a major battle ground.

19 Jul

Oppo SUPERVOOC S PMIC from OnePlus Ace 2 Mobile Handset Process Analysis

This report presents a PMIC process analysis (PEF) of the Oppo SUPERVOOC S PMIC, extracted from the OnePlus Ace 2 smartphone.

19 Jul

The OPPO Reno 9 and understanding OPPO’s Battery Health Engine

Can Oppo’s Battery Health Engine mitigate the aging of lithium-ion batteries?

19 Jul

Samsung’s 3nm GAA Process in Whatsminer ASIC - Disruptive Event

TechInsights has identified Samsung's revolutionary 3nm Gate-All-Around (GAA) process within the Whatsminer M56S++ crypto-mining ASIC from Chinese manufacturer MicroBT.

19 Jul

Deep Dive Teardown of the Apple Mac Mini A2816 Personal Computer

The Mac Mini A2816 runs the M2 Pro/APL1113 64-bit dodeca-core applications processor, manufactured by TSMC for Apple.

18 Jul

Deep Dive Teardown of the Fibocom FM350-GL Wireless Module

The FibocomFM350-GL module is a 5G wireless communication module released for the global market, supporting 5G standalone network (SA) and non-standalone network (NSA) network architectures.

18 Jul

A Brief History of Insulated Gate Bipolar Transistors (IGBTs) with Curated TechInsights Analysis

Two groundbreaking advancements have shaped the landscape of IGBT development, including the advantages of trench and field stop technology, also known as soft punch-through.

18 Jul

The Vivo V2 Brings More High-Speed Interfaces, Better Image Processing Capabilities

Image Sensor subject matter expert Jefferson Chua discusses what makes this ISP impressive in his blog.

This report (MFR) provides an analysis of the floorplan design used in the SpecTek PT040-56B DDR5 DRAM (Micron 1α) and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.

18 Jul

Meta AI Chip Targeted Recommenders

Meta has developed an AI accelerator chip called MTIA, following in the footsteps of Google and Amazon. Employing RISC V CPUs and fixed-function units, the chip offered 102 INT8 TOPS at 25 W TDP.

17 Jul

Lightelligence Connects Chiplets

Lightelligence’s ONoc interposer connects chiplets optically through silicon waveguides on a monolithic multireticle substrate. The company launched a machine-learning application as a demonstrator.

17 Jul

MLPerf Benchmarks GPT Training Times

The MLPerf benchmark added tests to assess GPT-training performance. AI processors from Nvidia and Intel (Habana) both exhibit good scaling.

17 Jul

Deep Dive Teardown of the Harman 4D DSS Booster ALEV4-02 Automotive

The Harman 4D DSS Booster is a part of Bowers & Wilkins 4D Diamond Surround Sound used in BWM iX vehicles.

17 Jul

STMicroelectronics VB56G4A 1.5 MP Resolution 2.61 μm Pixel Pitch Stacked Back-Illuminated Monochrome CMOS Image Sensor Device Essentials

This report presents a device essentials (DEF) of the STMicroelectronics VB56G4A 1.5 MP resolution, 2.61 μm pixel pitch, stacked back-illuminated monochrome CMOS image sensor for automotive applications.

17 Jul

Deep Dive Teardown of the Samsung A34 5G SM-A346E/DSN Smartphone

Compared to Samsung's A32 5G and A42 5G, the A34 5G has an entirely different RF design even though some ICs are the same.

17 Jul

Taiyo Yuden FSFCSR1T2G44EG66 Film Bulk Acoustic Wave Resonator (FBAR) Filter Process Analysis

This report presents a process analysis (AFF) of the Taiyo Yuden FSFCSR1T2G44EG66 Film Bulk Acoustic Wave Resonator (FBAR) Filter, extracted from the Honor 70 5G smartphone.

17 Jul

Flagship Smartphone Camera Showdown: iPhone 14 Pro Max vs. Galaxy S23 Ultra

TechInsights recently conducted a comparison between the camera systems of two prominent flagship smartphones: the Apple iPhone 14 Pro Max and the Samsung Galaxy S23 Ultra. Explore the image sensor components featured in these two leading flagship smartphones in the TechInsights Platform.

Apple remains the shipments leader in Bluetooth True Wireless Stereo (TWS) headsets.

10 Jul

RF Industry Review Q1 2023: Financials

Mobile phone shipments decreased and radio component supplier sales dropped sequentially.

10 Jul

Sustainability is a valley of mole hills. Becoming Great: KLA.

Sustainability is a valley of mole hills. Becoming Great: KLA. G. Dan Hutcheson The Chip Insider® Summary: Sustainability is a valley of mole hills … or maybe it should be named Mole Hill Valley because as I see it, dealing with so many mole hills is

10 Jul

Arm G720 Adds New Rendering Path

Fifth Generation Mali/Immortalis GPU Architecture Defers Vertex Shading

Global fitness band industry revenues slowed their rate of declines last quarter, dropping by just 17% in Q1 2023 (after dropping 30% - 45% during each of the prior 6 quarters).

07 Jul

AMD Ryzen 9 7950X3D TSMC SoIC Package Technology Advanced Packaging Analysis

This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the AMD Ryzen 9 7950X3D (second generation 3D V-Cache).

07 Jul

VALUE SHARE: Global Smartwatch Revenue and ASP by Vendor by Price Tier: Q1 2023

This field is used for the Short Desc in the eStore Report Store Item.

04 Jul

Providing Good Service to the Semiconductor Industry Matters

Providing Good Service to the Semiconductor Industry Matters Share This Post TechInsights invites you to learn about each award recipient in the 2023 Customer Satisfaction Survey. This week: PLASMA and TECHNOPROBE. 10 BEST Suppliers: Large Chip

04 Jul

Deep Dive Teardown of the Nanoleaf Essentials Matter Smart Bulb NL67E100 Smart Bulb

The Nanoleaf Essentials Matter Smart Bulb has the capability of 16 million colors and tunable white tone adjust with a dedicated App.

30 Jun

Survey Plus Teardown of the Samsung Galaxy A54 5G SM-A546E/DS Smartphone

There are many similarities between the Samsung Galaxy A54 to the Galaxy A34.

30 Jun

Technoprobe - Rated THE BEST Test Subsystem Supplier

TechInsights invites you to learn about each recipient of the 2023 Customer Satisfaction Survey. This week: Technoprobe

This report presents a standard floorplan analysis (FAR) of the Vivo V2 Image Signal Processor, extracted from the Vivo X90 Pro 5G smartphone.

30 Jun

TechInsights' Semiconductor Analytics Report

30 Jun

Reverse Engineering VINATech Hybrid Capacitors used in the Samsung TV Remote Control.

Part 1: Electrochemical Characterization.

Some Samsung televisions come with a remote based on hybrid supercapacitors instead of batteries.

28 Jun

Deep Dive Teardown of the Denso Global Safety Package 3 Forward Camera 8646C-78051 Automotive Camera

Designed by Denso, the Vision SensorCamera is a part of theGlobal Safety Package 3, the third generation of this system.

28 Jun

It's cold and foggy as we head into 2H23

It's cold and foggy as we head into 2H23 Shereen Vaux Order activity for semiconductor equipment increased but remains at a cold 42 °F. Micron’s earnings report on June 28 will give us some more visibility on how the memory industry fared in 2Q23 and

This report presents a basic floorplan analysis (BFR) of the Bestechnic BES2700YP Bluetooth 5.3 Audio SoC, extracted from the Huawei FreeBuds Pro 2 wireless earbuds.

27 Jun

Intel’s IFM and IMS. Lam’s new Bevel-Dep tool.

Intel’s IFM and IMS. Lam’s new Bevel-Dep tool. G. Dan Hutcheson The Chip Insider® Summary: What’s Happening and What’s the Meaning: Intel adopts Internal Foundry Model … Stock falls: Was it correlation with or without causation? … AMD also fell … is

26 Jun

Samsung 1a 16Gb LPDDR5X DRAM Transistor

This report presents Key DC electrical characteristics for NMOS and PMOS transistors located in the word line drivers and sense amplifiers regions of the Samsung K4L6E165YC die found inside the Samsung K3KL3L30CM-BGCT LPDDR5X SDRAM package.

26 Jun

SunLune Jasminer X4 Ethereum Miner ASIC Advanced CMOS Essentials

This report presents an advanced CMOS essentials (ACE) analysis of the SunLune Jasminer X4 Ethereum miner ASIC.

26 Jun

Micron Technology MT29F4T08EMLCHD4-RES_C 232-Layer 3D NAND Flash Memory Advanced Memory Essentials

This report presents an advanced memory essentials (AME) of the Micron Technology MT29F4T08EMLCHD4-RES_C 232-Layer 3D NAND flash memory, extracted from the Inland TD510 2 TB solid state drive.

23 Jun

Sony Introduces the First Line-up of LYTIA Branded CIS Products for Smartphones

Sony Introduces the First Line-up of LYTIA Branded CIS Products for Smartphones Share This Post The Smartphone industry has begun to embrace the arrival of DSLR-level capabilities in today’s smartphone cameras. The introduction of large format 1-inch

23 Jun

Global Smartphone Monthly Shipments (Sell In), Sales (Sell Through) and Inventory Variance by Vendor: June 2023

TechInsights tracked global smartphone shipments (sell in) and sales (sell through) went down -7% YoY and -8% YoY in May 2023 respectively.

23 Jun

eSIM for Massive IoT: New IoT eSIM Specification (SGP.32)

On 26th May 2023, the latest IoT eSIM specification (SGP.32) was released by GSM Association.

23 Jun

2023 ADAS ECU Market Share Estimates

This Excel file contains ECU market share estimates for key ADAS technologies - a market expected by TechInsights to be worth over $15.5 billion in 2023.

23 Jun

Global Wearables Microvendor Market Share: Q1 2023

A huge number of second-tier MICROVENDORS are playing a meaningful role in the global wearables market, flooding the market with new, niche, and segmented offerings.

23 Jun

Visibility remains low as we enter 2H23 (June Update)

Visibility remains low as we enter 2H23 (June Update) Shereen Vaux Order activity for semiconductor equipment increased but remains at a cold 42 °F. There were some notable changes made to our forecasts this month. ICs were upgraded; sales are now

22 Jun

This report presents a standard floorplan analysis (FAR) of the ams OSRAM ISP Die from Mira220, 2.2 MP Resolution, 2.79 μm Pixel Pitch Stacked Back-Illuminated NIR Enhanced Voltage Domain Global Shutter CMOS Image Sensor.

22 Jun

Webinar: The Rise of Automotive Subscriptions

This webinar will review the progress toward this vision thus far, the barriers to adoption, and the emerging opportunities for car makers, service providers, and other market sectors.

This report presents a power package analysis of the MPS MPM3683-7 16 V, 8 A Step-Down Power Module Package-in-Package QFN.

19 Jun

Rebellions Optimizes Chip For Latency

South Korean AI startup Rebellions has launched Atom, an AI-accelerator card targeting the high-frequency trading market. The company has raised over $100 million and has released ResNet-50 MLPerf benchmark performance data.

19 Jun

CXM GPUs Add HDR to Mainstream

Imagination Technologies’ new licensable CXM GPU family brings high-dynamic-range (HDR) support to its mainstream offering. With three new models, the company claims high area efficiency.

Global smart speaker and smart display shipments in Q1 2023 declined by 6.9% year-over-year to 33 million units, marking the second quarter of market contraction in a row.

16 Jun

Deep Dive Teardown of the Huawei Pocket S BAL-AL60 Smartphone

The Huawei Pocket S was released on November 11, 2022. This is a cheaper version of another flip smartphone, the Huawei P50 Pocket.

16 Jun

TechInsights' Semiconductor Analytics Report

16 Jun

Retro Tech: Nintendo DS

Discover the groundbreaking Nintendo DS, a handheld gaming console with dual screens and touchscreen capabilities. Explore innovative gameplay and interaction possibilities with its unique design. Learn more about this iconic device in the TechInsights Platform's original Teardown.

This analysis looks at the global Electronic Warfare Support (EWS) market across domain, function, form factor/platform as well as frequency and power categories.

14 Jun

Order activity edged higher as visibility remains limited

Order activity edged higher as visibility remains limited Shereen Vaux Order activity for semiconductor equipment edged higher but remains at a cold 41 °F. The increase was driven by Subcon/Advanced Packaging and DAO (Discrete, Analog, and Other)

14 Jun

Mobile RF Briefing

Capitalize on 5G Growth with Innovative RFFE Design Insight

14 Jun

IoT Connectivity SoC Briefing

Leverage the technical innovation and evolution of wireless connectivity for competitive advantage

13 Jun

Intel’s PowerVia and IBM Research’s hybrid bonding

Intel’s PowerVia and IBM Research’s hybrid bonding G. Dan Hutcheson The Chip Insider® Summary: Intel’s PowerVia: Intel disclosed more about its backside power development at this year’s VLSI Symposium, while promising to deliver it in 2024. What it

12 Jun

CircuitVision Analysis of the PA Die D1QM7718033 from the Qorvo QM77180 Module

The following is a CircuitVision Analysis report on one of the two power amplifier (PA) dies in the Qorvo QM77180 RF Front-End (RFFE) Module.

12 Jun

Enhanced Block Diagram Analysis on the Samsung Galaxy S23 Ultra 5G (S918U) Smartphone

The following is an Enhanced Block Diagram Analysis report on the Samsung Galaxy S23 Ultra 5G (S918U) Smartphone.

The economic slowdown combined with the post-COVID lull in product demand brought the tablet market down to pre-pandemic territory at 33.4 million units, down -19% year-on-year.

12 Jun

Analysis: Amazon, Huawei, OnePlus Broaden Detachable Segment

Despite a tablet market beset by economic challenges and post-COVID saturation, May 2023 was a busy month for global tablet releases.

This report presents a power floorplan analysis (PFR) of the Infineon IMYH200R012M1H CoolSiC 2000 V 12 mΩ SiC Trench MOSFET.

08 Jun

TechInsights' Semiconductor Analytics Report

08 Jun

Retro Tech: Sega Dreamcast

The Sega Dreamcast, a home video game console, made its debut in Japan in November 1998, followed by its release in other regions. Despite its relatively short lifespan, the Dreamcast left a lasting impact on the gaming industry and is fondly remembered by many gamers.

Moffett, a startup headquartered in Shenzen, China, has released AI accelerators that address sparsity to increase performance 32x. The company offers three cards spanning a 70–250 W TDP range.

05 Jun

AmpereOne Lowers Server-Rack Power

The Arm-compatible AmpereOne server processor implements 192 single-thread cores of Ampere’s own design in a chiplet-based package.

This report presents a power essentials summary (PEG) of the Innoscience INN040W048A 40 V Bi-Directional 4.8 mΩ GaN-on-Silicon Enhancement Mode HEMT, extracted from the OnePlus Ace 2 smartphone.

This report presents a Memory Floorplan Analysis of the UNIC DH40G DRAM die found inside the SunLune Technology P3J706-01.

02 Jun

Murata NJ23-A1 Temperature Compensated Surface Acoustic Wave (TC-SAW) Filter (Murata HFQRXxxxx-K95) Process Analysis

This report presents a process analysis (AFS) of the Murata NJ23-A1 temperature compensated surface acoustic wave (TC-SAW) filter from the Murata HFQRXxxxx-K95 RF front-end module.

01 Jun

Sunwoda-Amperex Technology Limited (ATL) A2519 Lithium-Ion Battery Pack

This report presents an analysis of the Amperex Technology Limited (ATL) A2519 battery found in the Apple MacBook 14” Pro 2023 laptop.

01 Jun

Sony IMX500

Samsung was the leader in foldable display smartphone shipments in Q1 2023, followed by Huawei and OPPO.

26 May

MediaTek MT6639 is Wi-Fi 7 ready!

Given the benefits of higher throughput and speeds available in Wi-Fi 7, market leaders such as Qualcomm and MediaTek are looking to ensure their systems on chips (SoCs) are Wi-Fi 7 ready/compliant.

26 May

Vivo IQOO Neo 7 V2231A Smartphone

Released in October 2022, the Vivo IQOO Neo7 has been equipped with a new generation processor –the MediaTek Dimensity9000+ (4nm technology) providing the efficient operation of this device. In comparison to the 9000 version, it has a 5% increase of CPU power and a 10 % increase of GPU power.

26 May

Baseband Market Share Tracker Q1 2023: Qualcomm, MediaTek takes big hits but bottom is in sight

This report tracks the quarterly cellular baseband unit shipments, ASPs and revenues of 21 baseband chip vendors across six air interface technologies and includes data from Q1 2008 to Q3 2023.

The global smartphone image sensor market crossed USD 3 Billion in Q1 2023.

25 May

With 2H23 right around the corner, will the rebound happen?

With 2H23 right around the corner, will the rebound happen? Shereen Vaux Order activity for semiconductor equipment continued to hit new lows. Mobile Compute and Digital Consumer segments led the decline, reflecting persistently weak end demand. On a

25 May

TechInsights' Semiconductor Analytics Report

25 May

THE HIGHEST- RATED SUPPLIERS OF TEST CONNECTIVITY SYSTEMS ⃰ - PROBE CARD SUPPLIERS

Technoprobe and FormFactor earn 5 Stars from customers as the 2023 Highest-Rated Test Connectivity Suppliers in the TechInsights Customer Satisfaction Survey.

24 May

Embedded Voice Assistants in the Home: The Technology

The continued growth of voice recognition technology is inevitable and vendors of CE devices without embedded voice must consider building a Voice Assistant (VA) into their products.

24 May

Sony CXD5610GF GlobalFoundries 22FDX eMRAM Memory Floorplan Analysis

This report presents a Memory Floorplan Analysis of the GlobalFoundries CXD5610_die found inside the Sony CXD5610GF.

24 May

Cissoid CMT-PLA9869 1200 V 40 mΩ SiC Floorplan Analysis

This report presents a Power Floorplan Analysis of the CISSOID CMTPLA9869 device.

This report is TechInsights annual compilation of the Top 10 providers of Interactive residential security services in the US.

23 May

Survey Plus Teardown of the Xiaomi Redmi K60 23013RK75C Smartphone

The Xiaomi Redmi K60 23013RK75C is a mid-range smartphone based on the Qualcomm platform.

23 May

Semidynamics Performs RISC–V Surgery

Semidynamics Performs RISC–V Surgery Semidynamics offers fully customized RISC–V CPUs for clients requiring capabilities beyond what’s readily available. The ability to maintain many outstanding memory requests boosts performance for applications

22 May

Broadcom Retargets Jericho at AI Clusters

Broadcom is challenging the conventional topology linking AI engines in training supercomputers/clusters, offering a version of its Jericho Ethernet switch chip set for AI.

22 May

Hailo Releases Second-Generation Chip

Israeli startup Hailo has released the Hailo 15, its second-generation chip for smart cameras. Hailo 15 is a standalone processor with an AI engine and comes in three variants ranging from 7 to 20 TOPS.

OPPO (OnePlus)’s smartphone shipments went down -7% YoY in Q1 2023. It was the six quarter in a row that the vendor posted annual decline.

19 May

Q1 '2023: Transsion: Triple Digit Growth in Central Latin America

Transsion’s global smartphone shipment decline -12.6% YoY, along with the total handset shipment went down -4.6% YoY.

19 May

Deep Dive Teardown of the PlayStation VR2 CFI-ZVR1 VR Headset

The Sony PlayStation VR2 is a second-generation VR headset by Sony, dedicated for use with PlayStation consoles.

19 May

Automotive LiDAR GaN Design Wins

Light detection and ranging (LiDAR) is a technology with huge growth potential. The first concepts were introduced in the 1960s, shortly after the invention of the laser, and the recent opportunities in surveying, aerospace, and autonomous vehicles have really driven growth.

18 May

THE BEST Semiconductor Equipment Supplier Rankings for 2023

Congratulations to THE BEST Suppliers of 2023. Here is what Customers rated them best at and how they are rated overall.

18 May

Qualcomm HB15I ultraBAW Bulk Acoustic Wave (BAW) Acoustic Filter from Qualcomm QPM6679 5G RF Front End Module Process Analysis Report

This report contains the results of the process analysis of the Qualcomm bulk acoustic wave (BAW) resonator acoustic filter die HB15I from the Qualcomm QPM6679-1V3.

17 May

Global Handset Vendor Marketshare for 15 Countries : Q1 2023

Global handset shipments declined significantly again by -18% annually in Q1 2023, impacted by many unfavorable issues including sluggish consumer demand, geo-political issues, and rising inflation across the world.

17 May

SonyIMX500, 1/2.3”, 12.3 MP, 1.55 μm Pixel Pitch Stacked Back-Illuminated Exmor RS CMOS Image Sensor with Embedded Artificial Intelligence for Machine Vision Device Essentials Summary

The IMX500 sensor is intended for use in enterprise-class security cameras and monitors in industrial equipment systems.

17 May

10 BEST Semiconductor Equipment Supplier Rankings for 2023

Advantest, ASML, ASMPT Limited, FormFactor, and EV Group earn TechInsights' Five-Star Ratings in the 2023 10 BEST.

17 May

Recovered Cobalt in Rechargeable Batteries

A Game-Changer for Sustainability or a Compromise on Performance?

16 May

TCL LinkHub 5G HH515V Router

The TCL 5G, WiFi6 home link hub is designed basis on FibocomFG360-EAU 5G Communication Module prepared in line with Europe market regulations.

16 May

VR Headset Platform Share 2014-2022

This report examines the share of shipments, installed base, and revenues for each of the major platforms. These include Google Cardboard, Daydream, Samsung Gear VR, HTC, Oculus, Windows MR and Sony PSVR.

16 May

SK Hynix D1a EUV 16 Gb DDR5 DRAM Transistor Characteristics

This report presents Key DC characteristics for NMOS and PMOS transistors located in the word line drivers and sense amplifiers regions of the SK Hynix MDHD5C20101die found inside the SK Hynix H5CG48AGBD-X018 DDR5 SDRAM package.

16 May

Micron 2400 MTFDKBK2T0QFM SSD

The Micron 2400 SSD is the world’s first 176-layer QLC NAND based PCIe Gen 4.0 x 4/NVMe 1.4 SSD.

16 May

Apple HomePod 2nd Gen A2825 Smart Speaker

The Apple HomePod 2nd Gen A2825 is a voice-interactive smart speaker and home assistant. Compared to the A16339, the has seven microphones (one more than the A1639) and beam-forming technology allows the user to perform a wide range of actions by using voice commands.

16 May

Samsung K3KL4L40DM-BGCT LPDDR5X DRAM Memory Floorplan Analysis

This report presents a Memory Floorplan Analysis of the Samsung K4L2E165YD die found inside the Samsung K3KL4L40DM-BGCT.

16 May

Recycled Cobalt in Rechargeable Batteries

This article explores the multifaceted landscape of cobalt in technology, the environmental impacts of cobalt extraction, and the opportunities and challenges posed by the growing demand for recycled cobalt.

16 May

MediaTek Dimensity 9200 Application Processor TSMC 4 nm

This report presents a Digital Floorplan Analysis of the AHJ11296B die found inside the MediaTek MT6985W application processor. The MediaTek MT6985W was extracted from a Vivo X90 Pro 5G smartphone.

15 May

Apple iPhone Shipments by Model: Q2 2007 to Q1 2023

Apple global iPhone shipment marginally declined -4% annually during Q1 2023, overperforming overmarket which went down -14% YoY.

15 May

U-Bolt Pro Smart Lock

Can Lower-Cost Smart Locks Open the Door to a $4.4B Smart Lock Market? Our ebook highlights the broad range of content available to TechInsights’ clients across our User Experience, Teardown, and Market Analysis capabilities.

15 May

Was the 2021 chip shortage real?

Was the 2021 chip shortage real? G. Dan Hutcheson The Chip Insider® Summary: Was the 2021 chip shortage real? This is the story of how the COVID Pandemic morphed into a Shortage Fever Pandemic, as the pandemic led to a shortage which turned into a

15 May

TPUv4 Interconnect Cuts Cost, Power

Google employs optical interconnect when building a 4,096-node AI supercomputer featuring its TPUv4 accelerator chip. The result is much higher potential performance coupled with a sharp drop in carbon emissions.

15 May

Dimensity 9200 Gets a Boost

The Dimensity 9200+ is a midlife kicker for MediaTek’s flagship smartphone processor, offering 5–10% more CPU and graphics performance than the original 9200. The company also renamed its low-end 5G products.

15 May

Component Price Landscape: First-Quarter 2023 Report

TechInsights is pleased to present the findings of the first-quarter 2023 report on The Component Price Landscape (CPL). This report provides valuable insights into the current state of the global macroeconomy and the electronics industry.

11 May

Q1 2023: Uber Approaches Profitability, Lyft Struggles

Uber’s results reflect a clever strategy of hedging against weaknesses in driver recruitment and retention as well as weakness in demand. Lyft has turned to layoffs to compete with Uber almost exclusively on price.

10 May

Order Activity Continues to Cool

Order Activity Continues to Cool Shereen Vaux Order activity for semiconductor equipment slipped a degree to a cold 41°. All segments moved lower as end demand remains weak, resulting in a slower pace of inventory digestion. In the mobile market

10 May

Design Costs too high? What’s after Moore’s Law?

Design Costs too high? What’s after Moore’s Law? G. Dan Hutcheson The Chip Insider® Summary: Are Semiconductor Design Costs too high? Since the seventies, there have been two common themes about cost leading to the destruction of the semiconductor

09 May

Flex Logix Drops Chips, Sticks With IP

Flex Logix Drops Chips, Sticks With IP Flex Logix is changing its business model, opting to offer its InferX block as IP and ceasing chip-building operations. It’ll serve chipmakers requiring either AI inference or DSP capability. Bryon Moyer Flex

08 May

Google Discloses TPUv4 Details

Google Discloses TPUv4 Details Google’s TPUv4 excels at AI models employing embeddings owing to its sea of SparseCores that supplement its two main cores. Targeting inference, the TPUv4i has only a single larger core to reduce power. Joseph Byrne

08 May

Synaptics Katana Targets Edge AI

Synaptics has launched its AI-enabled Katana processor for battery-operated edge devices in the security, biometrics, and smart-appliance markets. The chip includes an Arm CPU with a Tensilica DSP and a custom neural-network accelerator.

08 May

TechInsights' Semiconductor Analytics Report

05 May

Innoscience INN40W08 40 V Bi-Directional GaN

Gallium nitride (GaN) power semiconductor technology is disrupting the market in consumer electronics. This is a landmark moment in the success of wide bandgap technology and a further reputation boost to the reliability of a GaN device.

04 May

Order activity remains frigid

Order activity remains frigid Shereen Vaux Order activity for semiconductor equipment held at a cold 42°. SoC Mobile and SoC Digital Consumer continued to weaken. Subcon/Advanced Packaging hit a new low for the year as visibility remains low. Memory

03 May

China’s Semiconductor Strategy

China’s Semiconductor Strategy G. Dan Hutcheson The Chip Insider® Summary: China’s Secret Semiconductor Strategy & Tactics: As everyone knows, China’s public Semiconductor Strategy rests on Made in China 2025 and mil-civ fusion. The first was

02 May

Nordic, Silicon Labs Refresh Wireless SoCs

Nordic Semiconductor and Silicon Labs have updated their wireless multiprotocol SoCs for home and factory systems. Nordic improves the processing and radio, while Silicon Labs fills a package-size gap in its lineup.

01 May

TI Rolls Out Vision-Analysis Processors

Texas Instruments has launched Arm-based embedded processors for video analysis. They integrate the company’s proven C7x DSP and matrix unit to accelerate AI.

01 May

TechInsights' Semiconductor Analytics Report

28 Apr

It’s Going to be a Cold and Rainy Spring

It’s Going to be a Cold and Rainy Spring Shereen Vaux Order activity for semiconductor equipment fell by another point, hitting a new record low for the year. All segments moved lower as sentiment continued to weaken. ASML delivered another strong

25 Apr

SNUG, Inflation and our Industry

SNUG, Inflation and our Industry G. Dan Hutcheson The Chip Insider® Summary: SNUG: The Synopsys users group symposium … Synopsys decision, leadership, and management processes around integrating AI … HI and Chiplet Advances … How chiplets will grow

25 Apr

A Closer Look at the Motorola Edge 2022 (XT2205-3M)

The First FR2-capable Smartphone Built with MediaTek’s SoC chipset (Dimensity 1050)

25 Apr

Chatbots Can’t Yet Replace Analysts

Chatbots Can’t Yet Replace Analysts ChatGPT and other chatbots have raised concerns that they could replace humans. We analyze their relevance to the task of analysis and explain their inadequacies. Anand Joshi Chatbots have created a stir over

24 Apr

Startup Lemur Reduces RAM Requirements

Lemur Imaging’s LMR technology compresses image data by up to 50% with no visually perceptible loss in typical cases. A guaranteed compression ratio lets chips function with smaller image buffers.

24 Apr

Huge Hot Hopper Exhibits Energy Efficiency

The Version 3.0 MLPerf Inference results show data-center AI engines making gains relative to tests from six months ago. Nvidia continues post the highest scores, but Qualcomm achieved power-efficiency leadership on a couple tests.

24 Apr

It's always the darkest before dawn

It's always the darkest before dawn Shereen Vaux Order activity for semiconductor equipment held at a cold 43˚. There was no discernable change in activity among segments last week, as visibility for equipment suppliers remains limited. There were

20 Apr

TechInsights' Semiconductor Analytics Report

19 Apr

China’s Tech standards and foreign IP challenges

China’s Tech standards and foreign IP challenges G. Dan Hutcheson The Chip Insider® Strategy and Tactics: China’s Tech standards and foreign IP challenges Summary: Can China be successful with a standards wall strategy? Why China doesn’t respect

18 Apr

Ambarella CV72S Targets Security

Ambarella has launched the new CV72S, incorporating its third-generation CVflow architecture with a neural-network accelerator and hardware image signal processor. The chip targets high-end security cameras and adds radar support.

17 Apr

PUFs Generate Native Keys to Secure SoCs

Physically unclonable functions (PUFs) create externally inaccessible keys from unique chip characteristics. They can increase security and reduce the cost of provisioning hardware roots of trust.

17 Apr

Graphcore has revealed how it hybrid bonds a deep-trench-capacitor die and AI accelerator, describing manufacturing techniques and a voltage-swing reduction. A Shmoo plot shows how adding the capacitor die can cut power or boost the clock rate.

10 Apr

29 Mar

Snapdragon X75 Modem Improves Uplinks

Part of a radio subsystem, Qualcomm’s Snapdragon X75 modem for 5G simplifies boards by interfacing with a better-integrated RF transceiver. It also increases performance through more AI horsepower, enhanced uplink technology, and denser QAM.

27 Mar

Agilex 5 Floods FPGA Midrange

Intel has refreshed its midrange FPGAs, challenging market newcomers. The new family updates the fabric, CPUs, and DSPs while expanding the Agilex line.

27 Mar

Think Silicon GPU Accelerates Vectors

Think Silicon is among the few companies developing low-cost, low-power GPU IP, offering cores to accelerate 2D, 2.5D, and 3D graphics. The new Nema Pico VG adds support for vector graphics, enabling slick GUIs.

27 Mar

Can Samsung S23 Ultra Revive the Smartphone World?

The smartphone market experienced record-low shipments in 2022. Many smartphone manufacturers are looking to revive the market in 2023 and beyond, and Samsung’s recently released S23 Ultra shows promise to help with this revival.

24 Mar

SPIE ALP. Inventory out of control.

SPIE ALP. Inventory out of control. G. Dan Hutcheson The Chip Insider® SPIE Advanced Lithography and Patterning 2023: This is the penultimate conference on advanced lithography. Like many things, it goes through cycles of emergent behavior

24 Mar

TechInsights' Semiconductor Analytics Report

TechInsights' Semiconductor Analytics report

22 Mar

What can you learn from acoustic wave filter market leaders?

Radio design is characterized by tighter module integration with increased number of filters, switches, antenna tuners, and directional couplers.

22 Mar

Get an Exclusive Look at the Samsung S23 Ultra

Watch an exclusive sneak-peek video of our experts tearing down Samsung’s latest flagship smartphone release, the Samsung Galaxy S23 Ultra. Get an initial preview of the device’s technology components like the impressive 200-megapixel camera that gives users incredible photo quality rarely seen in the smartphone market.

22 Mar

TechInsights Uncovers Telsa’s Third Terminal

Curious about the latest breakthroughs in battery technology? Look no further than Tesla’s new 4680 battery cells. These innovative cells are designed to not only be larger and more energy dense, they also have a hidden feature: three terminals instead of the standard two.

22 Mar

NXP Offers Watermarks for AI Models

Trained machine-learning models can be valuable, and techniques have been developed to identify them in case of theft. NXP has introduced a tool that implements a straightforward approach to watermarking image-classification neural networks.

20 Mar

ST Tightens MCU Security

The STM32H5 family updates STMicroelectronics’ high-performance-MCU line with additional security. Installing the new Secure Manager software on the flagship model can yield a complete security suite with no required coding.

20 Mar

Marvell Adds Fusion Models to Octeon 10

Octeon 10 Fusion combines Arm Neoverse N2 CPUs, packet-processing hardware, DSPs, and in-line wireless accelerators. Targeting 5G infrastructure, it’s the only merchant-market integrated base-station processor for macrocells.

20 Mar

Logic Packaging Analytics Video Promotion Content

Accelerate your process with TechInsights' Logic Packaging Analytics

Are you finding the SoC and ASIC design challenging and time? It takes tremendous time and effort to build up knowledge of the industry, your competitors, your target market, and the product strategies of various SoCs. You may also need to understand critical competitive product benchmarks to achieve design efficiency and differentiation and to enhance your product's performance while optimizing for cost.

20 Mar

Rising macro uncertainties are impeding the prospects of 2H23 recovery

Rising macro uncertainties are impeding the prospects of 2H23 recovery Andrea Lati Order activity for semiconductor equipment remained steady at 45°. Both chipmakers and equipment suppliers are exercising caution regarding their near-term prospects

20 Mar

Disruptive Event - MediaTek’s Dimensity 1050 chipset AiP

Following up on MediaTek’s strong entry into the 5G mmWave market with their Dimensity 1050 chipset, TechInsights has discovered an innovative mmWave antenna array design in their MT6107O antenna-in-package (AiP) as used in the Moto Edge 2022, model XT2205-3 (Verizon edition), and not previously seen in AiP designs from Qualcomm, Murata, and Apple.

20 Mar

Grab your jackets! It's going to be a cold Spring! (March Update)

Grab your jackets! It's going to be a cold Spring! (March Update) Shereen Vaux Order activity for semiconductor equipment slipped to a chilly 45°. There were some notable changes made to our forecasts this month. The February data are in from the

17 Mar

Sustainability Panel at SPIE ALP

Sustainability Panel at SPIE ALP G. Dan Hutcheson The Chip Insider® Sustainability Panel at SPIE ALP: Why me? Which was my first question when they asked me to run this panel. As you know, until recently, I have considered sustainability to be a “boy

17 Mar

TechInsights' Semiconductor Analytics Report

TechInsights' Semiconductor Analytics report

15 Mar

Webinar: Minimizing Battery Degradation in Smartphones

This webinar reviews the existing industry fast charging techniques used by Apple, Samsung, and Xiaomi in their recent flagship smartphones. It was observed that these smartphones benefit from adaptive charging algorithms to suppress battery degradation, which would generally result from the high applied current.

14 Mar

Chiplet Technology Advances

Packaging technology goes hand in hand with chiplets. Examples include basic PCB-based 2D structures, passive silicon interposers and bridges for 2.5D packages, 3D packages employing active interposers, and hybrid bonding.

13 Mar

Generative AI on a Phone?

Generative-AI models such as ChatGPT are typically large and run only in the cloud, but Qualcomm recently demonstrated a smaller image-generation model called Stable Diffusion performing inference on a smartphone.

13 Mar

Ceva XC20 Enables Vector-Unit Sharing

The new Ceva XC20 architecture implements simultaneous multithreading in a vector DSP. The first product to use it, the XC22 more than doubles area efficiency compared with Ceva’s previous DSP cores.

13 Mar

25th Anniversary Issue of The Chip Insider. Why China will fail.

25th Anniversary Issue of The Chip Insider. Why China will fail. G. Dan Hutcheson The Chip Insider® 25 Years Ago Today, I started a new e-mailing to subscribers to address the increasing need for instantaneous analysis of events in a time when market

10 Mar

TechInsights' Semiconductor Analytics report

02 Mar

Does it Offer the Best Zoom Performance in the Industry? TechInsights take a look inside the camera hardware.

22 Feb

TechInsights' Semiconductor Analytics report

22 Feb

Alif MCUs Combine Arm Cortex and Ethos

Targeting IoT, wearables, consumer electronics, and robotics, Alif Semiconductor is building microcontrollers that consume less than 1 W and provide up to 250 GOPS using Arm Cortex CPUs and Ethos AI units.

21 Feb

M2 Pro, Max Boost GPU Performance 30%

Apple’s new M2 Pro and M2 Max offer more CPU, GPU, and AI performance than their predecessors, helping the company maintain its differentiation.

21 Feb

Editorial: Intel Struggles Continue

Two years into his tenure, CEO Pat Gelsinger continues to oversee major product delays. As profits fade, he must consider axing some of the company’s emerging businesses to meet expense targets.

21 Feb

Technology Export Controls, Fab utilization and chip inventory

Technology Export Controls, Fab utilization and chip inventory G. Dan Hutcheson The Chip Insider® Multilateral Technology Export Controls: Do they work? The historical throughline to today’s rising export controls – with the United States trying to

17 Feb

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

10 Feb

TechInsights hosted 3 webinars focused on Mobile RF technology and trends to watch for in 2022. With commentary, insights, and predictions from some of the top minds in the Mobile RF landscape, the TechInsights’ subject matter experts discussed who will be the dominant RF players, the different approaches taken to address the increased complexity brought by new standards, and the new antenna modules used by Apple in the iPhone 12 and 13.

02 Feb

Hybrid Bonding Technology - 2023 and beyond

Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.

01 Feb

20 Jan

Visibility is low as the storm intensifies

Visibility is low as the storm intensifies Shereen Vaux Order activity for semiconductor equipment held at a chilly 50 degrees The decline has moderated over the last few weeks with most segments remaining unchanged The December data from the

19 Jan

11 Jan

TechInsights Critical Subsystems Commodity Ceramics Summary on the Platform

TechInsights Critical Subsystems Commodity Ceramics Summary on the Platform Updates included are the following: Driving Forces Misc. Reports Commodity Ceramics 230110 We recently completed a focused report on commodity ceramics (includes Alumina

11 Jan

Roads are icy as fog clouds visibility

Roads are icy as fog clouds visibility Shereen Vaux Order activity for semiconductor equipment held at a chilly 50 degrees. All segments remained the same from last week, with the exception of Memory which continued to lose ground Memory continues at

10 Jan

Sapphire Rapids Scales to 60 CPUs, 8 Sockets

Intel’s new Xeon delivers upgrades in core count and accelerators. It also updates the company’s server platform with PCIe Gen5, DDR5, and CXL.

10 Jan

Year in Review: Established IP Vendors Jump on RISC-V

Over the past year, a few CPU-IP vendors have adopted RISC-V, challenging both Arm and RISC-V startups. Meanwhile, AI-accelerator vendors are jockeying to stand out in a crowded field.

09 Jan

Year in Review: Data-Center Chips Buck a Downturn

The year 2022 saw AI accelerators and DPU becoming mainstream in data center servers. Chiplets came to more CPUs while the chip power consumption reached a new high, necessitating a rethink in cooling.

09 Jan

The Chip Insider’s Strategic Forecast

The Chip Insider’s Strategic Forecast G. Dan Hutcheson The Chip Insider® The Chip Insider’s Strategic Forecast for 2023: Here’s what I believe the important strategic issues will be this year in the supply chain. These are the areas where you need to

06 Jan

SemiWEEK: 2023 is starting off with a blizzard; Semiconductor sales fell in a normal holiday dive; Stocks grew

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

06 Jan

TechInsights Critical Subsystems Driving Forces Update on Platform

TechInsights Critical Subsystems Driving Forces Update on Platform Updates included are the following: Driving Forces Device Forecast Summary Forecast for Electronics Revenues Forecast for Semiconductor Revenues, Unit Shipments, and ASPs An updated

05 Jan

A Trip Down TSMC Memory Lane – Part 2

Logic Blog A Trip Down TSMC Memory Lane – Part 2 Dick James To start Part 2 of the blog, we backtrack to 1998, when the 0.25-µm process was launched. One of the comments from Shang-Yi Chiang’s (former VP of R&D at TSMC) oral history was that when he

05 Jan

TechInsights' Semiconductor Analytics report

04 Jan

NXP’s i.MX9 Gets 10G Ethernet

NXP’s i.MX95 family targets industrial and automotive systems as well as consumer ones. With several CPUs and three computing domains, it exceeds what’s available today, but that gap may narrow by the time it ships.

04 Jan

2023 is starting off with a blizzard

2023 is starting off with a blizzard Shereen Vaux Order activity for semiconductor equipment continued to decline, falling to a chilly 50 degrees The decline moderated last week with only memory and DAO retracting It should not come as a surprise

03 Jan

Intel Fills Out 13th Generation

Intel revealed more of its 13th Core generation, codenamed Raptor Lake. Four mobile families launched along with more desktop models. The company also updated its N-series processors.

03 Jan

The Race for the Smallest Pixel Size

The race for smaller pixel sizes in CMOS image sensors (CIS) has reached new heights.

23 Dec

Recent PMIC Innovation and an Automotive Market Outlook: On-Demand Video

Webinar - On Demand Recent PMIC Innovation and an Automotive Market Outlook Enter the password sent to your email below to view the webinar. To ensure email delivery, add TInews@techinsights.com to your address book, contacts, or safe sender list.

22 Dec

Mobile RF Year in Review - Who Made Our Top Picks for 2022?

Mobile RF Blog Mobile RF Year in Review - Who Made Our Top Picks for 2022? 2022 has been a busy year in the mobile RF landscape. TechInsights’ team of subject- matter experts and analysts have been hard at work identifying the key events

20 Dec

Ventana Veyron Scales to 192 Cores

Startup Ventana has revealed Veyron, its RISC-V compute chiplet for server processors. Performance of a Veyron-based processor could rival that of server processors from AMD and Intel.

19 Dec

Auto Chips Drive New Architectures

This past year saw the introduction of new automotive chips that will power 2024-model-year vehicles. Driving the move towards domain and zonal architectures, they realize ideas that have been conceptual up to now.

19 Dec

China’s AI Tiger Roars

Disruptive Event - AMD Instinct MI210 GPU Accelerator

Silicon Bridge Disruptor: SPIL enters the race with a new offering found in AMD MI210

15 Dec

Webinar – Recent PMIC Innovation and an Automotive Market Outlook

Join TechInsights’ Power Subject Matter Expert, Dr. Stephen Russell and Strategy Analytics’ Executive Director of the Powertrain, Body, Safety & Chassis (PBCS) and Electric Vehicles Service (EVS), Asif Anwar, as they present the Recent PMIC Innovation and an Automotive Market Outlook Power webinar.

15 Dec

Disruptive Event - Stratio BeyonSense SWIR Camera

The BeyonSense Short Wave Infra-Red (SWIR) Sensor is part of a new generation of image sensors that capture light beyond the visible spectrum enabling imaging and sensing devices to see beyond the visible spectrum and into the internal structure of an object.

14 Dec

SEMI ISS Europe 2023 to Spotlight European Chips Act with Focus on Growth, Talent, Sustainability and Supply Chain

SEMI ISS Europe 2023 to Spotlight European Chips Act with Focus on Growth, Talent, Sustainability and Supply Chain VIENNA, Austria — December 13, 2022 — Leading analysts, economists, policymakers and technologists will gather at the SEMI Industry

13 Dec

2022 Semiconductor Materials Market Concludes as Another Solid Year Amid Rising Economic Challenges

2022 Semiconductor Materials Market Concludes as Another Solid Year Amid Rising Economic Challenges San Diego, CA, December 13, 2022: TECHCET—the electronic materials advisory firm providing business and technology information— announced that the

13 Dec

SEMI Taiwan Launches Rating Service to Strengthen Cybersecurity Across Taiwan Chip Ecosystem

SEMI Taiwan Launches Rating Service to Strengthen Cybersecurity Across Taiwan Chip Ecosystem HSINCHU, Taiwan – December 13, 2022 – Taking aim at hardening the Taiwan semiconductor ecosystem’s defenses against cyberattacks, SEMI has launched a

13 Dec

SEMICON Japan 2022 Opens Tomorrow to Showcase Cutting-Edge Technologies Powering Semiconductor Industry Growth

Opening keynote panel to feature Rapidus representatives discussing strategies for strengthening Japan’s semiconductor industry.

13 Dec

Global Total Semiconductor Equipment Sales Forecast to Reach Record High in 2022, SEMI Reports

Global Total Semiconductor Equipment Sales Forecast to Reach Record High in 2022, SEMI Reports TOKYO — December 13, 2022 — Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a new

13 Dec

Global Chip Industry Projected to Invest More Than $500 Billion in New Factories by 2024, SEMI Reports

Global Chip Industry Projected to Invest More Than $500 Billion in New Factories by 2024, SEMI Reports MILPITAS, Calif. — December 12, 2022 — The worldwide semiconductor industry is projected to invest more than $500 billion in 84 volume chipmaking

12 Dec

Pre-Registration Opens for Chiplet Summit

Pre-Registration Opens for Chiplet Summit SAN DIEGO, CA – December 9, 2022 — Chiplets Shorten Chip Design Cycles. Chiplet Summit opens pre-registration today for its first annual event. It will occur on January 24-26 at the Doubletree by Hilton San

12 Dec

Hopper Leads MLPerf Training Scores

The newest MLPerf training results include scores for Nvidia’s Hopper H100. Depending on the subtest, the H100 is 7–160% faster than its predecessor. No other AI processor is as fast.

12 Dec

MediaTek Boosts Budget Chromebooks

MediaTek’s new Kompanio 520 and 528 serve entry-level Chromebooks. With two higher-tier series targeting mid- and top-tier Chromebooks, the company has been free to optimize the new chips for cost and power.

12 Dec

Pentonic 1000 Upgrades 4K TVs

MediaTek’s newest smart-TV processor targets high-end 4K screens that display up to 120 frames per second (4K120). It features AI-enabled upscaling and can display eight video streams at once.

12 Dec

Questions & Answers: Case for a Mild Slowing and How TSMC took the lead in EUV

Questions & Answers: Case for a Mild Slowing and How TSMC took the lead in EUV G. Dan Hutcheson The Chip Insider® Questions & Answers: The Case for a Mild Slowing in 2023 (2 Dec 2022): Read Dan's article but am confused. Is Dan just offering up a

09 Dec

SemiWEEK: The Case for a Mild Slowing in 2023. Semiconductor Cyclicality; Stocks fell

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

09 Dec

Foundry & IDM Capital Expenditures 4Q2022

Foundry & IDM Capital Expenditures 4Q2022 Shereen Vaux 2023 is going to be a down year for semiconductor spending. Chipmakers have caught up to demand and the inventory buildup turns from a tailwind in 1H22 into a headwind in 2H22 and continues into

09 Dec

CEA-Leti Presents Path Towards Full Fault-Tolerant Quantum Computing with Si-Based VLSI Technologies

Related Paper Covers Efficient Characterization Flow of Industrial Grade Si-Based Qubits, Invited Paper Reports Breakthrough on Path Toward Cryogenic Compact Model.

08 Dec

eBook: Xiaomi Mi 12 Pro and the SurgeP1 Charging IC

This eBook takes an in depth look at Xiaomi's Mi 12 Pro's HyperCharging Protocol implemented by the Xiaomi SurgeP1 IC, which enabled the achievement of a full charge time of only 19 minutes for their Xiaomi Mi 12 smartphone.

08 Dec

Fractilia Dares Chipmakers to Take the Fractilia Challenge

“Fractilia Challenge” program invites chipmakers to send SEM images to Fractilia for analysis with its FAME stochastics control product at no cost with unsurpassed tool-to-tool matching results

07 Dec

3D-Micromac and Schott join forces to improve yield and cost of production of augmented reality waveguides

Joint development partnership to focus on dedicated laser cutting process and mass production system for SCHOTT RealView® high refractive index glass

07 Dec

TechInsights' Semiconductor Analytics report

07 Dec

Disruptive Event - Apple’s H2 BT 5.3 Audio SoC

Apple’s H2 BT 5.3 audio SoC – elevating the audio experience in the AirPods Pro 2

07 Dec

Joseph Byrne Becomes Editor-in-Chief

Joseph Byrne is now editor-in-chief of Microprocessor Report, replacing Linley Gwennap. Linley will continue as editor emeritus, serving on the editorial board and contributing articles.

05 Dec

Prestera DX1500 Unifies IT/OT Networks

Marvell’s Prestera DX1500 Ethernet switch targets converged IT/OT industrial networks. TSN, MACSec, and redundant-network protocols promote safety and reliability.

05 Dec

It's cold and gloomy

It's cold and gloomy Shereen Vaux Order activity for semiconductor equipment continued to decline, falling to 56 degrees The decline accelerated last week with all segments losing 2 or more degrees Major chipmakers are cutting utilization

05 Dec

Editorial: Arm’s No-Win Legal Fight

01 Dec

Webinar: Fan-Out Packaging Technologies - The Past and Future

TSMC, Apple, and Samsung have all leveraged different Fan-Out Packaging. Join us to get an update on the latest progress of Wafer Level and Panel Level Fan-Out Packaging.

01 Dec

The fog is clouding visibility Shereen Vaux Order activity for semiconductor equipment continued to cool off slipping, to 60 degrees The decline in the overall activity is starting to level off but remains below the Growth Decline Line All segments

23 Nov

16 Nov

It’s cold and foggy…

It’s cold and foggy… Shereen Vaux Order activity for semiconductor equipment extended its decline, slipping one point to 62 degrees Subcons/Advanced packaging was the only segment to increase last week which could be signaling a turn around in

16 Nov

TechInsights Critical Subsystems Silicon and Silicon Carbide Components report on the Platform

TechInsights Critical Subsystems Silicon and Silicon Carbide Components report on the Platform Summary data for Silicon and Silicon Carbide Components Report is now available on the TechInsights Platform: Driving Forces Misc. Reports Silicon and

16 Nov

A Trip Down TSMC Memory Lane – Part 1

Logic Blog A Trip Down TSMC Memory Lane – Part 1 Dick James A few months ago we published a blog on MOS process history, triggered by Pat Gelsinger’s keynote at the Intel Innovation Days in November last year, and while at the start it was generic

15 Nov

Webinar: Hybrid bonding technology - today and tomorrow

TechInsights experts review applications of hybrid bonding technology, and discuss what’s to come. This presentation compiles content from TechInsights’ subject matter experts in Memory, Image Sensor, and Logic, and from Engineers specializing in a variety of reverse engineering techniques.

15 Nov

N3E Will Be TSMC’s Main 3nm Node

TSMC’s enhanced 3nm process, N3E, employs fewer double-pattered EUV layers and allows more flexibility in the number of transistor fins than its predecessor, N3.

14 Nov

Eliyan Doubles UCIe Bandwidth

A serdes transceiver from Eliyan allows 32Gbps bidirectional chiplet signaling. It can reduce system cost in some systems by eliminating interposers or reduce power by halving speeds with no net bandwidth change.

14 Nov

Dimensity 9200 Continues Premium Push

MediaTek’s new top-of-the-line smartphone processor upgrades to the latest cores and protocols, offering ray tracing and other new capabilities for premium-phone buyers.

14 Nov

SMIC Reports 2022 Third Quarter Results

All currency figures stated in this report are in US Dollars unless stated otherwise.

11 Nov

ASML provides updated view on demand outlook, capacity plans and business model at Investor Day meeting

New share buyback program announced

11 Nov

SemiWEEK: The fog has rolled in; CSUBS Driving Forces Forecast Update; Stocks jumped

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

11 Nov

TechInsights Critical Subsystems Driving Forces Update on Platform

TechInsights Critical Subsystems Driving Forces Update on Platform Updates included are the following: Driving Forces Device Forecast Summary History and Forecast for Electronics Revenues (not updated this month) History and Forecast for

10 Nov

YMTC’s Xtacking 3.0 – Not what TechInsights was expecting to see

Memory Blog YMTC’s Xtacking 3.0 – Not what TechInsights was expecting to see Contributing author: Chi Lim Tan Yangtze Memory Technology Company (YMTC) has been making headlines since it was founded in 2016. Considered China’s leading Integrated

10 Nov

EV Group Advances Leadership in Optical Lithography with Next-Generation EVG150 Resist Processing Platform Redesigned 200-mm platform increases module capacity for higher throughput, improves architecture for reduced tool footprint all while

08 Nov

SEMI Global Smart Manufacturing Conference Opens Tomorrow to Spotlight Industry 4.0 Best Practices

SEMI Global Smart Manufacturing Conference Opens Tomorrow to Spotlight Industry 4.0 Best Practices MILPITAS, Calif. — November 7, 2022 — Industry 4.0 experts and visionaries will present at the SEMI Global Smart Manufacturing Conference (GSMC)

07 Nov

Linley Fall Processor Conference 2022 Proceedings - Thank You

TechInsights' Semiconductor Analytics report

26 Oct

SIA Member Update

SIA Member Update Member Update Following landmark enactment in August 2022 of the CHIPS and Science Act to reinvigorate domestic semiconductor manufacturing and research, SIA and the Boston Consulting Group (BCG) will release a report tomorrow

26 Oct

Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports

Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports MILPITAS, Calif. — October 25, 2022 — Worldwide silicon wafer shipments reached a new record of 3,741 million square inches (MSI) in the third quarter of 2022, increasing 1.0

26 Oct

Webinar - Mobile Radio Frequency: A Patent and Technology Perspective

This webinar describes how the RF market has evolved and how, more than ever, advanced investigations and prosecutions can be accomplished using technical analysis. Register for this webinar to get the latest perspective on the Mobile RF patent and technology landscape.

25 Oct

PentaG-RAN IP Targets Base Stations

Ceva’s PentaG-RAN is a baseband IP block for cellular infrastructure. Packing multiple fixed-function units and two DSP types, it targets SoCs for RUs, DUs, small cells, and beam-forming chips.

24 Oct

Zen 3 Goes Embedded

AMD’s new Ryzen Embedded V3000 family addresses networking and storage with the Zen 3 microarchitecture. It features up to eight CPUs but omits GPUs.

24 Oct

Neoverse V2 Pressures x86 Servers

Arm’s next Neoverse CPU, code-named Demeter, will appear in Nvidia’s Grace processor in 2023, matching the single-thread performance of mainstream Xeon products for the first time.

24 Oct

SIA News Roundup

SIA News Roundup CHINA Tech war: Chinese local governments ramp up chip industry support as US piles on export restrictions South China Morning Post China’s local governments are doubling down on cash incentives and policy support for home-grown

21 Oct

2023 Forecast, When Forecasting fails

2023 Forecast, When Forecasting fails G. Dan Hutcheson The Chip Insider® 2023 Forecast Update: There were major changes to the 2023 projections in this week’s TCI Graphics file. IC sales are expected to be down 6% and Semi Equipment off 14%, with WFE

21 Oct

SemiWEEK: Bearish conditions abound; Semiconductor sales fell 7% last week; Stocks jumped

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

21 Oct

TechInsights acquires The McClean Report from IC Insights

TechInsights, the authoritative information platform to the semiconductor and microelectronics market, is pleased to announce that it has acquired The McClean Report from IC Insights, Inc.

20 Oct

ASML intends to appoint Wayne Allan to Board of Management

ASML intends to appoint Wayne Allan to Board of Management VELDHOVEN, the Netherlands, October 19, 2022 — ASML Holding N.V. (ASML) today announces that its Supervisory Board intends to appoint Wayne Allan as a member of the Board of Management in the

19 Oct

TechInsights' Semiconductor Analytics report

17 Oct

Nvidia Ada Doubles GPU Performance

Nvidia’s newest gaming GPU, code-named Ada Lovelace, builds on the Ampere design with faster clock speeds, far more cores, a massive cache memory, and faster ray tracing.

17 Oct

Thank you for registering

Thank you for registering for the webinar. You will receive an email with a link confirming your seat to the webinar shortly. If you are having troubles with your registration link, please contact us. Leading the world in microelectronics reverse

17 Oct

Discussion on the Apple Watch Metal Can Battery

We have decided to take a deeper look into the Metal can approach with our analysis of the Apple watch series 7 (41 mm) to characterize the metal can battery with the intention of answering why the metal can is used instead of the soft pouch.

14 Oct

SemiWEEK: Still on Track to Hit $1 Trillion by 2030? Why the Natural Semiconductor Growth Rate will Rise. Maxims for a Downturn; Stocks sunk

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

Thank you for registering for the webinar. You will receive an email with a link confirming your seat to the webinar shortly. If you are having troubles with your registration link, please contact us. Leading the world in microelectronics reverse

04 Oct

Ask your question to Dr. Russell

Thank you for your interest. If you have a question you didn’t get to ask during the webinar Q&A, submit it below and Dr. Russell will answer Leading the world in microelectronics reverse engineering, and building the content platform for the

04 Oct

Your questions answered: Recent GaN Innovation, Moving from Consumer to Data Center and Automotive

Your webinar questions answered: Recent GaN Innovation

Answers to the numerous questions asked in the recent gallium nitride (GaN) focused webinar ‘Recent GaN Innovation: Moving from Consumer to Data Center and Automotive’.

04 Oct

AMD Zen 4 Adds AVX-512

Zen 4 increases IPC and runs much faster than Zen 3 owing to optimized circuits, a process shrink, bigger buffers, deeper queues, and a larger micro-op cache.

03 Oct

New SiFive CPUs Hit the Road

SiFive has entered the automotive market, offering small embedded and application cores for ASIL B and ASIL D systems.

03 Oct

Raptor Lake Adds Little Cores

Despite a short design cycle, Intel boosted the performance of its 13th Generation Core processor by up to 15% over the previous generation through higher clock speeds and more “efficiency” cores.

03 Oct

Re-Globalizing the Semiconductor Industry. Maxims for a Downturn.

Re-Globalizing the Semiconductor Industry. Maxims for a Downturn. G. Dan Hutcheson The Chip Insider® Re-Globalizing the Semiconductor Industry: Governments are not pursuing DE-Globalization. They are trying to RE-Globalize the semiconductor industry

30 Sep

SemiWEEK: TSMC’s Extraordinary Growth: What’s the problem; Stocks plummeted

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

30 Sep

Fast-Charging Algorithms of the iPhone 13 Pro Max and Samsung S22 Ultra

Unlock Faster Charging

Find an analysis of the existing fast charging methods and their associated problems, and an investigation of the fast-charging techniques of the iPhone 13 Pro Max and Samsung S22 Ultra.

29 Sep

SRC-SIA Webinar on Collaboration Towards Decadal Plan Goals: Emerging Semiconductor Technologies

SRC-SIA Webinar on Collaboration Towards Decadal Plan Goals: Emerging Semiconductor Technologies REGISTER HERE Dear G. Dan, Join us Thursday, Sept. 29 at 12:30 pm EDT for the complimentary SIA/SRC Webinar - Collaboration Towards Decadal Plan Goals

29 Sep

ROHM Gen 4 Discussion

Watch the 2-part video discussion that TechInsights’ own Dr. Stephen Russell and PGC Consultancy’s Professor Peter Gammon created to take a closer look at how groundbreaking improvements of ROHM’s 4th Gen SiC MOSFET, fits into the broader SiC market.

28 Sep

TechInsights Critical Sub-systems Graphics file on Platform

TechInsights Critical Sub-systems Graphics file on Platform Updated CSUBS Graphics file is now available: Driving Forces Misc. Reports CSUBS Graphics 220927 CSUBS, Equipment, Macroeconomic quarterly CSUBS, Equipment sales forecast annual Supply Chain

28 Sep

TechInsights' Semiconductor Analytics Report

28 Sep

TechInsights' Semiconductor Analytics Report

21 Sep

Sony IMX662 Image Sensor

Security and surveillance camera equipment is frequently required to perform in challenging lighting conditions. Based on multiple customers demands for performance upgrades to their STARVIS system, Sony have developed the IMX662, the latest from the STARVIS 2 family of image sensors.

15 Sep

TechInsights' Semiconductor Analytics Report

14 Sep

Samsung HKMG DDR5 DRAM

Samsung’s HKMG DDR5 is the most advanced DRAM product available. Based on the successes of this device design, HKMG is likely set to become the new standard in DRAM manufacturing. Learn more about this technology innovation here.

14 Sep

Inventories are turning red, casting a pall over the industry

Inventories are turning red, casting a pall over the industry Andrea Lati Order activity for semiconductor equipment extended its decline, slipping one point to 81 degrees in the second week of September Memory led the decline as order activity

13 Sep

SEMICON Taiwan 2022 Opens Tomorrow with Spotlight on Advanced Manufacturing, Heterogeneous Integration, Sustainability and Talent

SEMICON Taiwan 2022 Opens Tomorrow with Spotlight on Advanced Manufacturing, Heterogeneous Integration, Sustainability and Talent TAIPEI — September 13, 2022 - SEMICON Taiwan 2022 opens tomorrow as industry leaders and visionaries gather to discuss

13 Sep

Thank you

TechInsights' Semiconductor Analytics Report

17 Aug

The Medtronic PillCam SB3: packaging a capsule endoscope

The Medtronic PillCam SB3: packaging a capsule endoscope John Scott-Thomas Endoscopy is a medical procedure that examines the interior of a body using a camera. Common for digestive track imaging, a conventional endoscope uses a tube that is inserted

16 Aug

TI AM625 Updates Industrial SoCs

TI has updated its low-cost SoC family with 64-bit CPUs, lower power, and improved security and functional-safety support, enabling it to target automotive as well as industrial applications.

15 Aug

Intel Finally Gives Up on Optane

Intel and Micron have developed a revolutionary new memory technology called 3D XPoint, but under the Optane brand it never met expectations as either an SSD or DIMM replacement.

15 Aug

Google’s Tensor DLA Lags In Area, Speed

Among flagship-smartphone processors, Google’s first custom design has the largest AI engine but the worst AI performance. In contrast, the Dimensity 9000’s AI engine is the most efficient.

15 Aug

SemiWEEK: Chips and Science Act; ASML – Only Five Star WFE Leader; Stocks increased

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

12 Aug

Surprising Near-Term versus Long-Term Decadal Trends

Surprising Near-Term versus Long-Term Decadal Trends G. Dan Hutcheson The Chip Insider® Near-Term versus Long-Term Decadal Trends: As everyone knows, the near-term picture has been darkening for some time. DRAM and Foundry markets started to shift

12 Aug

Review and Things to Know: Flash Memory Summit 2022

The Flash Memory Summit 2022 conference including an Expo was held at Santa Clara Convention Center (US) last week (Aug. 1 – 4). Many of the industry-leading memory manufacturers and module suppliers exhibited their latest products in flash storage technology. TechInsights is a recurring and popular speaker at FMS.

11 Aug

TechInsights' Semiconductor Analytics Report

SMIC’s Next Generation Process

TechInsights is first and foremost focused on supporting innovation and decision making. Because of the far-reaching interest in this latest technology, we thought we would share some of the discussions we’ve been having. Here are a few of the common questions we are seeing, and our corresponding answers.

04 Aug

It’s cooling off as more fog rolls in

It’s cooling off as more fog rolls in Andrea Lati Order activity for semiconductor equipment continued to trend lower, slipping to 86 degrees Subcon/Adv. Packaging led the decline with temperatures tumbling 8 points last week Even though the overall

03 Aug

Teardown: Lenovo Mirage VR S3 headset Virtual reality (VR) headsets have taken off in recent years after remaining stagnant due to more content becoming available for users to enjoy both movies, games and other entertainment forms. With the inception

28 Jul

TechInsights' Semiconductor Analytics Report

Temperatures are cooling off, but the path is still clear

Temperatures are cooling off, but the path is still clear Andrea Lati Order activity for semiconductor equipment continued to trend down, slipping to 89 degrees The rate of decline has moderated in the last two weeks following a steep drop in June

21 Jul

Teardown: Samsung Galaxy Z Fold 5G

Teardown: Samsung Galaxy Z Fold 5G Foldable phones, once thought to be a dream, have become a reality. While flip phones were introduced many years ago as one of the first iterations of expanding cell phone form factors, it wasn’t the screen that

21 Jul

TechInsights' Semiconductor Analytics Report

20 Jul

Teardown: Lenovo ThinkPad X1 Fold laptop

Teardown: Lenovo ThinkPad X1 Fold laptop Foldable electronics are growing in number but remain a niche market overall. Consumers are interested in the technology but the practicality of using foldable electronics is something that just hasn’t caught

19 Jul

Disruptive Technology: 7nm SMIC MinerVa Bitcoin Miner

TechInsights has discovered what appears to be SMIC 7nm technology in the MinerVa Bitcoin Miner SoC. Learn why this matters and its market impact by downloading our Disruptive Technology Brief today.

19 Jul

Webinar - Recent GaN Innovation, Moving from Consumer to Data Center and Automotive

In this webinar, Dr. Stephen Russell will delve into the innovations found within recently released GaN devices for both low-voltage ( 600 V) devices aimed at data centers and high voltage (>650 V) devices looking to enter the light industrial and even automotive markets.

19 Jul

RISC-V Extension Eliminates Division

RISC-V International, the governing body of the open-standard instruction set, recently approved four new specifications that address multiplication, bootloaders, and debugging, reducing the gap with Arm.

18 Jul

Imagination Launches RISC-V Core

Imagination Technologies has unveiled its first Catapult family member. Based on the RISC-V architecture, the CPU core targets real-time applications, putting Cortex-R52 in its sights.

18 Jul

Gaudi2 Makes Impressive MLPerf Debut

In the latest round of MLPerf Training results, Graphcore’s Bow offers a modest improvement and Habana’s Gaudi2 triples performance over its predecessor, vaulting past Nvidia’s A100 on one benchmark.

18 Jul

Upcoming New 3D NAND TLC Devices: Samsung 176L & 238L, SK hynix 176L, KIOXIA/WD 162L

Micron, and now other leading 3D NAND players such as Samsung, SK hynix, KIOIXA, and Western Digital (WD) have finished the risky product stage and just moved onto the high-volume product stage with a higher yield for SSD application. Dr. Jeongdong Choe compares each.

14 Jul

TechInsights' Semiconductor Analytics Report

HANMI- 10 BEST Korean Chip Equipment Supplier HANMI is awarded 10 BEST and THE BEST awards

23 Jun

Reverse Engineering the first Silicon-Oxygen Anode battery-based Smartphone

As part of the TechInsights Li-Ion Battery Essentials subscription, we had the opportunity to reverse engineer the Amperex BM55 battery pack found in the Xiaomi Mi 11 Ultra. Xiaomi claims this is the first smartphone to use a Silicon Oxygen Anode based battery.

22 Jun

15 Jun

TechInsights @ IPBC Global 2022 – Intellectual Property Conference (June 12 -14)

12 Jun

Memory Lithography and Product Strategy. Consistent Development Cadence with Probability Management.

Memory Lithography and Product Strategy. Consistent Development Cadence with Probability Management. G. Dan Hutcheson The Chip Insider® Memory Lithography and Product Strategy: Micron recently announced that it was jumping back into EUV with plans to

10 Jun

We will see a clear scaling trend delay in Logic 3nm?

TechInsights has added the most recent data from our Digital Floorplan Analysis and TechInsights' speculation for TSMC N3 technology that we expect to see in the next 18 months.

10 Jun

SemiWEEK: Inflation – Why it’s good for Semiconductors; Plasma-Therm The Top Etch & Clean Supplier in the TechInsights Customer Satisfaction Survey; Stocks sunk

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

10 Jun

eBook: 2022 and Beyond for Memory Technology

Delve into the latest trends and challenges in DRAM, NAND Flash, and Emerging Memory markets, authored by renowned expert Dr. Jeongdong Choe.

09 Jun

EVG- Tenth Consecutive Triple Crown Win

EVG- Tenth Consecutive Triple Crown Win EV Group Awarded 10 BEST Supplier

08 Jun

Probe Card Market hit $2.5B in 2021 Ha Pham 2021 was another great year for the Probe Card market with sales hitting $2.5B. Foundry and IDM Logic drove most of the gains thanks to a soaring demand, especially at the leading-edge nodes. The Top 10

02 Jun

TechInsights' Semiconductor Analytics Report

01 Jun

Advantest Five Star ATE Supplier

Advantest five star ATE supplier Advantest Awarded RANKED 1st 10 BEST Supplier

01 Jun

Companies Are Hacking Their Way Around the Chip Shortage

The supply chain issues have no end in sight, so manufacturers are being forced to improvise.

01 Jun

THE HIGHEST- RATED SUPPLIERS OF TEST CONNECTIVITY SYSTEMS ⃰ - PROBE CARD SUPPLIERS

Technoprobe, FormFactor, and Nidec SV TCL earn 5 Stars by customers as the 2022 Highest-Rated Test Connectivity Suppliers in the TechInsights Customer Satisfaction Survey.

31 May

It's hot and humid but distant clouds threaten the upturn

It's hot and humid but distant clouds threaten the upturn Andrea Lati Order activity for semiconductor equipment held steady at a hot 110 degrees in the last week of May Equipment demand remains red hot and is not showing any signs of abating anytime

31 May

Dimensity 1050 Adds Millimeter-Wave 5G

MediaTek’s first smartphone processor to support the highest cellular bands targets mmWave operators in the US and Japan. In addition, the Dimensity 930 upgrades midrange sub-6GHz phones.

30 May

Helio G99: The Final 4G Processor?

MediaTek released a 6nm shrink of the Helio G96, reducing cost and extending battery life. The G99 product number signals it may be the company’s final LTE processor.

30 May

Mediatek's Genio Is Out of The Bottle

MediaTek has created a new brand for its embedded application processors. The family includes older rebranded chips but introduces a new flagship model, the Genio 1200, for AI IoT applications.

30 May

SemiWEEK: It’s red hot out there despite growing concerns about the economic outlook; Stocks jumped

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

27 May

Linley Spring Processor Conference 2022 Proceedings

Presentations address processors and IP cores for AI applications, embedded, data-center, automotive, and server designs. Linley Gwennap, principal analyst, TechInsights, opened the conference with an overview of the latest market, technologies, equipment-design, and silicon trends. Also featured, was a keynote from another industry leader.

25 May

It’s red hot out there despite growing concerns about the economic outlook

It’s red hot out there despite growing concerns about the economic outlook Andrea Lati Order activity for semiconductor equipment declined a mere 0.2 points in the third week of May Despite the pullback in the last couple of months, overall activity

25 May

Foundries will be the biggest segment for WFE sales for the fourth consecutive year in 2022

Foundries will be the biggest segment for WFE sales for the fourth consecutive year in 2022 WFE Forecast Updates included are the following: Equipment Database: WFE by Application – v22.05 2021 was a great year for WFE sales in Foundry and Memory

24 May

Webinar: mmWave Antenna Module Implementation Considerations for 5G Smartphones

TechInsights’ Radu Trandafir takes a closer look at the three mmWave antenna modules used by Apple in the iPhone 12/13 which mark an interesting departure from the “traditional” Qualcomm-based architecture at the implementation level.

24 May

TimberAI Scales Down an Octave

Expedera’s new licensable deep-learning accelerator (DLA) performs simple neural networks for audio processing in a tiny engine that draws less than one milliwatt.

23 May

SemiWEEK: SPIE, Hi-NA EUV, Digital Twins, Dry Resist, and the LAP and Memory CapEx Discrepancy; 10 BEST and THE BEST Suppliers of 2022; Stocks were mixed

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

20 May

Computer chip giant ASML places big bets on a tiny future

ASML’s $400 million machine for next-generation chips is a high-stakes gamble. TechInsights’ Dan Hutcheson weighs in on this potential game-changer.

20 May

AMD Adds ZEN 3 To Premium Chromebooks

AMD has expanded its Chromebook-processor lineup with four products based on the Barcelo design, including the top-of-the-line Ryzen 7 5825C, that target systems priced at $600 or more.

20 May

Alder Lake-HX Maxes Laptop Performance

Intel’s Core i9-12900HX sets performance records for laptop PCs, offering two extra “performance” cores at up to 5.0GHz for the most-demanding mobile gamers and professionals.

20 May

10 BEST Semiconductor Equipment Supplier Rankings for 2022

Advantest, ASML, FormFactor, Plasma-Therm, and EV Group earn 5 Star Ratings in the 2022 10 BEST Suppliers

18 May

The second half is looking solid despite macro concerns

The second half is looking solid despite macro concerns Andrea Lati Order activity for semiconductor equipment held steady at a hot 110 degrees in the second week of May All segments ended the week flat, except for Memory which slipped to a new low

18 May

THE BEST Semiconductor Equipment Suppliers of 2022

Take a look into what THE BEST suppliers of 2022 are best at, and their ratings.

18 May

11 May

TechInsights' Critical Sub-System Driving Forces

10 May

Still hot and green but clouds loom...

10 May

Chip Vendors Help Power Up 6GHz

Broadcom and Qualcomm will support a new automated-frequency-coordination (AFC) system to allow Wi-Fi and unlicensed 5G devices to use higher power in the 6GHz band, increasing performance and range.

09 May

Intel GNA Engine Adds Vision

The Gaussian and Neural Accelerator supports always-on audio and vision workloads, reducing power and adding security. It appears on Intel PC processors, other chips, and the Clover Falls add-on chip.

09 May

AMD Ships 3D V-Cache Processors

The Ryzen 7 5800X3D PC processor and Milan X server processor use TSMC’s chip-on-wafer (CoW) technology to stack more cache on the compute die, improving game and HPC performance.

09 May

TechInsights' Semiconductor Equipment Report

06 May

TechInsights' Semiconductor Analytics Report

05 May

It's hot but distant clouds threaten the upturn

03 May

AMD Adds DPUs With Pensando Buy

By acquiring Pensando, AMD will instantly offer DPUs alongside its CPUs and GPUs. Although it principally sells smart NICs, the startup recently announced a design win for its 7nm second-generation chip.

02 May

GF Fotonix Unites CMOS, Photonics

The new GlobalFoundries process combines photonic and digital components on a single 45nm chip. The primary application is data-center communications, but lidar and computing will benefit as well.

02 May

Fewer Find 3nm Worth the Wait

TSMC and Samsung have suffered lengthy delays in their 3nm processes, and the gain in density and other characteristics is smaller than in previous nodes. Intel says its future nodes are on schedule.

02 May

The EPC 2152 – A Fully Integrated GaN Half-Bridge IC

TechInsights comments on what the main reasons for this integration are, other innovations throughout the GaN die, and how there is not a ‘one size fits all’ approach in regard to power semiconductor devices.

02 May

SemiWEEK: SEMI ISS Takeaways Continued; Supply-chain clouds are still hanging over the industry; Stocks were mixed

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

29 Apr

Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead

Dick James, a Senior Fellow and Technology Analyst with TechInsights, entered the semiconductor industry in 1970, working for Philips Semiconductor. In this blog, he presents a retrospective of gate technology, ranging from 1971’s 10-micron design rules (!) through to the more modern 5-nanometer.

26 Apr

TetraMem Touts In-Memory DLA

The Silicon Valley startup uses a new type of memristor to perform analog math for deep-learning acceleration. It provides nonvolatile storage and performs low-power AI computations.

25 Apr

Sakura Debuts for Edge AI

EdgeCortix launched its first edge-AI inference chip by hardening its DNA IP, delivering low latency and high power efficiency for applications that fit into 5W to 20W.

25 Apr

Synopsys NPX6 Expands AI Options

The new deep-learning accelerator (DLA) can scale to more than 2,000 TOPS, providing a licensable core for applications such as autonomous driving and natural-language processing.

25 Apr

SemiWEEK: SEMI ISS, Anne Kelleher, Moore’s Law; Stocks were mixed

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

22 Apr

Main and Periscope Camera Trends at Apple, Samsung, Xiaomi, Vivo, Huawei, and Sharp

If you want to understand the progress of competitors and the recent situation of the market, this presentation reviews selected structural and feature highlights of Apple, Samsung, Xiaomi, Vivo, Huawei, and Sharp cameras, focusing on main & ultrawide cameras, and the periscope camera trends.

22 Apr

Linley Spring Processor Conference 2022

For more than a decade, The Linley Group has delivered the industry’s premier processor conferences. This year, the Linley Spring Processor Conference will return to Santa Clara on April 20-21, 2022 with a new hybrid format; if you can’t attend in person, you can tune in to our virtual livestream.

20 Apr

Spring orders are flitting like butterflies but 2H22 is becoming blurry

Semiconductor Equipment Weather Report

20 Apr

Chip demand cooling

TechInsights' Semiconductor Analytics Report

20 Apr

Sony Xperia 5 III uses a periscope camera with two Zoom settings

The Package channel continued building its periscope camera report database with a look inside the Sony Xperia 5 III smartphone. Notably, this is the first periscope camera TechInsights has examined that has a variable zoom; the magnification of the camera has two zoom settings.

18 Apr

Nvidia Orin Appears in MLPerf

The newest set of MLPerf Inference results showcase the same old vendors; almost all the data-center and edge accelerators came from Nvidia and Qualcomm. Orin was the notable newcomer.

18 Apr

Alchemist Turns Intel Into GPU Vendor

Intel’s new Arc products are its first significant discrete GPUs, using competitive performance and hardware ray tracing to bring new competition to laptop-PC graphics cards.

18 Apr

Editorial: Where’s the AI Competition?

The dominant AI-chip vendor, Nvidia has raised the bar with its new Hopper and Orin accelerators. Startups, hyperscalers, and large chip vendors try to compete with the company but keep falling short.

18 Apr

SEMI ISS, Anne Kelleher, Moore's Law

SEMI ISS, Anne Kelleher, Moore's Law G. Dan Hutcheson The Chip Insider® SEMI ISS: I have to say that 2022's conference was the best ever and I wasn't the only one who felt that way. It had record attendance and attendees were not disappointed. Maybe

15 Apr

SemiWEEK: Inflation is the new pandemic; Stocks fell

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

15 Apr

China and Russia down

China and Russia down G. Dan Hutcheson Semiconductor Analytics Semiconductor sales pulled back 3% W/W in the 1st week of 2Q22. Sales are closing in on 2021 levels. The IC weather cooled another 4°F last week. Zooming in on NAND growth this week, 13

13 Apr

It's Still Hot and Vistas Are Clear but Don't Forget the Mountainous Cycles

It's Still Hot and Vistas Are Clear but Don't Forget the Mountainous Cycles Andrea Lati The Chip Insider® Order activity for semiconductor equipment resumed its decline, slipping 0.6 points to 112 degrees in the first week of April Despite the recent

13 Apr

Reticle sales are expected to surge 18% in 2022

ForecastPro

11 Apr

Nvidia Reveals 51Tbps Ethernet Switch

Due to sample late this year, Spectrum-4 will quadruple the bandwidth of Spectrum-3 by both doubling per-lane speed to 100Gbps and doubling the number of serdes lanes to 512, yielding 51.2Tbps.

11 Apr

Merging Memory and Compute

Near-memory and in-memory compute are techniques for reducing computing power—especially for AI. But they mean different things to different companies. Understanding the differences is important for understanding how some AI chips work.

11 Apr

Nvidia Hopper Leaps Ahead

The next-generation AI architecture powers the H100 card and DGX-H100 system. The 700W flagship card triples peak performance over Ampere while adding FP8 support for more-efficient training.

11 Apr

Memory Components in Your Smartphones

Jeongdong Choe, TechInsight's Senior SME on Technology, compares China, Apple, and Samsung’s memory and storage components.

11 Apr

Inflation Is the New Pandemic

Strategy and Tactics: Inflation is the new pandemic

08 Apr

SemiWEEK: Why Governments Became So Concerned About Semiconductor Self-Sufficiency; Stocks Plunged

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

08 Apr

TechInsights partners with Cipher

TechInsights partners with Cipher to harness ML to leverage patent intelligence to reveal insight about the future direction of the Semiconductor industry

08 Apr

DRAM Sales on Track to Hit $111B in '22

TechInsights' Semiconductor Analytics report

06 Apr

All Eyes Are Focused on the Supply Chain

Semiconductor Equipment Weather Report

06 Apr

Linley Spring Processor Conference Features the Latest Breakthroughs in AI Silicon and Applications

TechInsights’ Linley Processor Conference – the industry’s premier technical event for microprocessors – returns this year, beginning this month with a must-see lineup of presentations revolving around the future of artificial intelligence.

05 Apr

Agilex Dials M for Memory

Intel announced its first Agilex to copackage DRAM, sporting a pair of HBM2e stacks that deliver up to 32GB. It’s also using the Intel 7 process to further cut power dissipation.

05 Apr

Renesas Refocuses on Enhanced ADAS

The R-Car V4H is a new automotive system-on-chip for vehicles with extended ADAS capabilities. It addresses functional safety and the greater AI performance for Level 2+ driving.

05 Apr

Snapdragon X70 Modem Trims Power

Qualcomm’s next 5G modem uses AI to reduce power and improve performance while maintaining the data rates of its predecessor.

05 Apr

Why Governments Became So Concerned About Semiconductor Self-Sufficiency

Strategy and Tactics: Why governments became so concerned about Semiconductor Self-Sufficiency

01 Apr

SemiWEEK: Intel’s Radical Post-Global National Mesh Strategy; Foundry & IDM Capital Expenditures; Stocks Fell

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

01 Apr

Packaging Approaches to Gallium Nitride (GaN) Products

TechInsights reviews additional considerations compared to silicon to optimize device performance, the challenges associated to thermal management, and other innovative solutions related to GaN specific packaging solutions.

31 Mar

Foundry & IDM Capital Expenditures 1Q2022

Semiconductor Manufacturing

31 Mar

Critical Subsystems 2021 Vendor Market Shares

Updates to Critical Subsystems on Website

31 Mar

Chip Sales Slid Last Week

Chip Sales Slid Last Week G. Dan Hutcheson Semiconductor Analytics Semiconductor sales slid 1% W/W in the 4th week of March. Sales remain well above 2021. The IC weather warmed up 1°F last week. Zooming in on semiconductor growth this week, 13-wk MA

30 Mar

Still Hot and Green but Distant Macro Clouds Loom

Still Hot and Green but Distant Macro Clouds Loom Andrea Lati The Chip Insider® Order activity for semiconductor equipment continued to trend lower, slipping half a point in the last week of March The slight pullback in the last five weeks has been

29 Mar

TechInsights stands with Ukraine

TechInsights is shocked and heartbroken by the violence and loss of life due to the invasion of Ukraine. We stand in solidarity with the Ukrainian people and we are hopeful for an expedient path to peace.

29 Mar

SemiWEEK: Lam Research’s Selective Etcher. COVID Strikes Again; Stocks Eked Out A Gain

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

25 Mar

Intel's Radical Post-Global National Mesh Strategy

Strategy and Tactics: Intel's radical Post-Global National Mesh strategy

25 Mar

Google Pixel 6 Pro Periscope Camera is a modified design of the Xiaomi Mi 10 Ultra module

In late 2021, the Google Pixel 6 Pro was launched and has been widely regarded as the best smartphone Google has made to date.

24 Mar

Communications Market Service

This subscription provides the detailed market information needed to sort out the complexities of the communications semiconductor market.

23 Mar

Semiconductor Sales on Track to Reach $0.7T in '22

Semiconductor Sales on Track to Reach $0.7T in '22 G. Dan Hutcheson Semiconductor Analytics report Semiconductor sales jumped W/W in the third week of March, with sales passing 50% Y/Y. The IC weather heated up 6°F last week. The March forecast

23 Mar

Worldwide OEM Electronics Sales Soared 19% Last Year

Worldwide OEM Electronics Sales Soared 19% Last Year Updates to Semiconductor Market Research Services on Website & Mobile App: ForecastPro Module Electronics & Macroeconomy - V22.03 Historical Ratios & Utilization Rates - V22.03 Diffusion Rates of

23 Mar

AI Processor Service

This annual subscription is updated quarterly and covers hardware technologies and products from more than 55 companies.

23 Mar

It's Hot but Supply Constraints Are Holding Up Growth

It's Hot but Supply Constraints Are Holding Up Growth Andrea Lati The Chip Insider® Semiconductor Equipment Weather Report Order activity for semiconductor equipment slipped to 113 degrees All segments held their ground at record levels, except for

22 Mar

Cirrus Logic 55 nm PMIC Products Observed in the Market

In a blog written by Stephen Russell, TechInsight's Senior Process Analyst, he explains why a logic node of 55 nm is important for a PMIC and his findings of recent teardown projects.

22 Mar

Critical Subsystems Driving Forces Update

Critical Subsystems Driving Forces Update Updates to Critical Subsystems on Website Substrate Processing Equipment Forecasts Semiconductor and Related Equipment Annual Unit Shipments v22.02ML DF Semiconductor and Related Equipment Quarterly Unit

21 Mar

Lam Research's Selective Etcher and COVID Strikes Again

Lam Research's Selective Etcher and COVID Strikes Again G. Dan Hutcheson The Chip Insider® Strategy and Tactics: Lam Research's Selective Etcher. COVID Strikes Again. What's Happening and What's the Meaning: Lam Research's Selective Etcher: Lam has

18 Mar

SemiWEEK: AI in the Fab: Who Does it? Ukraine’s Neon Supply. Apple 3rd in Semis; Stocks Soared

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

18 Mar

2021 Top Semiconductor Equipment Suppliers

2021 Top Semiconductor Equipment Suppliers The Chip Insider® Equipment & Emerging Markets 2021 was a very strong year for the equipment suppliers with sales soaring to record-highs. However, severe supply chain shortages made 2021 a challenging year

17 Mar

Apple Joins 3D-Fabric Portfolio with M1 Ultra?

On March 8, Apple held their “Peek Performance” event, introducing the all-new Mac Studio and Studio Display, a new iPad Air, the new iPhone SE, and two new shades of green for the iPhone 13 and iPhone 13 Pro.

17 Mar

Industry-leading DDR5 Technology

We have just entered into the era of DDR5 memory. All the major DRAM players such as Micron, Samsung, and SK Hynix have started to release their first DDR5 memory products (modules) since last year.

16 Mar

Analog & Power Rising Like 2021

Analog & Power Rising Like 2021 G. Dan Hutcheson Semiconductor Analytics Semiconductor sales were flat W/W in the second week of March. Though still high Y/Y, it was abnormally weak. The IC weather cooled another 1°F last week. Zooming in on Analog &

16 Mar

Worldwide Silicon Demand Is Expected to Increase 9% in 2022 as Semiconductor Demand Remains Strong; Stepper Shipments Surged 18% in 2021

Worldwide Silicon Demand Is Expected to Increase 9% in 2022 as Semiconductor Demand Remains Strong; Stepper Shipments Surged 18% in 2021 Updates to Semiconductor Market Research Services on Website & Mobile App ForecastPro Module Silicon Demand - V22

15 Mar

Ray-Ban Stories smart glasses cameras

The new Ray-Ban Wayfarer Stories glasses are a product developed by Facebook in a partnership with EssilorLuxottica, and TechInsights decided to take a look at the cameras these smart glasses use.

14 Mar

It's Still Hot and the Visibility Has Extended Well into 2H22

It's still hot and the visibility has extended well into 2H22 Andrea Lati The Chip Insider® Order activity for semiconductor equipment hovered at a hot 114 degrees All segments held their ground, except for Memory where order activity slipped for the

14 Mar

SemiWEEK: Planned Capacity Additions: Is there Too Much on the Books? Stocks Fell

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

11 Mar

Apple 3rd in Worldwide Semiconductor Market

Apple 3rd in Worldwide Semiconductor Market G. Dan Hutcheson The Chip Insider® Strategy and Tactics: AI in the fab: Who does it? Ukraine's Neon Supply. Apple 3rd in Semis AI in the fab: Who does it? Pretty much everybody today. Chipmakers started to

11 Mar

Semiconductor Sales Pass 40%

Semiconductor Sales Pass 40% G. Dan Hutcheson Semiconductor Analytics Semiconductor sales rose above a 13-week MA annual rate of 40% while matching the 34% peak of Dec 2017. The IC weather was mixed, cooling 1°F last week. Zooming in on Logic this

09 Mar

Qualcomm QTM545 Analysis

The Samsung Galaxy S22 Ultra has the latest and greatest Qualcomm mmWave, but not in Europe...

09 Mar

The Industry Soars, but Carries a Tether of Caution

The Industry Soars, but Carries a Tether of Caution Andrea Lati The Chip Insider® Order activity for semiconductor equipment slipped half a point as Memory activity fell for the second week in a row The Memory market has been somewhat bumpy in the

08 Mar

CapEx Is Expected to Soar 23% in 2022, Surpassing the $180B Mark as Chipmakers Race to Add More Capacity

CapEx Is Expected to Soar 23% in 2022, Surpassing the $180B Mark as Chipmakers Race to Add More Capacity Updates to Semiconductor Market Research Services on Website & Mobile App ForecastPro Module CapEx Distribution - V22.03 Soaring demand and

07 Mar

SemiWEEK: Intel Investor Day. Tower, Trust, Data Analytics; Stocks Sunk

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

04 Mar

Planned Capacity Additions: Is There Too Much on the Books?

Planned Capacity Additions: Is There Too Much on the Books? G. Dan Hutcheson Planned Capacity Additions. Is there too much on the books? That's the question every chip insider has been quietly asking recently. IR pros are being relentlessly hammered

04 Mar

NAND Growth Stays Strong

NAND Growth Stays Strong G. Dan Hutcheson Semiconductor Analytics Semiconductor sales continued to rise at an annual rate close to 30% with the shortage driving demand. The IC weather rose 1°F last week. Semiconductor Sales growth continues to soar

02 Mar

Workforce Development Solutions with SEMI

Ajit Manocha of SEMI has a conversation with Dan Hutcheson about the workforce development SEMI is accomplishing.

02 Mar

Order Activity Remained at Record Levels Despite Rising Uncertainty

Order Activity Remained at Record Levels Despite Rising Uncertainty Andrea Lati The Chip Insider® There was no discernable change in order activity for semiconductor equipment in the last week of February with temperatures staying near record levels

01 Mar

Strong Demand Coupled with Rising ASPs Will Propel Semiconductor Sales Past $675b in 2022

Strong Demand Coupled with Rising ASPs Will Propel Semiconductor Sales Past $675b in 2022 Updates to Semiconductor Market Research Services on Website & Mobile App ForecastPro Module Semiconductors - V22.03 Semiconductor sales soared 26% in 2021

28 Feb

The Upturn is Still Running Wild

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

25 Feb

Intel Investor Day. Tower, Trust, Data Analytics.

Intel Investor Day. Tower, Trust, Data Analytics. G. Dan Hutcheson The Chip Insider® Strategy and Tactics: Intel Investor Day. Tower, Trust, Data Analytics. Intel Investor Day 2022: As 2020 came to a close it was clear to everyone interested, and

25 Feb

Innovation in Memory with Micron Technology

Scott DeBoer of Micron Technology has a conversation with Dan Hutcheson about what it takes to innovate in Memory today.

25 Feb

DRAM Growth Super-Hot

DRAM Growth Super-Hot G. Dan Hutcheson Semiconductor Analytics Semiconductor sales pulled up as the shortage continued to drive demand, with record sales in the $10-12B/week range. The IC weather held at 88°F last week. Semiconductor Sales growth

23 Feb

Samsung Galaxy S22 Ultra teardown

Our colleagues did a quick teardown of the Samsung Exynos 2200-powered Galaxy S22 Ultra, so we can share some of our early teardown results now.

22 Feb

The Upturn Is Still Running Wild

The Upturn Is Still Running Wild Andrea Lati The Chip Insider® Order activity for semiconductor equipment held steady at a hot 115 degrees With backlogs at all-time-highs and visibility extending into next year, Equipment manufacturers expect 2022 to

17 Feb

TechInsights' 2022 Semiconductor Forecast Raised to 14%

TechInsights' 2022 Semiconductor Forecast Raised to 14% G. Dan Hutcheson Semiconductor Analytics Semiconductor sales pulled back for a second week in a typical February drawdown, albeit at unseen historical heights. The IC weather warmed 1°F last

16 Feb

Microsoft and Sony Acquisitions - a Strategy Game

Microsoft and Sony Acquisitions - a Strategy Game Contributing author: Peter Johnston Access the world's largest database of consumer electronics and semiconductor reverse engineering Login to the Platform Microsoft and Sony have independently

15 Feb

Orders Are Flitting Like Butterflies

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

11 Feb

How Data Analytics Fails Forecasters

How Data Analytics Fails Forecasters G. Dan Hutcheson The Chip Insider® Strategy and Tactics: Data Analytics: How it fails forecasters. Data Analytics: How it fails forecasters — In general, data analytics are great management tools but poor

11 Feb

Semiconductor Sales Pull Back

Semiconductor Sales Pull Back G. Dan Hutcheson Semiconductor Analytics Semiconductor sales pulled back 5% W/W in a typical early February dip. The IC weather warmed 1°F last week. Semiconductor Sales growth continued to hover above the 20% Y/Y bar

09 Feb

Orders Are Flitting Like Butterflies

Orders Are Flitting Like Butterflies Andrea Lati The Chip Insider® Order activity for semiconductor equipment stayed red hot at 115 degrees Visibility for equipment suppliers has extended all the way to the end of the year and backlogs are hitting

08 Feb

PCI Express Gen6 Adopts PAM4

In its sixth generation, PCI Express underwent the biggest changes since its debut in 2003, adopting PAM4 signaling. The new modulation enables data rates to reach 64Gbps per lane.

07 Feb

Inflation: Why It's Worse Than Many Fear. Moore's Law.

Inflation: Why It's Worse Than Many Fear. Moore's Law. G. Dan Hutcheson The Chip Insider® Inflation: Why it's worse than central banks fear. Is inflation not transitory and worse than they say? Should we raise prices? These are two of the most common

04 Feb

Inflation: Why It's Worse Than Many Fear. Moore's Law.

Inflation: Why It's Worse Than Many Fear. Moore's Law. February 4, 2022 Inflation: Why it's worse than central banks fear. Is inflation not transitory and worse than they say? Should we raise prices? These are two of the most common questions I have

04 Feb

Apple AirTag Teardown

Our interest in tag trackers is how much technology has evolved. We live in a world where a device the size of a US quarter-cent piece can have multiple antennas, radio ICs, a battery and continue to operate as a two-way radio, pinpointing objects within feet of accuracy for almost a full year.

04 Feb

Order Activity Stayed Hot Amid Supply Chain Woes

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

04 Feb

TechInsights Answers: Power Semiconductors - What is On-Resistance?

A common question our Power Semiconductor experts encounter is: What is on-resistance? Stated simply, on-resistance is the total resistance between the drain and source terminals of a FET.

03 Feb

IC Supply/Demand Indices Loosened

IC Supply/Demand Indices Loosened G. Dan Hutcheson Semiconductor Analytics Semiconductor sales continued to explode out of the normal Christmas lull, ending January near 2021's peaks. The IC weather cooled 2°F last week. Semiconductor Sales growth

02 Feb

IC Supply/Demand Indices Loosened

Semiconductor sales continued to explode out of the normal Christmas lull, ending January near 2021's peaks. The IC weather cooled 2°F last week.

02 Feb

Lenovo ThinkSmart Hub Teardown

This analysis allowed us to compare or discover new manufacturers, sub-assemblies, and ICs we have found in the consumer device market with components and brands found in the business-focused ThinkSmart Hub.

02 Feb

Order Activity Stayed Hot Amid Supply Chain Woes

Order Activity Stayed Hot Amid Supply Chain Woes Andrea Lati The Chip Insider® Order activity for semiconductor equipment held steady at a sizzling 115 degrees Even though the visibility and demand for equipment suppliers is the best it's ever been

01 Feb

Order Activity Stayed Hot Amid Supply Chain Woes

Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.

01 Feb

Mobileye EyeQ Ultra Aims for Level 4

The ADAS-processor leader is developing a single-chip solution for self-driving cars, along with its own lidar and radars. By 2025, Mobileye hopes its system will reduce the car buyer’s add-on cost to just $10,000.

01 Feb

Ceva Tackles Unstructured Sparsity

NeuPro-M, a licensable deep-learning accelerator, offers up to 16x faster inferencing than the previous generation thanks to its new architecture, Winograd modifications, and unstructured-sparsity engines.

01 Feb

Discrete GPUs Cut Power for Laptops

Low-cost laptops get a graphics boost from AMD and Nvidia, which now offer their leading GPU architectures in low-power products that increase gaming frame rates and enable hardware ray tracing.

01 Feb

Inventory: Loose or Tight? Equipment Shortages.

Inventory: Loose or Tight? Equipment Shortages. G. Dan Hutcheson The Chip Insider® Inventory: Loose or Tight? We were recently asked about the TCI Graphics IC Inventory data, after the WSJ published comments from the US Department of Commerce that

28 Jan

The Capex Race Rages On

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

28 Jan

Wafer Fabrication Equipment for Advanced Packaging Projected to Reach $2.2B in 2022

Wafer Fabrication Equipment for Advanced Packaging Projected to Reach $2.2B in 2022 Updates to Semiconductor Market Research Services on Website & Mobile App Equipment Database Module Advanced Packaging Equipment - V22.01 Wafer Fab Equipment (WFE)

27 Jan

IC Supply/Demand indices tighten

IC Supply/Demand indices tighten G. Dan Hutcheson Semiconductor Analytics Semiconductor sales continue to explode out of the normal Christmas roll-over with double-digit W/W and Y/Y growth, as IC Supply/Demand tightened up. The IC weather warmed 1°F

26 Jan

1Q 2022 Assembly Equipment Outlook

1Q 2022 Assembly Equipment Outlook The Chip Insider® Semiconductor Manufacturing Semiconductor shortages turbocharged 2021 Assembly & Packaging and Equipment demand by growing 57% to $5.5B. While the demand growth for equipment is slowing, the high

25 Jan

The Capex Race Rages On

The Capex Race Rages On Andrea Lati The Chip Insider® Order activity for semiconductor equipment continued to heat up with no signs of slowing down any time soon Temperatures hit a fresh new high of 115 degrees last week as chipmakers continued to

25 Jan

Lightelligence Demos Optical Compute

Startup Lightelligence recently took its first step toward commercialization by demonstrating a proof-of-concept device that stacks an electrical IC atop a photonic IC.

25 Jan

Ryzen 6000 Doubles GPU Performance

AMD’s new laptop processor, code-named Rembrandt, is the first PC processor with integrated hardware ray tracing. Its new RDNA2 GPU also doubles graphics performance relative to the previous generation.

25 Jan

Recognizing the Best Chips and Technology of the Past Year

To recognize the top semiconductor offerings of the year, The Linley Group (powered by TechInsights) presents its 2021 Analysts’ Choice Awards.

24 Jan

Analysts’ Choice Winners for 2021

The Linley Group recognizes 2021’s top products in the categories of data center, PC, embedded, mobile, processor IP, and related technology. And the winners are…

24 Jan

More Than Moore Equipment Sales Are Expected to Surge 70% in 2022, Far Outpacing the Growth of the Overall Market

More Than Moore Equipment Sales Are Expected to Surge 70% in 2022, Far Outpacing the Growth of the Overall Market Updates to Semiconductor Market Research Services on Website More than Moore Module 200mm & 300mm Microlithography V22.01 200mm & 300mm

21 Jan

Intel's fab in Ohio. Maxim: Trust building

Intel's fab in Ohio. Maxim: Trust building G. Dan Hutcheson Strategy and Tactics: Intel's fab in Ohio. Maxim: Trust building, Tests for and the management of trust and risk. The Three Traits of Great Leaders. Intel's fab in Ohio: Since Insiders read

21 Jan

Customers are clamoring for more capacity

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

21 Jan

Customers Are Clamoring for More Capacity

Customers Are Clamoring for More Capacity Andrea Lati The Chip Insider® Order activity for semiconductor equipment continued to heat up, jumping past 114 degrees SOC Computing and Memory added another point, hitting fresh new highs for the year With

20 Jan

1Q 2022 Test Equipment Outlook

1Q 2022 Test Equipment Outlook The Chip Insider® Semiconductor Manufacturing Advanced high-end 5nm, 3nm & beyond, Mobile, Automotive & Power, and Memory devices are expected to drive test demand, growing 19% in 2022. Test is in a long-term capital

20 Jan

IC Supply/demand Tightens

IC Supply/demand Tightens G. Dan Hutcheson Semiconductor Analytics Semiconductor sales continued to explode out of the normal Christmas roll-over with double-digit W/W and Y/Y growth, as IC Supply/Demand tightened up. The IC weather warmed 2°F last

19 Jan

Preview of Qualcomm’s 7th generation 4G/5G Envelope Tracker QET7100

Qualcomm announced the QET7100 – the successor to the QET6100, which they dubbed the "world’s first announced 5G 100MHz envelope tracking solution."

18 Jan

Intel Completes Alder Lake Lineup

Intel disclosed dozens of new Alder Lake products for both laptop and desktop PCs. The 12th Generation products offer sizable performance gains over earlier models, but often at higher prices.

18 Jan

Year in Review: Image Processors Enhance Phone Chips

In 2021, image processors (ISPs) became a hot topic in smartphone processors. 5G became an essential feature for midrange and premium phones, but CPU improvements are taken for granted.

18 Jan

Graviton3 Debuts Neoverse V1

Amazon recently revealed its third-generation server processor, with instances now in preview availability. Graviton3 uses Arm’s Neoverse V1 CPU while maintaining the 64-core count of its predecessor.

18 Jan

Business is in Full Bloom

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

14 Jan

eBook: Chevy Bolt Recall - A Battery of Problems

Discover the essential guide to the Chevrolet Bolt recall, uncovering detailed insights, impacts on owners, and the latest developments in automotive safety and electric vehicle technology.

14 Jan

Motorola edge X30 teardown

Motorola promotes the motorola edge X30 phone as having “the fastest speeds, the highest resolution smartphone camera, the loudest audio, and the boldest display.” So what technology is there to find behind the claims? TechInsights quick teardown answers some of these questions.

12 Jan

Semiconductor Sales Are Expected to Surpass $0.6T in 2022 and on Track to Hit $1T by 2030

Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.

11 Jan

Year in Review: PC Processors Adopt Hybrid CPUs

Desktop PCs had a big 2021, thanks to two new Intel releases and that company’s introduction of hybrid technology. Meanwhile, Apple converted most of its Mac lineup to hybrid Arm-compatible processors.

11 Jan

EdgeQ Enables 5G Small Cells

The startup is sampling an integrated base-station processor with a DSP that uses the RISC-V instruction set. The SoC is suited to 5G small cells and remote units.

11 Jan

Business Is in Full Bloom

Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.

10 Jan

Editorial: Imagination Jumps on RISC-V

With its new Catapult CPUs, Imagination Technologies has become the largest IP vendor to announce RISC-V products, helping position the open-source instruction set as the leading alternative to Arm.

10 Jan

2021 Review. SEMICON West 2021. Maskless Lithography. Strategy Statics versus Dynamics.

Strategy and Tactics: 2021 Review. SEMICON West 2021. Maskless Lithography. Strategy Statics versus Dynamics.

07 Jan

The ducks are lining up for the New Year

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

07 Jan

Semiconductor Equipment Sales Projected to Hit $150B in 2022

Fueled by soaring demand, the semiconductor equipment market is on track to increase 35% in 2021, hitting an-all-time-high of $125B.

05 Jan

Year in Review: CPU-IP Vendors Chase High-End Wins

In the past year, new CPU cores from Arm and SiFive targeted high-performance applications in the data center and communications infrastructure. Many IP startups instead focused on edge AI.

04 Jan

WD Licenses RISC-V CPUs

Storage giant Western Digital added Linux and Android support to its Swerv line of RISC-V CPU in its new EHX3. The company is licensing the new CPU, which targets low-end application processing.

04 Jan

Marvell Bridges MIPI to Auto Ethernet

Marvell announced several products under its new Brightlane automotive brand. The 88QB5224 is a unique chip for bridging MIPI CSI-2 cameras to an Ethernet-based automotive network.

04 Jan

Year in Review: Edge AI Knows No Boundaries

In 2021, edge AI continued propagating far beyond the cloud; smart speakers alone were up 12% from last year. Increased demand attracted investors to edge-AI-chip startups, creating several new unicorns.

28 Dec

P650 Pumps Up Performance by 50%

SiFive added a new flagship CPU to its RISC-V “Performance” line that raises integer performance compared with its predecessor through additional execution resources, larger caches, and microarchitecture tweaks.

27 Dec

Kompanio 828 Tackles Chromebooks

For the holidays, MediaTek offers the Kompanio 820 and 828 to refresh its Chromebook line. These chips deliver multiday battery life, in part thanks to their 7nm manufacturing.

27 Dec

New Lab Investments Bringing us to the Future of Reverse Engineering

TechInsights’ unsurpassed technical abilities come from two important areas – our (amazing!) people, and our tools. To reverse engineer cutting edge technology, we require the equipment and the expertise that keep us at – or ahead of – the pace of the latest technology. And that requires continuous investment in our staff and our tools.

22 Dec

TechInsights' Experiences of the 2021 Chip Shortage

Our views on contributing factors, how it has impacted our semiconductor reverse engineering this year, and looking to the future.

22 Dec

Latest Revelations on the Snapdragon 8cx Gen 3

Qualcomm recently officially released the Snapdragon 8cx Gen 3 which is using 5LPE process technology and is therefore likely based on the Snapdragon 888 made with the Samsung 5LPE process. Based on their announcement and previous analyses, we have reached some key findings.

21 Dec

Snapdragon 8 Gen 1 Sports 18-Bit ISP

In delivering the Snapdragon 8 Gen 1, Qualcomm is upscaling smartphone cameras by adding native 18-bit processing. The new platform packs impressive upgrades across all sections, scoring double digit gains across each section.

21 Dec

Qualcomm Eyes Ultrathin PCs

Providing a big performance boost, the Snapdragon 8cx Gen 3 is suitable for some ultrathin Windows PCs, moving up from the 2-in-1 systems where Snapdragon serves today. The company also updated the Snapdragon 7c+.

21 Dec

Year in Review: Data Centers Spur New Architectures

The past year began with AMD and Intel introducing next-generation server processors. AI-accelerator vendors focused on delivering production-worthy versions of previously announced products, validated by MLPerf testing.

21 Dec

MediaTek Reenters Flagship Phones

After several attempts, MediaTek has delivered its first true flagship processor: the Dimensity 9000. The new smartphone chip features the latest CPU designs, a powerful GPU, and LPDDR5X support.

14 Dec

Ventana Develops RISC-V Chiplet

The startup has developed a custom high-performance RISC-V CPU that comes as a 16-core chiplet, making it easier for customers to design their own data-center processors.

14 Dec

Fitness wearable WHOOP 4.0 leverages a next-generation battery anode technology

The new fitness wearable WHOOP 4.0 leverages a next-generation battery anode technology, which has the potential to raise the bar in the very competitive fitness and health monitoring market where major players such as FitBit, Xiaomi, and Apple lead.

13 Dec

Whitepaper - Democratizing Chiplet-Based Processor Design

Chiplet-based designs promise reduced development costs and faster time to market, but they’ve been exclusive to large chip vendors. Now, the industry is building an ecosystem intended to enable designs combining third-party chiplets that employ different process nodes. At the same time, RISC-V is enabling greater CPU innovation through its open-source model. These trends create an opportunity for a RISC-V chiplet vendor. Ventana Micro Systems sponsored the creation of this white paper, but the opinions and analysis are those of the author.

10 Dec

Whitepaper - Bit-Accurate CD Audio From apX Lossless

Thanks to the development of Bluetooth audio technology, wireless streaming has largely replaced physical media, and smartphone users no longer need to struggle with tangled earphone wires. But to accommodate Bluetooth’s limited bandwidth, the industry adopted a variety of lossy compression techniques that sacrifice audio fidelity. This white paper describes the benefits of the aptX Lossless codec, which enables wireless Bluetooth earbuds and speakers to stream audio that’s bit accurate to the original CD recording. The Linley Group prepared this paper, which Qualcomm sponsored, but the opinions and analysis are those of the author.

10 Dec

NXP i.MX93 Adds AI to IoT Devices

The first i.MX9 processor will pack 64-bit CPUs, an MCU, and an AI accelerator to handle a range of IoT applications, including industrial control, smart home, smart city, and smart grid.

07 Dec

MediaTek Aims to Change Smart TVs

With its Pentonic 2000 processor, the TV-chip leader delivers impressive CPU, GPU, and AI-engine improvements to enable new capabilities such as bidirectional video and gaming without a console.

07 Dec

Centaur Trots Off Into the Sunset

After a 26-year run, Centaur Technology has reached the end of the trail. Glenn Henry’s processor-design team, known for its x86 expertise, has become part of Intel.

07 Dec

An examination of the 5G radio in Google Pixel 6 Pro

At the beginning of September we were pondering the rumors about a Samsung 5G modem that was predicted to show up on the US shores in the form of the 5G implementation solution for the yet to be released Google Pixel 6.

07 Dec

AMD CDNA2 Targets Supercomputers

AMD’s Instinct MI250 and MI250X GPUs deliver extreme floating-point performance through massive parallelism, targeting high-end scientific and government research with leading FP64 throughput.

30 Nov

Imagination CXT Fires Photons

At 1.3 billion rays per second, the Photon architecture in Imagination’s new PowerVR CXT RT3 GPU enables hardware-accelerated real-time ray tracing for the first time in mobile devices.

30 Nov

Kneron KL530 Targets Automotive

Kneron is targeting emerging computer-vision models with its KL530. The new SoC delivers 0.5 trillion INT8 operations per second (TOPS) and supports INT4 format for greater throughput.

30 Nov

eBook: The latest development trends in CMOS image sensors

CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.

25 Nov

Cracking Open Snapdragon’s 4-Pack

In its latest mainstream push, Qualcomm delivers a fresh four-pack filled with CPU, GPU, and camera upgrades. It’s raising performance across multiple segments from low-end to mid-premium.

23 Nov

Epyc Roadmap Gets Specialized

AMD recently disclosed new details of its Epyc server-processor roadmap, including Milan-X with V-Cache, Genoa based on Zen 4 cores, and Bergamo scaling to 128 cores.

23 Nov

History of the Microprocessor, Part 3

As we celebrate the anniversary of the Intel 4004, this article extends our microprocessor history by covering the top trends from the past decade, including the rise of AI, Nvidia, processor startups, and RISC-V.

16 Nov

50 Billion Transistors in 50 Years

Microprocessors have improved by seven orders of magnitude—from 2,300 to 54 billion transistors—in only five decades. To illustrate these changes, we highlight a handful of industry-defining products.

16 Nov

Apple Scales M1 GPU to the Max

Apple’s M1 Max processor delivers a massive boost in integrated-graphics performance compared with the original M1, offering throughput similar to that of Nvidia’s top-end laptop GPU card.

16 Nov

Order activity for semiconductor equipment hit a new high for the year

Many find Pat Gelsinger’s foundry strategy for Intel to be counter-intuitive. One thing is for sure, his IDM 2.0 strategy is on a Grove-ian level of doing the unexpected.

Semiconductor Sales growth continues to slow due more to 2020 comps than a real decline. Still, 2021 will be the year in which semiconductor sales blew past a Half-a-Trillion and Logic at a Quarter-Trillion!

08 Nov

Intel’s Foundry Strategy for Growth & IDM 2.0: What’s different?

Many find Pat Gelsinger’s foundry strategy for Intel to be counter-intuitive. One thing is for sure, his IDM 2.0 strategy is on a Grove-ian level of doing the unexpected.

08 Nov

Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports

Worldwide silicon wafer shipments increased 3.3% to 3,649 million square inches in the third quarter of 2021 compared to the previous quarter, a new industry record, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

04 Nov

ACM Research Announces Orders for Ultra C PR Wet Stripping System for Semi Manufacturing

ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced receipt of two orders for ACM’s Ultra C pr wet stripping system from a leading global integrated device manufacturer (IDM).

04 Nov

FLEX Conference to Co-locate with SEMICON West in 2022

SEMICON West, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain, and FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, will co-locate at the Moscone Center in San Francisco, July 11-14, 2022.

03 Nov

Semiconductor sales edged higher as IC weather warms

Semiconductor sales jumped by another 1% W/W while Y/Y growth continued to decelerate.

03 Nov

The Number of Design Completions Is Expected to Increase Over 2% in 2021

The number of design completions is expected to increase over 2% in 2021 on the back of a strong semiconductor market.

02 Nov

Google Pixel 6 Pro Teardown

What's inside the Google Pixel 6 Pro Teardown? Contributing authors: Stacy Wegner, Daniel Yang, Radu Trandafir, Aakash Jani The much anticipated Google Pixel 6 Pro has arrived in our lab for teardown. This one took us some time to find! The phone

02 Nov

Alder Lake Steals Gaming-CPU Crown

Intel’s Core i9-12900K chip delivers a double-digit performance advantage over AMD’s fastest Ryzen processor. To do so, it runs at a sweltering 241W while using new superfast DDR5 DRAM.

02 Nov

Cadence HiFi Family Adds a Little One

The new Tensilica HiFi 1 DSP consumes less die area and power than the popular HiFi 3 but adds new instructions that improve performance on Bluetooth 5’s Low Complexity Communication Codec (LC3).

02 Nov

Marvell 5nm Switch Handles 5G RAN

Marvell’s first Ethernet switch built in 5nm technology is for carrier access rather than data centers. The Prestera DX7321 joins the DX73xx family, which handles Ethernet speeds up to 400Gbps.

02 Nov

Q3 Global Semiconductor Sales Increase 27.6% Year-to-Year

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $144.8 billion during the third quarter of 2021, an increase of 27.6% over the third quarter of 2020 and 7.4% more than the second quarter of 2021.

01 Nov

Savoring the Fall Rise

SOC Mobile and SOC Computing recorded the biggest gains, hitting fresh new highs for the year

01 Nov

Process Control and Optimization

This was the latest of Applied’s series intended to update investors on the nitty-gritty details of modern semiconductor technology, while showing why Applied is leading.

01 Nov

SEMI Applauds Inclusion of Advanced Manufacturing Investment Credit in U.S. Build Back Better Reconciliation Bill

SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the inclusion of an Advanced Manufacturing Investment Credit in the Build Back Better reconciliation bill.

29 Oct

Intel's Foundry Strategy for Growth & Idm 2.0: What's Different?

Many find Pat Gelsinger's foundry strategy for Intel to be counter-intuitive. One thing is for sure, his IDM 2.0 strategy is on a Grove-ian level of doing the unexpected.

29 Oct

Apple’s First GaN Charger

Apple's First GaN Charger Stephen Russell October 28, 2021 It has been heavily rumoured and anticipated for a few years now, but we have finally seen Apple make the switch to using gallium nitride (GaN) as the power transistor in one of their

28 Oct

Semiconductor Sales to Pass Half-A-Trillion

Still, 2021 will be the year in which semiconductor sales blew past a Half-a-Trillion and Logic at a Quarter-Trillion!

27 Oct

Apple A15 Extends Battery Life

The new A15 processor doubles its system cache to an industry-leading 32MB and drives double-digit performance gains across the CPU, GPU, and AI engine, while boosting battery life.

26 Oct

Order Activity Is Straight and Level

With lead times for semiconductor equipment stretching well into 2022, equipment manufacturers are feeling increasingly optimistic about next year

26 Oct

Coherent Logix Debuts Edge-AI SoC

After serving niche applications with its reconfigurable designs, Coherent Logix introduced an SoC that will serve as a development vehicle for edge AI, software-defined radio, and other real-time applications.

26 Oct

Strategy and Tactics: Samsung’s Strategy Shift and Why We Climb Exponentials

This month was treated with SFF, or the 2021 Samsung Foundry Forum. As expected, it was a technology tour de force. What was unexpected was a fundamental shift in strategic positioning.

25 Oct

North American Semiconductor Equipment Industry Posts September 2021 Billings

North America-based semiconductor equipment manufacturers posted $3.72 billion in billings worldwide in September 2021 (three-month moving average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

22 Oct

Applied Materials' Master Class on Process Control and Optimization

This was the latest of Applied's series intended to update investors on the nitty-gritty details of modern semiconductor technology, while showing why Applied is leading.

22 Oct

Semiconductor Sales Turned Up

Semiconductor Sales growth continues to slow due more to 2020 comps than a real decline.

20 Oct

ASML reports €5.2 billion net sales and €1.7 billion net income in Q3 2021

ASML Holding NV (ASML) has published its 2021 third-quarter results. Q3 net sales of €5.2 billion, gross margin of 51.7%, net income of €1.7 billion; Q3 net bookings of €6.2 billion; ASML expects Q4 2021 net sales between €4.9 billion and €5.2 billion and a gross margin between 51% and 52%.

20 Oct

Webinar: Technical and Financial Teardown of the Apple iPhone 13 Pro

TechInsights and Bloomberg Intelligence Analysts presented their findings on this year’s Apple flagship phone, the iPhone 13 Pro, in this webinar presentation.

20 Oct

Calmly Building Next Year's Nest

Memory activity slipped by another point but the decline was offset by SOC Mobile, which jumped higher

19 Oct

SEMICON Japan 2021 Returns Live in Tokyo to Highlight Semiconductor Industry Innovation, Growth Opportunities

Leading-edge technologies including artificial intelligence (AI), 5G, Internet of Things (IoT), MEMS and sensors, quantum computing and advanced 3D packaging will take center stage at SEMICON Japan 2021 Hybrid as visionary keynote speakers and industry leaders gather to share insights into the latest trends and innovations driving semiconductor industry growth.

19 Oct

SEMICON Europa 2021 to Spotlight Smart Technologies, Digital Transformation, Semiconductor Industry Growth

With leading-edge technologies such as artificial intelligence (AI), 5G and robotics at the heart of digital transformation, SEMICON Europa 2021 will convene industry visionaries and experts for insights into the latest innovations and smart applications powering the next wave of semiconductor industry growth.

19 Oct

Google Builds Video-Transcoder Chip

To better support its massive YouTube business, Google has created its own video-transcoding chip. The VCU design offers a 40x performance gain compared with CPUs.

19 Oct

Loihi 2 Advances Spiking R&D

Intel Labs has developed a second-generation neuromorphic processor using the Intel 4 process. It’s also offering the open-source Lava framework to advance neuromorphic software.

19 Oct

Semiconductor sales took a deep post-September dive last week

Comments, Questions & Answers: IBM's Telum processor. DRAM Contract vs Spot Prices. Downturn Warning Signs. Excessive CapEx Exuberance.

18 Oct

Global Silicon Wafer Shipments Projected to Log Robust Growth Through 2024, SEMI Reports

Global silicon wafer shipments are projected to register robust growth through 2024, with wafer area increasing 13.9% year-over-year in 2021 to a record high of nearly 14,000 millions of square inches (MSI), SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.

18 Oct

Applied Materials Unveils eBeam Metrology System that Enables a New Playbook for Patterning Advanced Logic and Memory Chips

Applied Materials, Inc. today unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements.

18 Oct

Veeco Receives Multi-System Order for New ADS-800 SRD™ System Targeting Power Electronics

Veeco Instruments Inc. (NASDAQ: VECO) announced today that it has received a multi-system order for its new ADS-800 SRD™ System from a leading semiconductor supplier.

18 Oct

ACM Research Announces Order for SAPS Evaluation Tool from Major Global Semiconductor Manufacturer

ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the receipt of an evaluation tool order for its Ultra C SAPS frontside cleaning tool from a major global semiconductor manufacturer.

18 Oct

Samsung's Strategy Shift and Why We Climb Exponentials

Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.

15 Oct

TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content

TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content OTTAWA, ON, October 14, 2021 - TechInsights Inc. is pleased to announce the acquisition of The Linley Group, Inc., an industry-leading source for

14 Oct

Semiconductor Sales Take a Deep Dive

Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.

13 Oct

Power and Compound Fab Capacity Projected to Top Record 10 Million Wafers Per Month in 2023, SEMI Reports

Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions wrought by the pandemic, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in 2023, growing to 10.24 million WPM (in 200mm equivalents) and climbing to 10.6 million WPM in 2024, SEMI announced today in its Power & Compound Fab Report to 2024.

12 Oct

Anton 3 Cracks Molecular Dynamics

Billionaire David E. Shaw has spent two decades quietly building highly specialized supercomputers. Anton 3 is his newest ASIC for accelerating molecular-dynamics simulations.

12 Oct

Cadence Takes Tensilica AI to the Max

The new Tensilica AI lineup comprises three product tiers that Cadence calls AI Base, AI Boost, and AI Max, along with a new accelerator and a multicore model that can deliver up to 32 TOPS.

12 Oct

Samsung Demos In-Memory Processing

The company disclosed architecture and performance details for the processor-in-memory (PIM) version of its popular Aquabolt HBM2. The HBM-PIM, dubbed Aquabolt-XL, adds compute to a drop-in HBM2 stack.

12 Oct

The Industry Is Soaring but Carries a Tether of Caution

Equipment suppliers continue to see a very strong level of activity which is why they expect 2022 to be another solid year for them.

11 Oct

The Industry Is Soaring but Carries a Tether of Caution

Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.

11 Oct

Downturn Warning Signs. Excessive CapEx Exuberance

Comments, Questions & Answers: IBM's Telum processor. DRAM Contract vs Spot Prices. Downturn Warning Signs. Excessive CapEx Exuberance.

11 Oct

Semiconductor Market on Track to Hit $0.6t in 2021

The positive sign that electronic prices are turning up, Wafer prices are 40% higher than a year ago, August WSTS was really strong, and Power Semiconductors.

07 Oct

Semiconductor Sales Closing in on a Record $600m Year

Semiconductor sales closed in on $12B, another all-time weekly record. Semiconductor Sales are closing in on a record $600M in 2021 with 24% growth.

06 Oct

IBM’s Telum processor. Aart deGeus on EDA-AI.

IBM is a powerhouse in AI, as it has always been a powerhouse in semiconductor research. But this is often in the shadow of west-coast technology giants who dominate west-centric conferences.

04 Oct

Semiconductor Industry Strategic Trends

This is the talk Dan Hutcheson gave for the Semiconductor Industry Association’s state of the U.S. semiconductor industry webinar.

29 Sep

YMTC 128L 3D Xtacking 2.0 TLC NAND

YMTC 128L Xtacking 2.0 for SSD! Finally, they might catch up with Samsung, SK hynix, and KIOXIA Dr. Jeongdong Choe September 23, 2021 TechInsights just found and quickly reviewed YMTC 128L TLC die removed from Asgard Memory (Powev Electronic

23 Sep

Apple iPhone 13 Pro Teardown

We received the iPhone 13 and iPhone 13 Pro in our labs and identification and early costing analysis are available below.

23 Sep

TSMC's Gift to the Industry

This week Andrea Lati, Dan Hutcheson, Jason Abt, and Risto Puhakka discuss what insiders are saying about: TSMC’s gift to the industry, 2021 forecast updates: Few notable changes, 2022 the big question of much higher growth, and the next big thing in image sensors.

22 Sep

Whitepaper - Software is Critical to Edge-AI Deployment

This white paper describes the importance of a flexible and robust software stack to edge-AI deployment. Processor vendors and intellectual-property licensers often tout the theoretical performance of their designs, but the neural-network compiler, run-time engine, and scheduler are just as critical to realizing that potential in production systems. The Linley Group prepared this paper, which EdgeCortix sponsored, but the opinions and analysis are those of the author.

10 Sep

Europe's Semiconductor Share Loss and Most Advanced Memory Maker

This week Andrea Lati, Dan Hutcheson, and Jason Abt discuss what insiders are saying about: Has Europe really lost so much share of semiconductor manufacturing, going from 44% in 1990 to 9% in 2020?, Semiconductor forecast of 26% for ICs and current market status, the DRAM disconnect of spot prices and contract prices and Memory.

09 Sep

Fitbit Luxe Teardown

Will the Fitbit Charge 5 Outshine the Fitbit Luxe? Stacy Wegner September 9, 2021 We don’t know, and we do not comment on whether one device is better than its previous generation. What we do, is look at and compare generations of devices. And while

09 Sep

Semiconductor Communications Market Share and Forecast

Provides five-year revenue forecasts for many categories of communications semiconductors, including Ethernet products, smart NICs, embedded and server processors, and FPGAs.

28 Aug

Disruptive Technology: TSMC 22ULL eMRAM

TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm

26 Aug

AMD's Chiplet Roadmap - the Nvidia-Arm Deal - Forecast

This week Andrea Lati, Dan Hutcheson, Jason Abt, and Risto Puhakka discuss what insiders are saying about. What is AMD doing next with chiplets? UK pumps the brakes on the Nvidia-Arm deal. What’s up at Intel and new processor segmentation? What’s driving continued growth in semiconductor equipment?

25 Aug

Bite-sized Webinar On-Demand: A Comparison of GaN Technology Approaches in USB-C Power Adapters

TechInsights has examined several GaN design wins in wall charger technology. This 22-minute presentation provides a quick comparison of the different GaN integration strategies that we have observed in recent USB-C adapters.

20 Aug

Intelligent move: Ottawa's TechInsights acquires San Jose-based market research firm VLSI

An Ottawa company that gives global semiconductor giants detailed breakdowns of how their competitors’ technology works has joined forces with a leading Silicon Valley market research firm as it looks to broaden its corporate intelligence skills.

19 Aug

TechInsights acquires VLSIresearch… with Gavin Carter, CEO of TechInsights

It’s time to bring the core-technology and market analysis closer again, which explains why TechInsights has acquired VLSIresearch. In this interview, Dan Hutcheson has a conversation about this with Gavin Carter from TechInsights, where he’s CEO.

16 Aug

TechInsights and VLSIresearch join forces

Innovation Decisions Accelerated: TechInsights Acquires VLSIresearch TechInsights is pleased to announce the acquisition of VLSI Research Inc., the award-winning provider of market research and economic analysis covering the semiconductor supply

16 Aug

Micron 176L 3D NAND

NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process

13 Aug

Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap?

Power Semiconductor Technology Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap? Now both silicon carbide (SiC) and gallium nitride (GaN) products are having an impact in the marketplace, it is easy to think that there is no longer

06 Aug

The Auto Shortage Is a Riddle, Wrapped in a Mystery, Inside an Enigma

This week Andrea Lati, Dan Hutcheson, John West, and Risto Puhakka discuss what insiders are saying about the Auto IC shortage and how the 4Q21 Forecast is shaping up.

05 Aug

Advanced Micro-Fabrication Equipment Inc. China earns its second triple crown

Provides state-of-the-art equipment, process knowhow, and all-star support to customers in front-end semiconductor manufacturing, back-end wafer level packaging, LED production, MEMS applications, and other semiconductor fabrication processes.

29 Jul

Micron DDR5 DIMM Technology

DRAM Memory Technology Disruptive Product: What technology node for 1st DDR5 DIMM? DDR5 is a new generation of Memory! All the major DRAM players are moving forward to a faster DRAM, DDR5. DDR5 improves power management (1.1V vs. 1.2V for DDR4) as

29 Jul

ASML awarded five stars across all of its categories

As the leading lithography innovator in the chip industry, ASML’s solutions in lithography and process control have been making it possible for chip makers progress in better and faster devices.

13 Jul

ASM Pacific Technology secures its fifth triple crown

ASM Pacific Technology, the world leader in the supply of semiconductor assembly and packaging equipment, awarded 4 VLSI Stars with a solid 8.47.

08 Jul

Micron 1α DRAM Technology

DRAM Memory Technology Micron D1α, '14 nm'! The Most Advanced Node Ever on DRAM! D1α! It’s 14 nm! After a quick view on Micron D1α die (die markings: Z41C) and cell design, it’s the most advanced technology node ever on DRAM. Further, it’s the first

08 Jul

EUV光刻机争夺战，升级！(EUV lithography machine battle, upgrade!)

The battle for EUV lithography machines is gradually intensifying.

08 Jul

Memory Technology Highlights from TechInsights 2021 Webinar

Due to strong and growing demands for memory chips from storage, mobile, and AIOT market, all the memory players are striving to increase density/performance, reduce manufacturing cost, and develop the new and innovative technologies for each generation.

29 Jun

How many mini-LEDs did Apple pack into the iPad Pro?

Teardown Technology Stacy Wegner How many mini-LEDs did Apple pack into the iPad Pro? An in-depth look at the Liquid Retina XDR display Note: this article provides an update to the Displays section of our lengthier article on the TechInsights

28 Jun

Electric Vehicle Technologies Webinar: An in-depth analysis from the market to the semiconductor

This webinar will be jointly delivered by Strategy Analytics, Munro & Associates, and TechInsights. Each organization brings a wealth of knowledge to the discussion, with Strategy Analytics covering market information, Munro & Associates covering electronic systems, schematics, components, and mechanical structures, and TechInsights analyzing components at the semiconductor level.

15 Jun

Intel 2nd Generation XPoint Memory

Embedded and Emerging Memory Technology Here, we have the Intel 2 nd gen. XPoint Memory die! Finally, we’ve found the Intel XPoint TM Memory 2nd generation die! We’ve quickly viewed the die removed from Intel OptaneTM SSD DC P5800X 400GB (Model

03 Jun

Teardown: Apple iPhone 12 Pro Max 5G

Electronics360 News Desk: The following is a partial deep dive into a Teardown of the Apple iPhone 12 Pro Max 5G smartphone conducted by TechInsights.

25 May

Apple iPad Pro Teardown

In this year’s iPad Pro, the new 12.9” mini-LED display and new TrueDepth camera system may be taking ‘Center Stage’ for many users, TechInsights will continue to look deeper for other semiconductor and design winners inside the new iPad Pro.

24 May

Groundbreaking SenSWIR Sensor by Sony- IMX990/IMX991

This approach presents two advantages, the Cu-Cu DBI can help reduce the overall height of the Die while Die-to-Wafer hybridization can help reduce the per-Die cost, thereby facilitating greater utilization of Sony’s SWIR technology for a wide range of applications. Recently, TechInsights revealed the first detailed cross-sectional image of the 1.34MP.

19 May

Webinar: The Power Revolution - Innovation and IP in Power Management Technologies

The panel will discuss the making of power devices using semiconductors, power management technologies and products that use power efficiently, and the enforcement of the intellectual property rights associated with semiconductors and power management technologies.

11 May

Apple Homepod Mini Teardown

May 5, 2021 Teardown Technology A quick look inside the Apple Homepod Mini design wins, but is there a secret part waiting to be intialized? The Apple HomePod Mini A2374 is a voice-interactive smart speaker with Siri assistant. It features four

05 May

Guide to Processors for Deep Learning

Provides market share data for many categories of communications semiconductors, including Ethernet products, processors, and FPGAs.

01 May

Intel's 2nd Generation XPoint Memory

April 30, 2021 Dr. Jeongdong Choe Intel's 2 nd Generation XPoint Memory - Will it be worth the long wait ahead? In 2017, TechInsights analyzed the details on Intel 1 st gen. XPoint Memory (Optane TM Memory 16GB, MEMPEK1W016GA) including structure

30 Apr

Qualcomm extends their mmWave leadership position

April 21, 2021 Kyle Nolan Qualcomm extends their mmWave leadership position 5G mmWave is still far from worldwide adoption but Qualcomm is keeping their foot on the pedal despite no one really close on their tail. One of Qualcomm’s Sr. Directors of

21 Apr

Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) - Memory Blog

April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in

16 Apr

World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin

March 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1

31 Mar

TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis

March 23, 2021 Abdullah Rahal TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis Download the Summary of Analysis TechInsights’ analysts have examined the Blackberry patent portfolio and partitioned it

23 Mar

KIOXIA’s new XL-FLASH for ultra-low latency NAND application

March 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high

23 Mar

Dynamic Vision Sensors – A Brief Overview - Image Sensor TechStream Blog

Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture

18 Mar

Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies

March 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive

16 Mar

A New and advanced ReRAM from Fujitsu

March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The

11 Mar

GaN USB-C Charger Market Heating Up in 2021

March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights

10 Mar

Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary

March 03, 2021 Dr Peter Gammon Power Technology Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary SiC power devices have the potential to reach voltage ratings beyond 30 kV, yet today, SiC chip manufacturers are focussed on

03 Mar

Webinar: Selected Imager and Sensor Trends and Comparisons

The intent of this webinar is to share selected content from our 2020 Image Sensor Device Essentials (DEF) subscription annual presentation.

03 Mar

Moore’s Law: Dead or Alive

Moore's Law: is it Dead or Alive? It’s a perennial subject that has come back in 2021. Without the chip industry you would not have a smartphone or a notebook computer at your side … no Facebook or Google either … only a slide rule, a pen, and paper

01 Mar

LiDAR 101 – Solid-State and Mechanical LiDARs

February 19, 2021 Automotive Technology LiDAR 101 – Solid-State and Mechanical LiDARs 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster

19 Feb

Webinar: Gearing Up for the Electric Vehicle (EV) Revolution

In this seminar we will discuss the major players, their technology choices and how they tie into the strict reliability standards required by the automotive industry.

03 Feb

Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market

February 03, 2021 Logic Disruptive Technology Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings - the Apple A14 and

03 Feb

A Guide to Processors for Deep Learning

Covers processors for accelerating deep learning, neural networks, and vision processing for AI training and inference in data centers, autonomous vehicles, and client devices.

01 Feb

Supporting IP strategy in the semiconductor industry

Supporting IP strategy in the semiconductor industry Growing complexity of the chip market has made it harder than ever for intellectual property owners to monitor developments, making reverse engineering a crucial process The breadth of reverse

27 Jan

Analysts’ Choice Winners for 2020

The Linley Group recognizes 2020’s top products in the categories of data center, PC, embedded, mobile, networking, processor IP, and related technology. And the winners are…

26 Jan

Sony d-ToF Sensor found in Apple’s new LiDAR camera

January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry

19 Jan

2021 Forecast ... with Andrea Lati

2020 was a tumultuous year. Semiconductors decoupled from the macroeconomy and semiconductor production equipment demand boomed.

06 Jan

Webinar: Increasing Value of Semiconductor IP in the Automotive Supply Chain

Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge displays that do far more than navigation.

17 Dec

2020 Semiconductor Mask Maker’s Survey ... a conversation with Aki Fujimura of the eBeam Initiative

Aki Fujimura discusses what the eBeam Initiative found in its 2020 Mask making survey. Every year, they run two surveys of mask makers and its luminaries.

15 Dec

Teardown: Velodyne Lidar Puck VLP-16 sensor (Electronics360)

A deep dive into the major components used in the light detection and ranging technology. Posted in Electronics360.

14 Dec

Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters

In this presentation we will survey the different GaN integration strategies that we have observed in recently procured USB adapters. It is believed that GaN brings compelling advantages in terms of efficiency for adapter and other power supply products; however, achieving these efficiencies in a cost-effective manner can be challenging.

09 Dec

3D flash memory, 176 layers!

So far, NAND Flash has shown a white-hot stage. Not long ago, storage vendors were still "seeing the scenery on the high platform of flash memory" with 128 layers.

09 Dec

Webinar: Memory Technology 2020 and Beyond - NAND, DRAM, Emerging and Embedded Memory Technology Trends

Memory Technology 2020 and Beyond NAND, DRAM, Emerging and Embedded Memory Technology Trends This webinar was presented by TechInsights In this webinar, Dr. Jeongdong Choe will present his detailed review of the latest NAND, DRAM, emerging and

02 Dec

Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12

The information presented in this webinar will be of greatest interest to those looking to understand the semiconductor design wins of the iPhone 12, and related financial implications to companies like Qualcomm, Broadcom, Skyworks, Qorvo, Cirrus Logic, Dialog Semiconductor, and more.

10 Nov

Micro Loading And Its Impact On Device Performance

How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA profile.

02 Nov

Webinar: ALD/ALE Process in Commercially Available Memory Devices

This presentation will examine some of the different structures we have seen through the evolution of these technologies, in particular the latest 3D-NAND and DRAM parts. We will also look at several historical applications of ALD/ALE technology that have been observed through reverse engineering.

28 Oct

iPhone Camera History: iPhone 12's Alternative and Normal

The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last

21 Oct

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G chip design and manufacturing

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing

During this 30-minute presentation our experts will provide exclusive insight of our findings on the latest 5G mmWave transceiver architecture with a focus on the solution, including the QTM052 Antenna module from Qualcomm.

23 Sep

SK hynix 128L 3D PUC NAND (4D NAND)

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral

14 Sep

Webinar: ALD/ALE Process in Commercially Available Logic Devices

This presentation on the Atomic Layer Deposition/Atomic Layer Etching (ALD/ALE) process examines some of the different structures we have seen during the evolution of these logic technologies, in particular the latest 7 nm and 10 nm devices.

26 Aug

60 years of the Semiconductor industry and its changing patent strategy

Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device

04 Aug

Memory Process Webinar: 3D NAND Word Line Pad (WLP)

In this webinar, we present a comparison of 9x-layer 3D NAND devices from major manufacturers: Samsung, KIOXIA / Western Digital, Intel / Micron and SK hynix. The process sequence is discussed, with emphasis on the word line pad (WLP), also commonly known as staircase.

24 Jun

On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN

This webinar will be a review of the 650 V power MOSFET ecosystem and IP landscape. We will discuss the technologies in light of an early seminal GaN HEMT patent, demonstrating how reverse engineering can show innovation. 

27 May

Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony

STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.

26 Sep

Apple iPhone 11 Pro Max Teardown

Posted: September 23, 2019 - Updated: October 1, 2019 Contributing Authors: Daniel Yang, Stacy Wegner, Albert Cowsky We are always excited to see a new Apple iPhone, and this year’s iPhone 11 line is no exception. This is the first ever Apple event

23 Sep

Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication

Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and

07 Feb

Creating Better Applications Through Patent Strengthening

Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.

20 Jun

What does Uber’s patent landscape look like?

Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years

27 Feb

A Guide to Multicore Processors

Covers 32- and 64-bit embedded processors with four or more CPU cores that are used for wires and wireless communications, storage, security, and other applications.

28 Aug

A Guide to Ethernet Switch and PHY Chips

Covers data-center switch chips for 10G, 25G, 40G, 50G, and 100G Ethernet. Also includes physical-layer (PHY) chips for 10GBase-T and 100G Ethernet.

28 Jul

The 10nm Process Rollout Continues to Evolve

Explore the latest advancements in 10nm semiconductor technology, including Samsung's 10nm LPE and TSMC's 10nm FinFET processes. Learn about their impact on mobile devices like the Galaxy S8 and iPad Pro2, and discover how these innovations are driving the semiconductor industry forward.

27 Jun

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